Universal integrated circuit card apparatus and related methods

• US 8,950,681 B2
• Filed: 11/15/2011
• Issued: 02/10/2015
• Est. Priority Date: 11/07/2011
• Status: Active Grant

• Current Assignee: Blackberry Limited
• Original Assignee: Blackberry Limited
• Inventors: Lepp, James Randolph Winter, Cormier, Jean-Philippe Paul, Dwyer, Johanna Lisa
• Primary Examiner(s): Lee, Michael G
• Assistant Examiner(s): GUDORF, LAURA A
• Application Number:
  US13/296,946
• Publication Number:
  US 20130116010A1
• Time in Patent Office: 1,183 Days
• Field of Search: 235/492, 455/558, 361/737, 361/784, 439/638
• US Class Current: 235/492
• CPC Class Codes: G06K 19/072 the record carrier comprising a plurality of integrated circuit chips
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier

Abstract

UICC apparatus and related methods are disclosed herein. An example UICC apparatus includes a carrier and a first UICC defined by a first punch-out feature formed in the carrier. The first punch-out feature is configured to remain attached to the carrier when the first UICC is removed from the carrier.

Claims

1. An universal integrated circuit card (UICC) apparatus comprising:

a carrier; and

a first UICC defined by a first punch-out feature formed in the carrier adjacent a first peripheral edge of the first UICC, the first punch-out feature configured to remain attached to the carrier when the first UICC is removed from the carrier, the first punch-out feature including a tab formed by a recessed cavity between the first peripheral edge of the first UICC and an inner edge of the carrier, the tab having a notch adjacent the first peripheral edge of the first UICC to provide a line of weakness adjacent the first peripheral edge of the first UICC to ensure that a remnant of the tab remains substantially entirely attached to the carrier when the first UICC is removed from the carrier, the notch having a tapered profile between the first peripheral edge of the first UICC and an edge of the tab.

2. The UICC apparatus of claim 1, further comprising:

a second UICC defined by a second punch-out feature formed in the carrier and inside a first perimeter of the first punch-out feature, the second punch-out feature configured to remain attached to a first frame portion defined by the first UICC when the second UICC is removed from the carrier; and

a third UICC defined by a third punch-out feature formed in the carrier and inside the first perimeter of the first punch-out feature and a second perimeter of the second punch-out feature, the third punch-out feature configured to remain attached to a second frame portion defined by the second UICC when the third UICC is removed from the carrier.

3. The UICC apparatus of claim 2, wherein the carrier defines a fourth UICC, and wherein the fourth UICC has a dimensional profile greater than the dimensional profiles defined by the first, second and third UICCs.

4. The UICC apparatus of claim 2, wherein the first punch-out feature is formed adjacent the first peripheral edge of the first UICC, the second punch-out feature is formed adjacent a second peripheral edge of the second UICC and the third punch-out feature is formed adjacent a third peripheral edge of the third UICC.

5. The UICC apparatus of claim 1, wherein the tab includes a face substantially flush with a surface defined by the carrier and the first UICC adjacent an electrical contact of the UICC apparatus.

6. The UICC apparatus of claim 5, wherein the first peripheral edge is substantially perpendicular to the face of the tab.

7. An universal integrated circuit card (UICC) apparatus comprising:

a carrier; and

a first UICC defined by a first punch-out feature formed in the carrier, the first punch-out feature configured to remain attached to the carrier when the first UICC is removed from the carrier;

a second UICC defined by a second punch-out feature formed in the carrier and inside a first perimeter of the first punch-out feature, the second punch-out feature configured to remain attached to a first frame portion defined by the first UICC when the second UICC is removed from the carrier;

a third UICC defined by a third punch-out feature formed in the carrier and inside the first perimeter of the first punch-out feature and a second perimeter of the second punch-out feature, the third punch-out feature configured to remain attached to a second frame portion defined by the second UICC when the third UICC is removed from the carrier, wherein the first, second and third punch-out features provide a modular snap-fit feature, wherein the modular snap-fit feature comprises a groove formed in a first surface of the first UICC, the second UICC, or the third UICC, the first surface being opposite a second surface of the respective UICCs or carrier having an electrical contact, and wherein the groove is formed adjacent a perimeter defining an outer surface of the first UICC, the second UICC, or the third UICC; and

an arm protruding along a perimeter defining an inner surface of the carrier, the first UICC or the second UICC and toward the groove of the other one of the first UICC, the second UICC or the third UICC.

8. An universal integrated circuit card (UICC) apparatus comprising:

a carrier having a UICC surface that includes one or more electrical contacts on a face surface opposite a back surface, the UICC surface and a first perimeter of the carrier conforms to a first UICC form factor standard;

a first cutout profile formed in the carrier adjacent the UICC surface such that the UICC surface and the first cutout profile define a second perimeter that conforms to a second UICC form factor standard different than the first UICC when the UICC surface is removed from the carrier along the second perimeter defined by the first cutout profile, the first cutout profile having a first tab formed by a first cavity partially extending from the back surface and toward the face surface, the first tab defining a first portion of the face surface, the first tab having a first notch defining a first line of weakness adjacent an outer lateral edge of the second UICC that is non-parallel relative to the face surface, the first notch having a varying profile between a first end of the first tab and the outer lateral edge of the second UICC;

