Optimized via cutouts with ground references
First Claim
1. A printed circuit board comprising:
- a first ground reference layer;
a second ground reference layer;
a via cutout on the first ground reference layer, the geometry of the via cutout selected to provide an extension region extending in the direction of a differential trace,a first differential trace, the first differential trace adjacent a first ground reference layer and a second ground reference layer, wherein a spacing of the first differential trace in the extension region is different from a spacing of the first differential trace outside the extension region;
a second differential trace;
the second differential trace adjacent the second ground reference layer; and
a first via cutout and a second via cutout on the second ground reference layer, a radial dimension of the first via cutout and the second via cutout selected such that the second ground reference layer remains intact in the area adjacent the second differential trace.
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Accused Products
Abstract
The present disclosure relates to a method of optimizing via cutouts, including selecting a geometry of a via cutout on a first ground reference layer adjacent to a first differential trace, the geometry selected to provide an extension region extending in the direction of the first differential trace. Additionally, the method includes the steps of selecting a geometry of the first differential trace, wherein a spacing of the first differential trace in the extension region is different from a spacing of the first differential trace outside the extension region, and selecting a radial dimension of a first and second via cutout on a second ground reference layer adjacent to and between the first and second differential traces, the radial dimension of the first via cutout and the second via cutout selected such that the second ground reference layer remains intact in the area adjacent the second differential trace.
140 Citations
18 Claims
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1. A printed circuit board comprising:
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a first ground reference layer; a second ground reference layer; a via cutout on the first ground reference layer, the geometry of the via cutout selected to provide an extension region extending in the direction of a differential trace, a first differential trace, the first differential trace adjacent a first ground reference layer and a second ground reference layer, wherein a spacing of the first differential trace in the extension region is different from a spacing of the first differential trace outside the extension region; a second differential trace;
the second differential trace adjacent the second ground reference layer; anda first via cutout and a second via cutout on the second ground reference layer, a radial dimension of the first via cutout and the second via cutout selected such that the second ground reference layer remains intact in the area adjacent the second differential trace. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of optimizing via cutouts, comprising:
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selecting a geometry of a via cutout on a first ground reference layer adjacent to a first differential trace, the geometry of the via cutout selected to provide an extension region extending in the direction of the first differential trace; selecting a geometry of the first differential trace, wherein a spacing of the first differential trace in the extension region is different from a spacing of the first differential trace outside the extension region; and selecting a radial dimension of a first via cutout and a second via cutout on a second ground reference layer adjacent to and between the first differential trace and a second differential trace, the radial dimension of the first via cutout and the second via cutout selected such that the second ground reference layer remains intact in the area adjacent the second differential trace. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
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Specification