Small form factor magnetic shield for magnetorestrictive random access memory (MRAM)
First Claim
1. A die comprising:
- a component;
a first ferromagnetic layer positioned above the component;
a second ferromagnetic layer positioned below the component; and
a plurality of through substrate vias positioned around the component, the plurality of through substrate vias comprising a ferromagnetic material.
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Accused Products
Abstract
Some implementations provide a die that includes a magnetoresistive random access memory (MRAM) cell array that includes several MRAM cells. The die also includes a first ferromagnetic layer positioned above the MRAM cell array, a second ferromagnetic layer positioned below the MRAM cell array, and several vias positioned around at least one MRAM cell. The via comprising a ferromagnetic material. In some implementations, the first ferromagnetic layer, the second ferromagnetic layer and the several vias define a magnetic shield for the MRAM cell array. The MRAM cell may include a magnetic tunnel junction (MTJ). In some implementations, the several vias traverse at least a metal layer and a dielectric layer of the die. In some implementations, the vias are through substrate vias. In some implementations, the ferromagnetic material has high permeability and high B saturation.
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Citations
67 Claims
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1. A die comprising:
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a component; a first ferromagnetic layer positioned above the component; a second ferromagnetic layer positioned below the component; and a plurality of through substrate vias positioned around the component, the plurality of through substrate vias comprising a ferromagnetic material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method for providing a die that includes a magnetic shield, comprising:
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providing a die that includes a component; providing a first ferromagnetic layer positioned above the component; providing a second ferromagnetic layer positioned below the component; and providing a plurality of through substrate vias positioned around the component, the plurality of through substrate vias comprising a ferromagnetic material. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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27. A die comprising:
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a component; a first shielding means configured to provide shielding of the component from a top magnetic field traversing a top portion of the die; a second shielding means configured to provide shielding of the component from a bottom magnetic field traversing a bottom portion of the die; and a third shielding means configured to provide shielding of the component from a side magnetic field traversing a side portion of the die. - View Dependent Claims (28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38)
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39. A die package comprising:
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a packaging substrate; a die coupled to the packaging substrate; a first ferromagnetic layer below the die; a second ferromagnetic layer above the die; a molding surrounding the die; and a plurality of vias positioned around an outer perimeter of the die, the plurality of vias formed in at least the molding, the plurality of vias comprising a ferromagnetic material. - View Dependent Claims (40, 41, 42, 43, 44, 45, 46, 47)
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48. A method for providing a die package that includes a magnetic shield, comprising:
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providing a packaging substrate; providing a die coupled to the packaging substrate; providing a first ferromagnetic layer below the die; providing a second ferromagnetic layer above the die; providing a molding surrounding the die; and providing a plurality of vias positioned around an outer perimeter of the die, the plurality of vias formed in at least the molding, the plurality of vias comprising a ferromagnetic material. - View Dependent Claims (49, 50, 51, 52, 53, 54, 55, 56, 57)
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58. A die package comprising:
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a packaging substrate; a die coupled to the packaging substrate; a molding surrounding the die; a first shielding means configured to provide shielding of the die from a bottom magnetic field traversing a bottom portion of the die package; a second shielding means configured to provide shielding of the die from a top magnetic field traversing a top portion of the die package; and a third shielding means configured to provide shielding of the die from a side magnetic field traversing a side portion of the die package. - View Dependent Claims (59, 60, 61, 62, 63, 64, 65, 66, 67)
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Specification