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White light devices using non-polar or semipolar gallium containing materials and phosphors

  • US 8,956,894 B2
  • Filed: 09/24/2013
  • Issued: 02/17/2015
  • Est. Priority Date: 08/04/2008
  • Status: Active Grant
First Claim
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1. A method for fabricating a light emitting diode device comprising:

  • providing a substrate member comprising a first surface region;

    providing one or more light emitting diode devices overlying the first surface region, at least one of the light emitting diode devices being fabricated on a semipolar or nonpolar GaN containing device substrate, the device substrate comprising a bulk gallium nitride substrate, the at least one or more light emitting diode devices fabricated on the semipolar or nonpolar GaN containing device substrate emitting substantially polarized emission of one or more first wavelengths;

    coupling an optically transparent member to the one or more light emitting diode devices such that an optical path is provided between the one or more light emitting diode devices and the optically transparent member; and

    forming a thickness of one or more entities formed within a vicinity of the optically transparent member, one or more of the entities being excited by the substantially polarized emission to emit electromagnetic radiation at one or more second wavelengths;

    wherein the bulk gallium nitride substrate has a dislocation density in the plane of the large-area surface that is less than 5×

    106 cm

    2
    .

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