Circuit board, semiconductor device, and method of manufacturing semiconductor device
First Claim
Patent Images
1. A method for manufacturing a semiconductor device, the method comprising steps of:
- forming a first electrode on a first base; and
forming a solder ball composed of lead free solder on the first electrode, wherein the step of forming the first electrode comprises steps of;
forming a first layer containing copper as a main component on the first base;
forming a second layer containing nickel as a main component on the first layer;
forming a third layer containing tin as a main component on the second layer; and
forming an alloy layer of the second layer and the third layer by a heat treatment after the step of forming the third layer;
wherein an alloy of tin, nickel, and copper is formed between the solder ball and the first electrode by the step of the solder ball; and
the further comprising a step of connecting the solder ball to a circuit board;
wherein the circuit board comprising;
a second base; and
a second electrode formed on the second base, wherein the second electrode comprising;
a fifth layer containing copper as a main component and formed on the second base;
a sixth layer containing nickel as a main component and formed on the fifth layer; and
a seventh layer containing an alloy of tin and nickel as a main component and formed on the sixth layer.
1 Assignment
0 Petitions
Accused Products
Abstract
There is provided a circuit board to which a solder ball composed of a lead (Pb)-free solder is to be connected, a semiconductor device including an electrode and a solder ball composed of a lead (Pb)-free solder disposed on the electrode, and a method of manufacturing the semiconductor device, in which mounting reliability can be improved by enhancing the bonding strength (adhesion strength) between the solder ball composed of a lead (Pb)-free solder and the electrode.
6 Citations
6 Claims
-
1. A method for manufacturing a semiconductor device, the method comprising steps of:
-
forming a first electrode on a first base; and
forming a solder ball composed of lead free solder on the first electrode, wherein the step of forming the first electrode comprises steps of;
forming a first layer containing copper as a main component on the first base;
forming a second layer containing nickel as a main component on the first layer;
forming a third layer containing tin as a main component on the second layer; and
forming an alloy layer of the second layer and the third layer by a heat treatment after the step of forming the third layer;
wherein an alloy of tin, nickel, and copper is formed between the solder ball and the first electrode by the step of the solder ball; andthe further comprising a step of connecting the solder ball to a circuit board;
wherein the circuit board comprising;
a second base; and
a second electrode formed on the second base, wherein the second electrode comprising;
a fifth layer containing copper as a main component and formed on the second base;
a sixth layer containing nickel as a main component and formed on the fifth layer; and
a seventh layer containing an alloy of tin and nickel as a main component and formed on the sixth layer. - View Dependent Claims (2, 3, 4, 5, 6)
-
Specification