Media content device chassis with internal extension members

• US 8,953,324 B2
• Filed: 12/20/2013
• Issued: 02/10/2015
• Est. Priority Date: 03/21/2011
• Status: Active Grant

• Current Assignee: Dish Technologies LLC (Echostar Corporation)
• Original Assignee: Eldon Technology Limited (Echostar Corporation)
• Inventors: Burton, David Robert, Hardaker, Trevor, Stephens, Matthew, Blythe, Greg, Lockwood, Chris
• Primary Examiner(s): Edwards, Anthony Q
• Application Number:
  US14/136,192
• Publication Number:
  US 20140111937A1
• Time in Patent Office: 417 Days
• Field of Search: 361/714
• US Class Current: 361/714
• CPC Class Codes: H05K 7/20409 Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
• CPC Class Codes: H05K 7/20518 Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots

Abstract

A media content receiving device, such as a set top box, includes a chassis that incorporates a heat bridge, a heat shield or both. The heat bridge may take the form of a structural wall coupled to, but preferably integrated with, the chassis to facilitate conductive heat transfer into a chassis panel. The heat bridge may be configured to receive heat radiated from a chip having a die to be cooled. The heat shield may take the form of a wall-type structure protruding from a chassis panel. For example, the heat shield may extend from a top panel of the chassis in a fin-like or flange-like manner to provide a thermal barrier between adjacent electrical components arranged on a circuit board. While the heat shield protects the adjacent component from potential thermal damage or degradation, it may also operate to transfer heat into the chassis.

Claims

1. A system comprising:

a circuit board;

at least one integrated circuit chip residing on the circuit board and having a die situated thereon that generates heat when in operation; and

a thermally conductive chassis that encloses the circuit board with the at least one integrated circuit chip thereon in an interior of the chassis, the thermally conductive chassis comprising;

at least one panel with an external surface exposed to an environment having an environment temperature that is lower than an internal chassis temperature, and with an internal surface exposed to the interior of the chassis; and

a heat bridge integrally formed as part of the chassis and protruding from the internal surface, the heat bridge defined by first and second opposing surfaces and a free end that is distally located from the panel,

wherein the heat bridge is arranged proximate the die so that the first opposing surface receives thermal energy from the die,

wherein an air gap separates the free end of the heat bridge from the circuit board, and

wherein the heat bridge is in thermally conductive cooperation with the external surface of the chassis to transfer the received thermal energy for dissipation into the environment.

2. The system of claim 1, wherein the at least one panel of the chassis comprises the top panel.

3. The system of claim 2, wherein the heat bridge and the top panel are integrally machined together from a single piece of material.

4. The system of claim 2, wherein the heat bridge and the top panel are integrally molded together from a pre-formed mold.

5. The system of claim 2, wherein the heat bridge and the top panel are die cast together as a unitary component.

6. The system of claim 1, wherein the first opposing surface of the heat bridge faces the integrated circuit chip and includes a thermally absorptive surface disposed thereon to facilitate receiving the thermal energy from the die.

7. The system of claim 1, wherein the first opposing surface of the heat bridge faces the integrated circuit chip and includes a radiant energy absorptive coating disposed thereon to facilitate receiving the thermal energy from the die.

8. The system of claim 1, wherein the second opposing surface of the heat bridge that faces away from the integrated circuit chip includes a thermally insulative surface disposed thereon to prevent heat absorbed by the heat bridge from radiating out from the second opposing surface.

9. The system of claim 8, wherein the thermally insulative surface disposed on the second opposing surface of the heat bridge is a layer of fiberglass.

10. The system of claim 1, wherein the second opposing surface of the heat bridge that faces away from the integrated circuit chip includes a radiant energy insulative coating disposed thereon to prevent heat absorbed by the heat bridge from radiating out from the second opposing surface.

11. The system of claim 1, wherein the second opposing surface of the heat bridge that faces away from the integrated circuit chip includes a thermal insulative layer disposed thereon, wherein the thermal insulative layer has a larger R-value than a material used to make the heat bridge.

12. The system of claim 1, wherein the air gap that separates the free end of the heat bridge from the circuit board is configured to permit airflow proximate the integrated circuit chip.

13. The system of claim 1, wherein the at least one panel of the chassis comprises a side panel, and wherein the heat bridge extends outwardly from the side panel of the chassis.

14. The system of claim 1,

wherein the at least one panel of the chassis comprises a top panel portion and a plurality of side panel portions,

wherein the top panel portion has an external surface that is exposed to the environment having the environment temperature that is lower than the internal chassis temperature, and has an internal surface exposed to the interior of the chassis,

wherein a first one of the plurality of side panel portions has an external surface that is exposed to the environment having the environment temperature that is lower than the internal chassis temperature, and has an internal surface exposed to the interior of the chassis,

wherein the heat bridge extends outwardly from both of the interior surfaces of the top panel portion and the first side panel portion of the chassis, and

wherein the heat bridge is in thermally conductive cooperation with the external surface of the top panel portion and the first side panel portion to transfer the received thermal energy for dissipation into the environment.

15. The system of claim 14, wherein the free end of the heat bridge is a first free end that is distally located from the top panel portion, wherein a second free end is distally located from the first side panel portion, and wherein the air gap separates the first free end and the second free end of the heat bridge from the circuit board.

16. The system of claim 14, wherein the heat bridge, the top panel portion, and the plurality of side panel portions are integrally machined together from a single piece of material.

17. The system of claim 14, wherein the heat bridge, the top panel portion, and the plurality of side panel portions are integrally molded together from a pre-formed mold.

18. The system of claim 14, wherein the heat bridge, the top panel portion, and the plurality of side panel portions are die cast together as a unitary component.

19. A thermally conductive chassis comprising:

at least one panel with an internal surface and an external surface, wherein the external surface of the at least one panel is exposed to an environment having an environment temperature that is lower than a temperature of an interior of the chassis; and

a heat bridge formed on the internal surface of the at least one panel, wherein the heat bridge is defined by first and second opposing surfaces and a free end that is distally located from the at least one panel, and wherein the heat bridge is in thermally conductive cooperation with the external surface of the at least one panel to transfer received thermal energy for dissipation into the environment,

wherein the thermally conductive chassis is configured to enclose a circuit board within the interior of the chassis,

wherein an electronic component positioned on the circuit board is operable to radiate an amount of thermal energy,

wherein the heat bridge is arranged proximate the electronic component so that the first opposing surface of the heat bridge receives the thermal energy from the electronic component, and

wherein the heat bridge is formed on the internal surface of the at least one panel when the at least one panel and the heat bridge are integrally machined together from a single piece of material, when the at least one panel and the heat bridge are integrally molded together from a pre-formed mold, or when the at least one panel and the heat bridge are die cast together as a unitary component.

20. The system of claim 19, wherein an air gap separates the free end of the heat bridge from the circuit board.