Printed wiring board and method for manufacturing same

• US 8,959,760 B2
• Filed: 08/15/2011
• Issued: 02/24/2015
• Est. Priority Date: 09/20/2007
• Status: Active Grant

• Current Assignee: Ibiden Co., Ltd.
• Original Assignee: Ibiden Co., Ltd.
• Inventors: Niki, Ayao, Kitajima, Kazuhisa
• Primary Examiner(s): Vo, Peter DungBa
• Assistant Examiner(s): Carley, Jeffrey T
• Application Number:
  US13/209,483
• Publication Number:
  US 20110296681A1
• Time in Patent Office: 1,289 Days
• Field of Search: 298/52, 298/30, 298/46, 298/31, 298/53, 257/698, 257/700, 257/785, 257/786, 174/255, 174/261, 174/262, 228/110.1
• US Class Current: 29/846
• CPC Class Codes: H05K 1/113 Via provided in pad; Pad over filled via
• CPC Class Codes: H05K 2201/096 Vertically aligned vias, holes or stacked vias
• CPC Class Codes: H05K 2203/0152 Temporary metallic carrier, e.g. for transferring material affixing a prefabricated conductor pattern formed by electroplating or electroforming on a metallic carrier H05K3/205
• CPC Class Codes: H05K 2203/0156 Temporary polymeric carrier or foil, e.g. for processing or transferring
• CPC Class Codes: H05K 2203/0228 Cutting, sawing, milling or shearing
• CPC Class Codes: H05K 2203/1536 Temporarily stacked PCBs
• CPC Class Codes: H05K 3/0058 Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence
• CPC Class Codes: H05K 3/025 by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
• CPC Class Codes: H05K 3/06 the conductive material being removed chemically or electrolytically, e.g. by photo-etch process semi-additive methods H05K3/108
• CPC Class Codes: H05K 3/108 by semi-additive methods; masks therefor characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241
• CPC Class Codes: H05K 3/4682 Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base
• CPC Class Codes: Y10T 29/49167 with deforming of conductive path

Abstract

A method for manufacturing a printed wiring board, including providing a support board having a metal foil secured to the support board, forming a resin insulation layer on the metal foil, forming openings in the resin insulation layer, forming a conductive circuit on the resin insulation layer, forming in the openings via conductors to electrically connect the conductive circuit and the metal foil, separating the support board and the metal foil, and forming from the metal foil external terminals to electrically connect to another substrate or electronic component.

Claims

1. A method for manufacturing a printed wiring board, comprising:

preparing a mother material structure comprising a support member and a metal foil laminated on a surface of the support member, the metal foil having a smaller size than the surface of the support member;

forming a laminated sheet body comprising a resin insulation layer, a conductive circuit and a solder resist layer on the surface of the support member such that the resin insulation layer covers the metal foil laminated on the surface in entirety and a portion of the surface of the support member outside the metal foil;

cutting a portion of the laminated sheet body inside a peripheral portion of the surface of the support member such that the portion of the laminated sheet body having the metal foil is removed from the support member; and

forming from the metal foil a plurality of external terminals positioned to electrically connect to another substrate or an electronic component.

2. The method for manufacturing a printed wiring board according to claim 1, wherein the preparing of the mother material structure comprises gluing or bonding peripheral portions of the metal foil to the support member.

3. The method for manufacturing a printed wiring board according to claim 1, wherein the forming of the laminated sheet body comprises forming an upper-layer resin insulation layer such that the upper-layer resin insulation layer covers the resin insulation layer and conductive circuit, forming a plurality of openings in the upper-layer resin insulation layer, forming an upper-layer conductive circuit on the upper-layer resin insulation layer, and forming a plurality of upper-layer via conductors in the openings formed in the upper-layer resin insulation layer such that the upper-layer via conductors electrically connect the conductive circuit and the upper-layer conductive circuit.

4. The method for manufacturing a printed wiring board according to claim 1, wherein the support member comprises at least one metal surface.

5. The method for manufacturing a printed wiring board according to claim 4, wherein the metal surface of the support member comprises a metal foil.