a second cutout profile formed in the carrier adjacent the UICC surface and the first cutout profile such that the UICC surface and the second cutout profile define a third perimeter that conforms to a third UICC form factor standard different than the first and second UICCs when the UICC surface is removed from the carrier along the third perimeter defined by the second cutout profile, the second cutout profile having a second tab formed by a second cavity partially extending from the back surface and toward the face surface, the second tab defining a second portion of the face surface, the second tab having a second notch defining a second line of weakness adjacent an outer lateral edge of the third UICC that is non-parallel relative to the face surface, the second notch having a varying profile between a first end of the second tab and the outer lateral edge of the third UICC; and

a third cutout profile formed in the carrier adjacent the UICC surface, the first cutout profile and the second cutout profile such that the UICC surface and the third cutout profile define a fourth perimeter that conforms to a fourth UICC form factor standard different than the first, second and third UICCs when the UICC surface is removed from the carrier along the fourth perimeter defined by the third cutout profile, the third cutout profile having a third tab formed by a third cavity partially extending from the back surface and toward the face surface, the third tab defining a third portion of the face surface, the third tab having a third notch defining a third line of weakness adjacent an outer lateral edge of the fourth UICC that is non-parallel relative to the face surface, the third notch having a varying profile between a first end of the third tab and the outer lateral edge of the fourth UICC.

9. The UICC apparatus of claim 8, wherein the first UICC has a dimensional profile that is greater than a dimensional profile of the second UICC, the third UICC and the fourth UICC, wherein the second UICC has a dimensional profile that is greater than a dimensional profile of the third UICC and the fourth UICC, and wherein the third UICC has a dimensional profile that is greater than the dimensional profile of the fourth UICC.

10. The UICC apparatus of claim 8, wherein the first cutout profile substantially surrounds the second cutout profile and the third cutout profile, wherein the second cutout profile substantially surrounds the third cutout profile.

11. The UICC apparatus of claim 8, wherein the first cutout profile comprises a first plurality of first tabs, wherein the second cutout profile comprises a second plurality of second tabs, and the third cutout profile comprise a third plurality of third tabs.

12. The UICC apparatus of claim 11, wherein the first, second and third tabs are configured to remain attached with the carrier when one of the respective first, second and third UICCs are removed from the carrier.

13. A method of forming an universal integrated circuit card (UICC) apparatus comprising:

coupling one or more electrical contacts on a first surface of a carrier;

forming a first punch-out feature in the carrier and encompassing the first surface to define a first UICC when the first surface is removed from the carrier along the first punch-out feature;

forming a first tab between an inner lateral surface of the carrier and an outer lateral surface of the first UICC via a recessed cavity formed in a second surface of the carrier opposite the first surface; and

forming a notch in the tab with a tapering profile between an end of the tab and the outer lateral surface of the first UICC such that the notch defines a line of weakness to enable a remnant of the tab to remain substantially attached to the carrier when the first UICC is removed from the carrier.

14. The method as defined in claim 13, further comprising:

forming a second punch-out feature in the carrier adjacent to and encompassing the first surface and the first punch-out feature to define a second UICC when the first surface is removed from the carrier along the second punch-out feature; and

forming a third punch-out feature in the carrier adjacent to and encompassing the first surface and the first and second punch-out features to define a third UICC when the first surface is removed from the carrier along the third punch-out feature.

15. The method of claim 14, further comprising forming the carrier according to a fourth UICC form factor standard, where the fourth UICC encompasses the first surface and the first, second and third punch-out features.

16. The method of claim 14, further comprising configuring the second punch-out feature to remain attached to the third UICC of the carrier when the second UICC is removed from the carrier along the second punch-out feature.

17. The method of claim 14, further comprising configuring the third punch-out feature to remain attached to the carrier when the third UICC is removed from the carrier along the third punch-out feature.

18. The method of claim 14, forming a plurality of tabs or perforations disposed along a perimeter of at least one of the first punch-out feature, the second punch-out feature and the third punch-out feature.

19. The method of claim 14, further comprising forming a receiving area in a second surface of at least one of the first UICC, the second UICC or the third UICC, the second surface being opposite the first surface, and wherein the receiving area is formed adjacent an outer surface of the first UICC, the second UICC and the third UICC defined by a perimeter of the respective first, second or third punch-out features.

20. A method of forming an universal integrated circuit card (UICC) apparatus comprising:

coupling one or more electrical contacts on a first surface of a carrier;

forming a first punch-out feature in the carrier and encompassing the first surface to define a first UICC when the first surface is removed from the carrier along the first punch-out feature;

forming a second punch-out feature in the carrier adjacent to and encompassing the first surface and the first punch-out feature to define a second UICC when the first surface is removed from the carrier along the second punch-out feature; and

forming a third punch-out feature in the carrier adjacent to and encompassing the first surface and the first and second punch-out features to define a third UICC when the first surface is removed from the carrier along the third punch-out feature

forming a receiving area in a second surface of at least one of the first UICC, the second UICC or the third UICC, the second surface being opposite the first surface, and wherein the receiving area is formed adjacent an outer surface of the first UICC, the second UICC and the third UICC defined by a perimeter of the respective first, second or third punch-out features; and

forming an arm extending from an inner surface defined by the carrier or the first or the second punch-out features, wherein a profile of the receiving area is substantially complementary to a profile of the arm to enable the arm to couple to the receiving area via a snap-fit connection or interference fit.