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Media content device chassis with internal extension members

  • US 8,953,324 B2
  • Filed: 12/20/2013
  • Issued: 02/10/2015
  • Est. Priority Date: 03/21/2011
  • Status: Active Grant
First Claim
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1. A system comprising:

  • a circuit board;

    at least one integrated circuit chip residing on the circuit board and having a die situated thereon that generates heat when in operation; and

    a thermally conductive chassis that encloses the circuit board with the at least one integrated circuit chip thereon in an interior of the chassis, the thermally conductive chassis comprising;

    at least one panel with an external surface exposed to an environment having an environment temperature that is lower than an internal chassis temperature, and with an internal surface exposed to the interior of the chassis; and

    a heat bridge integrally formed as part of the chassis and protruding from the internal surface, the heat bridge defined by first and second opposing surfaces and a free end that is distally located from the panel,wherein the heat bridge is arranged proximate the die so that the first opposing surface receives thermal energy from the die,wherein an air gap separates the free end of the heat bridge from the circuit board, andwherein the heat bridge is in thermally conductive cooperation with the external surface of the chassis to transfer the received thermal energy for dissipation into the environment.

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