Method for edge sealing barrier films

• US 8,955,217 B2
• Filed: 01/19/2012
• Issued: 02/17/2015
• Est. Priority Date: 10/25/1999
• Status: Expired due to Fees

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Inventors: Burrows, Paul, Pagano, J. Chris, Mast, Eric S., Martin, Peter M., Graff, Gordon L., Gross, Mark E., Bonham, Charles C., Bennett, Wendy D., Hall, Michael G.
• Primary Examiner(s): CAZAN, LIVIUS RADU
• Application Number:
  US13/353,635
• Publication Number:
  US 20120118855A1
• Time in Patent Office: 1,125 Days
• US Class Current: 29/841
• CPC Class Codes: C09K 2323/00 Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
• CPC Class Codes: C09K 2323/05 Bonding or intermediate layer characterised by chemical composition, e.g. sealant or spacer
• CPC Class Codes: G02F 1/133337 Layers preventing ion diffusion, e.g. by ion absorption
• CPC Class Codes: H01L 23/562 Protection against mechanical damage H01L23/02, H01L23/28 take precedence
• CPC Class Codes: H01L 23/564 Details not otherwise provided for, e.g. protection against moisture getters H01L23/26
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01M 50/186 characterised by the disposition of the sealing members
• CPC Class Codes: H01M 50/191 Inorganic material
• CPC Class Codes: H01M 50/193 Organic material
• CPC Class Codes: H01M 50/197 having a layered structure
• CPC Class Codes: H10K 50/84 Passivation; Containers; Encapsulations
• CPC Class Codes: H10K 50/8445 multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
• CPC Class Codes: H10K 71/80 using temporary substrates
• CPC Class Codes: Y02E 60/10 Energy storage using batteries
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 29/49146 with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 428/239 Complete cover or casing

Abstract

An edge-sealed barrier film composite. The composite includes a substrate and at least one initial barrier stack adjacent to the substrate. The at least one initial barrier stack includes at least one decoupling layer and at least one barrier layer. One of the barrier layers has an area greater than the area of one of the decoupling layers. The decoupling layer is sealed by the first barrier layer within the area of barrier material. An edge-sealed, encapsulated environmentally sensitive device is provided. A method of making the edge-sealed barrier film composite is also provided.

Claims

1. A method of making an edge-sealed barrier film composite, the method comprising:

providing a substrate consisting essentially of a polymer; and

placing a plurality of barrier stacks on the substrate such that an initial barrier stack is formed directly on the substrate, the initial barrier stack comprising at least one decoupling layer comprising an organic material and a barrier layer comprising an inorganic material such that the barrier layer of the initial barrier stack is deposited directly on the substrate, wherein the at least one decoupling layer of the initial barrier stack defines an area and is etched so that at least one edge thereof defines a gradual slope, and wherein the barrier layer of the initial barrier stack has an area that is greater than the area of the at least one decoupling layer of the initial barrier stack such that a decoupling layer of a subsequently-deposited barrier stack is sealed from the substrate by at least the barrier layer of the initial barrier stack, the placing comprising;

providing at least one mask with at least one opening therein;

depositing the at least one decoupling layer of the initial barrier stack through the at least one opening in the at least one mask; and

depositing the barrier layer of the initial barrier stack adjacent to the at least one decoupling layer of the initial barrier stack.

2. The method of claim 1, wherein at least one barrier layer of each subsequently-deposited barrier stack has an area greater than the area of the at least one decoupling layer of the initial barrier stack such that a sealing containment of the at least one decoupling layer of the initial barrier stack is formed thereby.

3. The method of claim 1, wherein the at least one barrier layer of a first subsequently-deposited barrier stack is deposited directly on a top layer of the initial barrier stack.

4. The method of claim 1, wherein the at least one decoupling layer of the initial barrier stack is etched using a reactive plasma.

5. The method of claim 4, wherein the reactive plasma is selected from O₂, CF₄, H₂ or combinations thereof.

6. The method of claim 1, wherein at least one of the plurality of barrier stacks comprises at least two decoupling layers therein.

7. The method of claim 1, further comprising placing an environmentally sensitive device adjacent to the substrate before the initial barrier stack is placed thereon.

8. The method of claim 1, further comprising placing an environmentally sensitive device adjacent to at least one of the plurality of barrier stacks after the initial barrier stack is placed on the substrate.

9. The method of claim 8, wherein at least one subsequently-deposited barrier stack comprises at least one decoupling layer and at least one barrier layer such that the area of the at least one barrier layer of the at least one subsequently-deposited barrier stack is greater than the area of the at least one decoupling layer of the subsequently-deposited barrier stack-such that it is sealed thereby.

10. The method of claim 1, wherein at least one of the plurality of barrier stacks is formed by laminating.

11. The method of claim 10, wherein the lamination is achieved using a process selected from heating, soldering, using an adhesive, ultrasonic welding and applying pressure.

12. A method of making an edge-sealed barrier film composite, the method comprising:

providing a substrate consisting essentially of a polymer;

placing a plurality of barrier stacks on the substrate such that an initial barrier stack is formed directly on the substrate, the initial barrier stack comprising at least one decoupling layer comprising an organic material and a barrier layer comprising an inorganic material such that the barrier layer of the initial barrier stack is deposited directly on the substrate, wherein the at least one decoupling layer of the initial barrier stack defines an area and wherein the barrier layer of the initial barrier stack has an area that is greater than the area of the at least one decoupling layer of the initial barrier stack such that a decoupling layer of a subsequently-deposited barrier stack is sealed from the substrate by at least the barrier layer of the initial barrier stack, the placing comprising;

providing at least one mask with at least one opening therein;

depositing the at least one decoupling layer of the initial barrier stack through the at least one opening in the at least one mask; and

depositing the barrier layer of the initial barrier stack adjacent to the at least one decoupling layer of the initial barrier stack; and

depositing a ridge on the substrate before depositing the initial barrier stack thereon, the ridge interfering with the deposition of the first decoupling layer of the initial barrier stack so that the area of the barrier layer of the initial barrier stack is greater than the area of the first decoupling layer of the initial barrier stack.