Tagging of functional blocks of a semiconductor component on a wafer

• US 8,952,712 B2
• Filed: 02/11/2011
• Issued: 02/10/2015
• Est. Priority Date: 06/16/2010
• Status: Expired due to Fees

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Broadcom Corporation (Broadcom, Inc.)
• Inventors: Behzad, Arya Reza, Rofougaran, Ahmadreza, Zhao, Sam Ziqun, Castaneda, Jesus Alfonso, Boers, Michael
• Primary Examiner(s): Assouad, Patrick
• Assistant Examiner(s): CURTIS, SEAN M
• Application Number:
  US13/025,665
• Publication Number:
  US 20110309851A1
• Time in Patent Office: 1,460 Days
• Field of Search: 324/750, 324/750.15, 324/763, 324/750.1, 324/763.8, 324/757.04, 324/762.02, 257/734, 714/23
• US Class Current: 324/750.15
• CPC Class Codes: G01R 31/2834 Automated test systems [ATE]; using microprocessors or computers G01R31/317 takes precedence; ATE for detection of defective computer hardware G06F11/2736
• CPC Class Codes: G01R 31/3025 Wireless interface with the DUT
• CPC Class Codes: G01R 31/311 of integrated circuits G01R31/31728 takes precedence
• CPC Class Codes: G01R 31/319 Tester hardware, i.e. output processing circuits
• CPC Class Codes: H01L 2223/54433 containing identification or tracking information
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device

Abstract

Methods and apparatus are disclosed to simultaneously, wirelessly test semiconductor components formed on a semiconductor wafer. The semiconductor components transmit respective outcomes of a self-contained testing operation to wireless automatic test equipment via a common communication channel. Multiple receiving antennas observe the outcomes from multiple directions in three dimensional space. The wireless automatic test equipment determines whether one or more of the semiconductor components operate as expected and, optionally, may use properties of the three dimensional space to determine a location of one or more of the semiconductor components. The wireless testing equipment may additionally determine performance of the semiconductor components by detecting infrared energy emitted, transmitted, and/or reflected by the semiconductor wafer before, during, and/or after a self-contained testing operation.

Claims

1. An integrated circuit under test that is implemented as part of a semiconductor component that is formed onto a semiconductor wafer, comprising:

a first functional block characterized as being assigned to a first unique identification number; and

a second functional block characterized as being assigned to a second unique identification number,

wherein the first unique identification number and the second unique identification number are wirelessly provided to the first functional block and the second functional block, respectively,

wherein the first functional block is configured to execute a self-contained testing operation to determine whether it operates as expected and to provide information resulting from execution of the self-contained testing operation to the second functional block,

wherein the second functional block is configured to execute the self-contained testing operation using the information to determine whether it operates as expected, and

wherein the first functional block and the second functional block are further configured to provide a first and a second indication of operability, respectively, in response to the execution of the self-contained testing operation, the first and the second indications of operability including the first unique identification number and the second unique identification number, respectively.

2. The integrated circuit under test of claim 1, wherein the first unique identification number represents a first sequence of bits that is unique to the first functional block, and

wherein the second unique identification number represents a second sequence of bits that is unique to the second functional block.

3. The integrated circuit under test of claim 1, wherein the semiconductor component includes a plurality of hardware modules, the first functional block and the second functional block being arranged to share at least one of the plurality of hardware modules.

4. The integrated circuit under test of claim 1, wherein the semiconductor component includes a plurality of hardware modules, the first functional block and the second functional block being arranged to share none of the plurality of hardware modules.

5. The integrated circuit under test of claim 1, wherein the first functional block comprises a first memory device configured to store the first unique identification number, and

wherein the second functional block comprises a second memory device configured to store the second unique identification number.

6. The integrated circuit under test of claim 1, wherein the first functional block is further configured to execute a plurality of first testing routines of the self-contained testing operation to determine whether it operates as expected, and

wherein the second functional block is further configured to execute a plurality of second testing routines of the self-contained testing operation to determine whether it operates as expected.

7. The integrated circuit under test of claim 1, wherein the first and the second indications of operability indicate whether the first functional block and the second functional block, respectively, operate as expected.

8. The integrated circuit under test of claim 1, wherein the first and the second indications of operability indicate whether the first functional block and the second functional block, respectively, operate unexpectedly.

9. The integrated circuit under test of claim 1, wherein the first functional block is further configured to append the first unique identification number to the first indication of operability when the first functional block operates unexpectedly, and

wherein the second functional block is further configured to append the second unique identification number to the second indication of operability when the second functional block operates unexpectedly.

10. The integrated circuit under test of claim 1, wherein the first functional block comprises a first transmitter configured to operate in accordance with an Institute of Electrical and Electronics Engineers (I.E.E.E.) 802.11 communication standard, and

wherein the second functional block comprises a second transmitter configured to operate in accordance with a Bluetooth communication standard.

11. The integrated circuit under test of claim 1, wherein the integrated circuit under test is coupled to a hardware test module, and

wherein the first functional block and the second functional block are further configured to receive the first unique identification number and the second unique identification number, respectively, from the hardware test module.

12. The integrated circuit under test of claim 1, wherein the first functional block comprises a first memory device configured to store the first unique identification number, and

wherein the second functional block comprises a second memory device configured to store the second unique identification number.

13. The integrated circuit under test of claim 1, wherein the first functional block is further configured to receive a plurality of first testing routines of the self-contained testing operation, and

wherein the second functional block is further configured to receive a plurality of second testing routines of the self-contained testing operation.

14. The integrated circuit under test of claim 13, wherein the first functional block is further configured to execute the plurality of first testing routines of the self-contained testing operation to determine whether it operates as expected, and

wherein the second functional block is further configured to execute the plurality of second testing routines of the self-contained testing operation to determine whether it operates as expected.

15. The integrated circuit under test of claim 11, wherein the first functional block and the second functional block are further configured to provide the first and the second indications of operability to the hardware test module.

16. The integrated circuit under test of claim 1, wherein the first functional block and the second functional block are further configured to execute the self-contained testing operation in response to a first and a second initiate testing operation signal, respectively.

17. The integrated circuit under test of claim 1, wherein the self-contained testing operation comprises a plurality of first testing routines and a plurality of second testing routines,

wherein the first functional block is further configured to execute the plurality of first testing routines to determine whether it operates as expected, and

wherein the second functional block is further configured to execute the plurality of second testing routines to determine whether it operates as expected.

18. A semiconductor wafer having a plurality of integrated circuits, comprising:

an integrated circuit under test, from among the plurality of integrated circuits including a first functional block that is tagged with a first unique identification number and a second functional block that is tagged with a second unique identification number,

wherein the first functional block is configured to execute a plurality of first testing routines of a self-contained testing operation to determine whether it operates as expected and to provide information resulting from execution of the plurality of first testing routines to the second functional block,

wherein the second functional block is configured to receive the information and to execute a plurality of second testing routines of the self-contained testing operation using the information to determine whether it operates as expected, and

wherein the first functional block and the second functional block are further configured to provide a first and a second indication of operability, respectively, in response to execution of the self-contained testing operation, the first and the second indications of operability including the first unique identification number and the second unique identification number, respectively.

19. The semiconductor wafer of claim 18, wherein the first unique identification number represents a first sequence of bits that is unique to the first functional block, and

wherein the second unique identification number represents a second sequence of bits that is unique to the second functional block.

20. The semiconductor wafer of claim 18, wherein the first and the second indications of operability indicate whether the first functional block and the second functional block, respectively, operate as expected.