Camera module

• US 8,953,096 B2
• Filed: 03/10/2014
• Issued: 02/10/2015
• Est. Priority Date: 10/31/2011
• Status: Active Grant

• Current Assignee: LG Innotek Company Limited (LG Corporation)
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: Oh, Sangyun
• Primary Examiner(s): SELBY, GEVELL V
• Application Number:
  US14/203,263
• Publication Number:
  US 20140192260A1
• Time in Patent Office: 337 Days
• Field of Search: 3482084-2087, 348/374
• US Class Current: 348/374
• CPC Class Codes: G02B 27/646 compensating for small deviations, e.g. due to vibration or shake movement of one or more optical elements for control of motion blur in cameras, projectors or printers G03B2205/0007; image stabilisation in cameras peculiar to the presence or use of an electronic image sensor H04N23/68
• CPC Class Codes: G02B 7/09 adapted for automatic focusing or varying magnification
• CPC Class Codes: G03B 13/36 Autofocus systems
• CPC Class Codes: G03B 2205/0007 Movement of one or more optical elements for control of motion blur
• CPC Class Codes: G03B 2205/0069 using electromagnetic actuators, e.g. voice coils
• CPC Class Codes: G03B 5/00 Adjustment of optical system relative to image or object surface other than for focusing
• CPC Class Codes: H04N 23/51 Housings
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: H04N 23/67 Focus control based on electronic image sensor signals
• CPC Class Codes: H04N 23/685 performed by mechanical compensation

Abstract

A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have first coils wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB; and buffer units provided at the connection units of the wire springs and the third PCB and configured to surround the connection units of the wire springs and the third PCB.

Claims

1. An OIS (Optical Image Stabilization) unit, comprising:

a housing unit including a first housing and a second housing arranged at an upper surface of the first housing and centrally formed with an opening;

a holder module including an outer blade spaced apart from an inner floor surface of the first housing at a predetermined distance, and a bobbin arranged at an inner surface of the outer blade;

a spring member arranged at the outer blade to support a movement of the bobbin to an optical axis;

an autofocus driving unit including an autofocus coil arranged at a periphery of the bobbin, and a magnet that interacts with the autofocus coil;

an OIS driving unit including a magnet and an OIS coil, the magnet and the OIS coil arranged on the housing unit and the holder module;

a plurality of wires that support a movement of the holder module to a direction perpendicular to the optical axis by the OIS driving unit while being spaced apart from the first housing at a predetermined distance, and electrically connected to the autofocus coil through the spring member configured to provide a current to the autofocus coil; and

a buffering unit formed by curving or bending the wires and arranged with an adhesive material.

2. The OIS unit of claim 1, wherein the magnet and the OIS coil interact by being discretely and oppositely arranged.

3. The OIS unit of claim 1, wherein two wires among the plurality of wires are electrically connected to the autofocus coil.

4. The OIS unit of claim 1, wherein each of the plurality of wires has a same length.

5. The OIS unit of claim 1, wherein the wire is formed with a metal material and with a thickness of 1˜

100 μ

m.

6. The OIS unit of claim 1, wherein the adhesive material includes a material for elastic support by being adhered.

7. The OIS unit of claim 1, wherein at least one of both distal ends of the wires includes a surface processing unit.

8. The OIS unit of claim 1, wherein the buffering unit is formed by bending the wire at least twice.

9. The OIS unit of claim 1, wherein the buffering unit is formed near to the outer blade.

10. The OIS unit of claim 1, wherein the first housing is a base.

11. The OIS unit of claim 1, further comprising a hook protrusively formed from the first housing.

12. The OIS unit of claim 1, further comprising a first PCB configured to apply a current to the autofocus coil and the OIS coil.

13. The OIS unit of claim 12, wherein the first PCB includes a terminal configured to receive the current and the wires are electrically connected to the first PCB.

14. The OIS unit of claim 1, wherein the magnet is arranged on the housing unit and the OIS coil is arranged on the outer blade.

15. A camera module, comprising an image sensor, a lens and an OIS (Optical Image Stabilization) unit, the OIS unit including,

a housing unit including a first housing and a second housing arranged at an upper surface of the first housing and centrally formed with an opening,

a holder module including an outer blade spaced apart from an inner floor surface of the first housing at a predetermined distance, and a bobbin arranged at an inner surface of the outer blade,

a spring member arranged at the outer blade to support a movement of the bobbin to an optical axis,

an autofocus driving unit including an autofocus coil arranged at a periphery of the bobbin, and a magnet that interacts with the autofocus coil,

an OIS driving unit including a magnet and an OIS coil, the magnet and the OIS coil arranged on the housing unit and the holder module,

a plurality of wires that support a movement of the holder module to a direction perpendicular to the optical axis by the OIS driving unit while being spaced apart from the first housing at a predetermined distance, and electrically connected to the autofocus coil through the spring member configured to provide a current to the autofocus coil,

a buffering unit integrally formed at a partial section of each the wires of the plurality of wires and arranged with an adhesive material, and

a first PCB (Printed Circuit Board) configured to apply a current to the autofocus coil and the OIS coil,

wherein the lens is coupled to the bobbin, and

wherein the camera module further comprises a second PCB, and the image sensor is arranged on the second PCB.

16. The camera module of claim 15, wherein the first PCB includes a terminal configured to receive the current, and

wherein the first and second PCBs are electrically connected.