Media content device chassis with internal extension members
First Claim
1. A system comprising:
- a circuit board;
at least one integrated circuit chip residing on the circuit board and having a die situated thereon that generates heat when in operation; and
a thermally conductive chassis that encloses the circuit board with the at least one integrated circuit chip thereon in an interior of the chassis, the thermally conductive chassis comprising;
at least one panel with an external surface exposed to an environment having an environment temperature that is lower than an internal chassis temperature, and with an internal surface exposed to the interior of the chassis; and
a heat bridge integrally formed as part of the chassis and protruding from the internal surface, the heat bridge defined by first and second opposing surfaces and a free end that is distally located from the panel,wherein the heat bridge is arranged proximate the die so that the first opposing surface receives thermal energy from the die,wherein an air gap separates the free end of the heat bridge from the circuit board, andwherein the heat bridge is in thermally conductive cooperation with the external surface of the chassis to transfer the received thermal energy for dissipation into the environment.
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0 Petitions
Accused Products
Abstract
A media content receiving device, such as a set top box, includes a chassis that incorporates a heat bridge, a heat shield or both. The heat bridge may take the form of a structural wall coupled to, but preferably integrated with, the chassis to facilitate conductive heat transfer into a chassis panel. The heat bridge may be configured to receive heat radiated from a chip having a die to be cooled. The heat shield may take the form of a wall-type structure protruding from a chassis panel. For example, the heat shield may extend from a top panel of the chassis in a fin-like or flange-like manner to provide a thermal barrier between adjacent electrical components arranged on a circuit board. While the heat shield protects the adjacent component from potential thermal damage or degradation, it may also operate to transfer heat into the chassis.
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Citations
20 Claims
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1. A system comprising:
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a circuit board; at least one integrated circuit chip residing on the circuit board and having a die situated thereon that generates heat when in operation; and a thermally conductive chassis that encloses the circuit board with the at least one integrated circuit chip thereon in an interior of the chassis, the thermally conductive chassis comprising; at least one panel with an external surface exposed to an environment having an environment temperature that is lower than an internal chassis temperature, and with an internal surface exposed to the interior of the chassis; and a heat bridge integrally formed as part of the chassis and protruding from the internal surface, the heat bridge defined by first and second opposing surfaces and a free end that is distally located from the panel, wherein the heat bridge is arranged proximate the die so that the first opposing surface receives thermal energy from the die, wherein an air gap separates the free end of the heat bridge from the circuit board, and wherein the heat bridge is in thermally conductive cooperation with the external surface of the chassis to transfer the received thermal energy for dissipation into the environment. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A thermally conductive chassis comprising:
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at least one panel with an internal surface and an external surface, wherein the external surface of the at least one panel is exposed to an environment having an environment temperature that is lower than a temperature of an interior of the chassis; and a heat bridge formed on the internal surface of the at least one panel, wherein the heat bridge is defined by first and second opposing surfaces and a free end that is distally located from the at least one panel, and wherein the heat bridge is in thermally conductive cooperation with the external surface of the at least one panel to transfer received thermal energy for dissipation into the environment, wherein the thermally conductive chassis is configured to enclose a circuit board within the interior of the chassis, wherein an electronic component positioned on the circuit board is operable to radiate an amount of thermal energy, wherein the heat bridge is arranged proximate the electronic component so that the first opposing surface of the heat bridge receives the thermal energy from the electronic component, and wherein the heat bridge is formed on the internal surface of the at least one panel when the at least one panel and the heat bridge are integrally machined together from a single piece of material, when the at least one panel and the heat bridge are integrally molded together from a pre-formed mold, or when the at least one panel and the heat bridge are die cast together as a unitary component. - View Dependent Claims (20)
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Specification