Method of transfer by means of a ferroelectric substrate

• US 8,951,809 B2
• Filed: 04/03/2009
• Issued: 02/10/2015
• Est. Priority Date: 04/07/2008
• Status: Expired due to Fees

• Current Assignee: Commissariat a L'Energie Atomique (French Alternative Energies and Atomic Energy Commission)
• Original Assignee: Commissariat a L'Energie Atomique (French Alternative Energies and Atomic Energy Commission)
• Inventors: Moulet, Jean-Sebastien, Di Cioccio, Lea, Migette, Marion
• Primary Examiner(s): Nguyen, Ha Tran T
• Assistant Examiner(s): DEHNE, AARON A
• Application Number:
  US12/936,582
• Publication Number:
  US 20110104829A1
• Time in Patent Office: 2,139 Days
• Field of Search: 414/935, 414/941, 438/3
• US Class Current: 438/3
• CPC Class Codes: H01L 21/187 by direct bonding
• CPC Class Codes: Y10S 414/135 Associated with semiconductor wafer handling
• CPC Class Codes: Y10S 414/141 includes means for gripping wafer

Abstract

A method of carrying out a transfer of one or more first components or of a first layer onto a second substrate including: a) application and maintaining, by electrostatic effect, of the one or more first components or of the first layer, on a first substrate, made of a ferroelectric material, electrically charged, b) placing in contact, direct or by molecular adhesion, and transfer of the components or the layer onto a second substrate, and c) dismantling of the first substrate, leaving at least one part of the components or the layer on the second substrate.

Claims

1. A method of carrying out a transfer of one or more first components or of a first layer, from a first substrate to a second substrate, comprising:

a) placing in contact, against the first substrate, made of a ferroelectric material, the one or more first components or the first layer, and maintaining them by electrostatic effect against the first substrate, the first substrate being electrically charged;

b) placing in contact, direct or by molecular adhesion, the one or more first components or the first layer with the second substrate; and

c) separating or dismantling the first substrate, leaving at least one part of each of the one or more first components or the first layer on the second substrate,

wherein the separating or dismantling the first substrate is performed either

(i) by inversion of the polarization of the first substrate, or

(ii) by heating at a temperature of between 100°

C. and 1,200°

C.

2. The method according to claim 1, the c) separating or dismantling being assisted thermally and/or mechanically and/or in an electrostatic manner.

3. The method according to claim 2, the c) separating or dismantling being assisted by a rise in temperature.

4. The method according to claim 3, the rise in temperature being carried out by application of an increasing thermal ramp, of gradient greater than 5°

C./min.

5. The method according to claim 1, the c) separating or dismantling being assisted by a difference between adhesion forces of the one or more first components or of the first layer on the first substrate and on the second substrate.

6. The method according to of claim 1, the first substrate being charged in an intrinsic or assisted manner.

7. The method according to claim 1, the ferroelectric material of the first substrate being made of LiTaO₃, or LiNbO₃, or BaTiO₃, or SrTiO₃, or LaAlO₃, or LiAlO₃.

8. The method according to claim 1, the second substrate being at least partially made of semi-conductor material, or silicon, or fused silica, or quartz.

9. The method according to claim 1, the one or more first components or the first layer being at least partially made of semi-conductor material.

10. The method according to claim 1, the one or more first components, or the first layer, having undergone before the a) placing, or undergoing, between the a) placing and the b) placing, a treatment by etching, and/or ion implantation, and/or deposition, and/or a thermal treatment.

11. The method according to claim 10, the one or more first components, or the first layer, having undergone before the a) placing, or undergoing, between the a) placing and the b) placing, a treatment by ion implantation, defining in at least one of the one or more first components or in the first layer, a fragilization area, along which a fracture is formed during the c) separating or dismantling.

12. The method according to claim 10, the one or more first components, or the first layer, having undergone, before the a) placing, a treatment by ion implantation, defining in at least one of the one or more first components or in the first layer, a fragilization area, along which a fracture is formed between the a) placing and the b) placing.

13. The method according to claim 10, the thermal treatment not inducing polarization inversion of the material of the first substrate.

14. The method according to claim 13, the thermal treatment being carried out by application of an increasing thermal ramp, of gradient less than 5°

C./min.

15. The method according to claim 1, at least one of the one or more first components, or the first layer, and/or a surface of the first substrate having undergone at least one treatment for promoting contact or adhesion of the component with the surface.

16. The method according to claim 1, a surface of the second substrate and/or a surface of at least one of the one or more first components or of the first layer, having undergone, before the b) placing, a preparation for molecular bonding.

17. The method according to claim 1, a surface of one of the one or more first components not being at a same height as a surface of at least another one of the one or more first components in relation to a surface of the second substrate on which the one or more first components are deposited.

18. The method according to claim 1, at least one of the one or more components comprising at least one surface made of a compliant or elastic material.

19. A method of carrying out a transfer of at least two stages of components and/or of layers onto a second substrate, comprising:

carrying out a first transfer of a first stage of one or more first components or of a first layer from a first substrate onto said second substrate, comprising;

a) placing in contact, against the first substrate, made of a ferroelectric material, the one or more first components or the first layer, and maintaining them by electrostatic effect against the first substrate, the first substrate being electrically charged;

b) placing in contact, direct or by molecular adhesion, the one or more first components or the first layer with the second substrate; and

c) separating or dismantling the first substrate, leaving at least one part of each of the one or more first components or of the first layer on the second substrate,

then carrying out a second transfer of a second stage of one or more second components or of a second layer, onto the first stage.

20. The method according to claim 19, the transfer of the second stage being carried out by:

a′

) applying and maintaining, by electrostatic effect, the one or more second components or the second layer, on the first stage, by a third substrate, made of the ferroelectric material and being electrically charged;

b′

) placing in contact and transferring the one or more second components or the second layer onto the first stage; and

c′

) separating or dismantling the third substrate, leaving the one or more second components or the second layer on the first stage.

21. The method according to claim 20, wherein the third substrate and the first substrate are the same substrate.

22. A method of carrying out a transfer of one or more first components or of a first layer, from a first substrate to a second substrate, comprising:

a) placing in contact, against the first substrate, made of a ferroelectric material, the one or more first components or the first layer, and maintaining them by electrostatic effect against the first substrate, the first substrate being electrically charged;

b) placing in contact, direct or by molecular adhesion, the one or more first components or the first layer with the second substrate; and

c) separating or dismantling the first substrate, leaving at least one part of each of the one or more first components or the first layer on the second substrate,

wherein the one or more first components, or the first layer, having undergone, before the a) placing, a treatment by ion implantation, defining in at least one of the one or more first components or in the first layer, a fragilization area, along which a fracture is formed between the a) placing and the b) placing.