Organic module EMI shielding structures and methods
First Claim
1. An integrated circuit structure, comprising:
- a substrate on a printed circuit board,said substrate having a first surface and a second surface and electromagnetic interference (EMI) absorbing material directly contacting at least a portion of at least one of said first surface and said second surface of said substrate;
an integrated circuit chip on said substrate, said integrated circuit chip being electrically connected to said substrate; and
an EMI shielding unit contacting said integrated circuit chip and said substrate, said EMI shielding unit comprising;
a lid covering said integrated circuit chip and portions of said substrate outside said integrated circuit chip;
a periphery of said lid comprising a side skirt, said side skirt circumscribing said integrated circuit chip and said substrate;
EMI absorbing material attached to an inner surface of said side skirt and at least a portion of an inner surface of said lid; and
EMI absorbing material attached to said printed circuit board, a portion of said side skirt being embedded in said EMI absorbing material.
6 Assignments
0 Petitions
Accused Products
Abstract
Apparatus and methods for an electronic package incorporating shielding against emissions of electromagnetic interference (EMI). According to an integrated circuit structure, a substrate is on a printed circuit board. An integrated circuit chip is on the substrate. The integrated circuit chip is electrically connected to the substrate. An electromagnetic interference (EMI) shielding unit is on the integrated circuit chip and the substrate. The EMI shielding unit comprises a lid covering the integrated circuit chip and portions of the substrate outside the integrated circuit chip. A fill material can be deposited within a cavity formed between the lid and the substrate. The fill material comprises an EMI absorbing material. A periphery of the lid comprises a side skirt, the side skirt circumscribing the integrated circuit chip and the substrate. EMI absorbing material is on the printed circuit board, and a portion of the side skirt is embedded in the EMI absorbing material.
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Citations
8 Claims
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1. An integrated circuit structure, comprising:
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a substrate on a printed circuit board, said substrate having a first surface and a second surface and electromagnetic interference (EMI) absorbing material directly contacting at least a portion of at least one of said first surface and said second surface of said substrate; an integrated circuit chip on said substrate, said integrated circuit chip being electrically connected to said substrate; and an EMI shielding unit contacting said integrated circuit chip and said substrate, said EMI shielding unit comprising; a lid covering said integrated circuit chip and portions of said substrate outside said integrated circuit chip; a periphery of said lid comprising a side skirt, said side skirt circumscribing said integrated circuit chip and said substrate; EMI absorbing material attached to an inner surface of said side skirt and at least a portion of an inner surface of said lid; and EMI absorbing material attached to said printed circuit board, a portion of said side skirt being embedded in said EMI absorbing material. - View Dependent Claims (2, 3, 4)
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5. An electronics package comprising:
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a substrate having a first surface and a second surface opposite said first surface; an integrated circuit chip connected to said first surface of said substrate; a plurality of electrically conductive circuit members attached to said first surface of said substrate, said electrically conductive circuit members being electrically connected to said integrated circuit chip; a printed circuit board having a mounting surface, said second surface of said substrate being connected to said mounting surface of said printed circuit board; a lid covering said integrated circuit chip and portions of said substrate outside said integrated circuit chip; a periphery of said lid comprising a side skirt, said side skirt circumscribing said integrated circuit chip and said substrate, electromagnetic interference (EMI) absorbing material being attached to an inner surface of said side skirt and at least a portion of an inner surface of said lid; and electromagnetic interference (EMI) absorbing material contacting said printed circuit board, a portion of said side skirt being embedded in said EMI absorbing material. - View Dependent Claims (6, 7, 8)
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Specification