Method for fabricating an interlayer
First Claim
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1. A method for fabricating an interlayer, comprising:
- (1) providing a substrate;
(2) forming an interlayer on said substrate; and
(3) performing a polymerization to said interlayer for modifying said interlayer wherein a UV light having a wavelength in range of 100 nm to 400 nm is applied to irradiate a surface of said interlayer in an ozone environment for polymerizing said interlayer; and
(4) performing an OH bonding removing treatment to said surface of said interlayer for removing OH bondings on said surface of said polymerized interlayer after said step (3) wherein said step (4) comprises;
dissolving a surfactant in a solvent for preparing a surfactant solution; and
coating said surfactant solution on said surface of said interlayer.
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Abstract
The present invention relates to a method for fabricating an interlayer, and particularly relates to a method for fabricating an interlayer PCBM which is difficult to be dissolved in organic solvents. The solubility of the interlayer (PCBM) in organic solvents is decreased by polymerization of the interlayer (PCBM). Therefore, the thickness of the interlayer (PCBM) can be efficiently controlled, and the yield rate and efficiency of photoelectric devices can be improved.
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25 Claims
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1. A method for fabricating an interlayer, comprising:
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(1) providing a substrate; (2) forming an interlayer on said substrate; and (3) performing a polymerization to said interlayer for modifying said interlayer wherein a UV light having a wavelength in range of 100 nm to 400 nm is applied to irradiate a surface of said interlayer in an ozone environment for polymerizing said interlayer; and (4) performing an OH bonding removing treatment to said surface of said interlayer for removing OH bondings on said surface of said polymerized interlayer after said step (3) wherein said step (4) comprises; dissolving a surfactant in a solvent for preparing a surfactant solution; and coating said surfactant solution on said surface of said interlayer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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Specification