6. The method for manufacturing a printed wiring board according to claim 1, wherein the preparing of the mother material structure comprises securing the metal foil to the support member by ultrasound bonding.

7. The method for manufacturing a printed wiring board according to claim 1, wherein the support member comprises a metal plate.

8. The method for manufacturing a printed wiring board according to claim 1, wherein the forming of the laminated sheet body comprises forming a plurality of openings for a plurality of via conductors in the resin insulation layer, forming the conductive circuit on the resin insulation layer, and forming in the plurality of openings a plurality of via conductors electrically connecting the conductive circuit and the metal foil, and the forming of the conductive circuit and the forming of the via conductors are carried out simultaneously.

9. The method for manufacturing a printed wiring board according to claim 3, wherein the forming of the upper-layer conductive circuit and the forming of the upper-layer via conductors are carried out simultaneously.

10. The method for manufacturing a printed wiring board according to claim 1, wherein the support member comprises a copper-clad laminate.

11. The method for manufacturing a printed wiring board according to claim 10, wherein the preparing of the mother material structure comprises securing the metal foil to the copper-clad laminate by ultrasound bonding.

12. The method for manufacturing a printed wiring board according to claim 1, wherein the forming of the external terminals includes etching the metal foil such that the metal foil is patterned into the external terminals.

13. The method for manufacturing a printed wiring board according to claim 1, wherein the forming of the laminated sheet body comprises forming an opening for a via conductor in the resin insulation layer, forming the conductive circuit on the resin insulation layer, forming in the opening a via conductor electrically connecting the conductive circuit and the metal foil, and forming the solder resist layer on the conductive circuit and the resin insulation layer.

14. The method for manufacturing a printed wiring board according to claim 2, wherein the forming of the external terminal includes etching the metal foil from the portion of the laminated sheet body such that the metal foil is patterned into the external terminals.

15. The method for manufacturing a printed wiring board according to claim 1, wherein the forming of the external terminal includes etching the metal foil from the portion of the laminated sheet body such that the metal foil is patterned into the external terminals, wherein the metal foil has a matted surface on which the resin insulation layer is formed, and the metal foil is etched from the portion of the laminated sheet body such that a roughened surface formed on the portion of the laminated sheet body by the matted surface of the metal foil is exposed.

16. The method for manufacturing a printed wiring board according to claim 1, wherein the forming of the laminated sheet body comprises forming a plurality of openings for a plurality of via conductors in the resin insulation layer, forming the conductive circuit on the resin insulation layer, and forming in the plurality of openings a plurality of via conductors electrically connecting the conductive circuit and the metal foil.

17. The method for manufacturing a printed wiring board according to claim 16, wherein the forming of the laminated sheet body comprises forming an upper-layer resin insulation layer such that the upper-layer resin insulation layer covers the resin insulation layer and conductive circuit, forming a plurality of openings in the upper-layer resin insulation layer, forming an upper-layer conductive circuit on the upper-layer resin insulation layer, and forming a plurality of upper-layer via conductors in the openings formed in the upper-layer resin insulation layer such that the upper-layer via conductors electrically connect the conductive circuit and the upper-layer conductive circuit.

18. The method for manufacturing a printed wiring board according to claim 1, wherein the support member has double-sided metal surfaces each of which forms a metal surface, the forming of the laminated sheet body is carried out on the double-sided metal surfaces of the support member such that a plurality of laminated sheet bodies is formed on the double-sided metal surfaces of the support member, respectively.

19. The method for manufacturing a printed wiring board according to claim 4, wherein the forming of the external terminals includes etching the metal foil such that the metal foil is patterned into the external terminals.

20. The method for manufacturing a printed wiring board according to claim 4, wherein the forming of the external terminals includes etching the metal foil such that the metal foil is patterned into the external terminals, wherein the metal foil has a matted surface on which the resin insulation layer is formed, and the metal foil is etched from the portion of the laminated sheet body such that a roughened surface formed on the portion of the laminated sheet body by the matted surface of the metal foil is exposed.