Solid-state lighting apparatus

• US 8,956,018 B2
• Filed: 06/10/2010
• Issued: 02/17/2015
• Est. Priority Date: 06/10/2009
• Status: Active Grant

• Current Assignee: Prafulla Madhukar Thote
• Original Assignee: Prafulla Madhukar Thote
• Inventors: Deshpande, Shirish Devidas, Thote, Prafulla Madhukar
• Primary Examiner(s): Lee, Jong-Suk (James)
• Assistant Examiner(s): GARLEN, ALEXANDER K
• Application Number:
  US12/797,651
• Publication Number:
  US 20100315252A1
• Time in Patent Office: 1,713 Days
• Field of Search: 362/190, 362/191, 362/218, 362/217.14, 362/217.16, 362/249.01, 362/249.02, 362/294, 362/373, 362/431, 362/800, 362/802, 362/547
• US Class Current: 362/373
• CPC Class Codes: F21S 8/088 with lighting device mounted on top of the standard, e.g. for pedestrian zones
• CPC Class Codes: F21V 15/01 Housings, e.g. material or assembling of housing parts F21V15/02 takes precedence housings forming signs or letters G09F13/04
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/83 the elements having apertures, ducts or channels, e.g. heat radiation holes
• CPC Class Codes: F21W 2131/103 of streets or roads
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

The invention provides lighting apparatuses which are power efficient, environment friendly and long lasting and can be manufactured with high degree of speed, accuracy and flexibility. The lighting apparatuses are easily serviceable and can be produced, transported economically and have higher economical value even on completion of life term of the lighting apparatuses. The present invention reduce the waste of raw material thereby utilizing maximum percentage raw material for produce solid state lighting fixtures using CAD and CNC process and provides retrofitting lighting apparatuses which can be replaced without making considerable changes in existing infrastructure.

Claims

1. A solid-state lighting apparatus comprising:

a fixture having a mounting surface, the fixture made of a thermally conductive sheet metal, the fixture is a primary heat sink and dissipates heat in an x axis and a y axis, relative to each other, of the fixture, wherein the fixture has a thickness between 0.5 and 6.0 millimeters, wherein the primary heat sink further comprises a first primary heat sink and a second primary heat sink, the first primary heat sink being a separate unitary structure from the second primary heat sink, wherein at least one of a thermal isolator and a buffer space is positioned between the first primary heat sink and the second primary heat sink;

an anodized coating covering the fixture, the anodized coating configured to prevent corrosion and increase thermal conductivity;

a metal core printed circuit board (MCPCB) mounted on the mounting surface;

a power supply unit enclosed within a housing in the fixture, the power supply unit configured to generate an output voltage, wherein the power supply unit is configured to achieve a power factor greater than 0.98;

a solid-state light-emitting source mounted on the MCPCB, the solid-state light-emitting source coupled to the power supply unit, wherein the solid-state light emitting source is one of a Light Emitting Diode (LED), an Organic Light Emitting Diode (OLED), and a Polymer Light Emitting Diode (PLED);

a base plane extending from one end of the fixture, wherein the base plane is adjustably inclined with respect to a ground in order to control a photometry of the solid state light emitting source;

a secondary heat dissipating panel mounted at a rear of the fixture, wherein the secondary heat dissipating panel is a secondary heat sink, and wherein the secondary heat dissipating panel is made from a thermally conductive material selected from a set of aluminum, iron, steel, and copper;

a sensor coupled to the power supply unit for selectively controlling power delivery to the solid-state light-emitting source, wherein the sensor is one of a photo sensor or a motion sensor;

a lens mounted on the solid-state light-emitting source to focus a light output from the solid-state light-emitting source, wherein the lens prevents light scatter; and

a metallic thermal interface positioned in a cut-out opening of the first primary heat sink, wherein the heat is dissipated from the MCPCB through the metallic thermal interface and to the second primary heat sink.

2. The lighting apparatus of claim 1, wherein the power supply unit is an AC or DC power supply unit.

3. The lighting apparatus of claim 1, wherein the fixture comprises a hole, the hole configured to provide heat dissipation and wind resistance.

4. The lighting apparatus of claim 1, wherein the secondary heat dissipating panel comprises a hole, the hole configured to provide heat dissipation and wind resistance.

5. The lighting apparatus of claim 1, further comprising a protective transparent sheet covering the solid-state light-emitting source, the sheet made from glass or plastic.

6. The lighting apparatus of claim 1, wherein the lighting apparatus is configured to achieve ingress protection standards.

7. The lighting apparatus of claim 1, wherein the thermally conductive sheet metal is aluminum, iron, steel, or copper.

8. The lighting apparatus of claim 1, further comprising a thermal interface material placed between the fixture and the MCPCB.

9. The solid-state lighting apparatus of claim 1, wherein the metallic thermal interface is not in contact with the first primary heat sink.

10. A solid-state lighting apparatus comprising:

a fixture having a mounting surface, the fixture made of a thermally conductive sheet metal, wherein the fixture is a primary heat sink and dissipates heat through at least a thickness thereof, wherein the fixture has a thickness between 0.5 and 6.0 millimeters;

an anodized coating covering the fixture, the anodized coating configured to prevent corrosion and increase thermal conductivity;

a metal core printed circuit board (MCPCB) mounted on the mounting surface;

a power supply unit enclosed within a housing in the fixture, the power supply unit configured to generate an output voltage;

a solid-state light-emitting source mounted on the MCPCB, the solid-state light-emitting source coupled to the power supply unit, wherein the solid-state light emitting source further comprises at least one of a Light Emitting Diode (LED), an Organic Light Emitting Diode (OLED), and a Polymer Light Emitting Diode (PLED);

a secondary heat dissipating panel constructed from a thermally conductive material and mounted at a rear of the fixture, the secondary heat dissipating panel being separate from the primary heat sink, wherein the primary heat sink is positioned between the MCPCB and the secondary heat dissipating panel;

at least one threaded fastener engaged between a clamp positioned exterior of the secondary heat dissipating panel and the MCPCB, wherein the at least one threaded fastener is positioned through the MCPCB, the primary heat sink, and the secondary heat dissipating panel; and

a third heat dissipating panel positioned between the MCPCB and the primary heat sink, wherein the at least one threaded fastener is positioned through the MCPCB, the primary heat sink, the secondary heat dissipating panel, and the third heat dissipating panel.

11. The solid-state lighting apparatus of claim 10, further comprising a thermal interface positioned between each of:

the MCPCB and the third heat dissipating panel;

the third heat dissipating panel and the primary heat sink; and

the primary heat sink and the secondary heat dissipating panel.

12. The solid-state lighting apparatus of claim 10, further comprising a photo sensor coupled to the power supply unit, the photo sensor selectively controlling power delivery to the solid-state light-emitting source.

13. The solid-state lighting apparatus of claim 10, further comprising a motion sensor coupled to the power supply unit, the motion sensor selectively controlling power delivery to the solid-state light-emitting source.

14. The solid-state lighting apparatus of claim 10, further comprising a lens mounted on the solid-state light-emitting source, the lens configured to focus light output from the solid-state light-emitting source, and the lens further configured to prevent light scatter.

15. A solid-state lighting apparatus comprising:

a fixture having a mounting surface, the fixture made of a thermally conductive sheet metal, wherein the fixture is a primary heat sink and dissipates heat through at least a thickness thereof, wherein the fixture has a thickness between 0.5 and 6.0 millimeters;

an anodized coating covering the fixture, the anodized coating configured to prevent corrosion and increase thermal conductivity;

a metal core printed circuit board (MCPCB) mounted on the mounting surface;

a power supply unit enclosed within a housing in the fixture, the power supply unit configured to generate an output voltage;

a solid-state light-emitting source mounted on the MCPCB, the solid-state light-emitting source coupled to the power supply unit, wherein the solid-state light emitting source further comprises at least one of a Light Emitting Diode (LED), an Organic Light Emitting Diode (OLED), and a Polymer Light Emitting Diode (PLED);

a secondary heat dissipating panel constructed from a thermally conductive material and mounted at a rear of the fixture, the secondary heat dissipating panel being separate from the primary heat sink, wherein the primary heat sink is positioned between the MCPCB and the secondary heat dissipating panel;

at least one threaded fastener engaged between a clamp positioned exterior of the secondary heat dissipating panel and the MCPCB, wherein the at least one threaded fastener is positioned through the MCPCB, the primary heat sink, and the secondary heat dissipating panel; and

at least one isolating bushing positioned surrounding the at least one threaded fastener, wherein the at least one threaded fastener is separated from the MCPCB, the primary heat sink, and the secondary heat dissipating panel with the isolating bushing.