Method of manufacturing an electronic module

• US 8,959,762 B2
• Filed: 02/25/2011
• Issued: 02/24/2015
• Est. Priority Date: 08/08/2005
• Status: Active Grant

• Current Assignee: Qorvo US, Inc. (Qorvo, Inc.)
• Original Assignee: RF Micro Devices Incorporated (Qorvo, Inc.)
• Inventors: Leahy, Donald Joseph, Sawyer, Brian D., Parker, Stephen, Morris, Thomas Scott
• Primary Examiner(s): PHAN, THIEM D
• Application Number:
  US13/034,755
• Publication Number:
  US 20120217048A1
• Time in Patent Office: 1,460 Days
• Field of Search: 298/55, 294/12, 298/25, 298/29, 298/32, 298/40, 298/41, 298/46, 298/47, 298/52, 257/773, 257/786, 257/E23.02
• US Class Current: 29/855
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H05K 1/0216 Reduction of cross-talk, noise or electromagnetic interference grounding H05K1/0215
• CPC Class Codes: H05K 1/0218 by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/0715 provided by an outer layer of PCB
• CPC Class Codes: H05K 2201/0949 Pad close to a hole, not surrounding the hole if used for surface mounting H05K1/114
• CPC Class Codes: H05K 2201/09618 Via fence, i.e. one-dimensional array of vias
• CPC Class Codes: H05K 2201/09709 Staggered pads, lands or terminals; Parallel conductors in different planes
• CPC Class Codes: H05K 3/0052 Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: H05K 3/0097 Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards H05K3/0052 takes precedence
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/4614 the electrical connections between the circuit boards being made during lamination
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49146 with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 29/49171 with encapsulating

Abstract

In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.

Claims

1. A method of manufacturing an electronic module, comprising:

providing a substrate having a component portion wherein the component portion includes a component area on a surface of the substrate, and a plurality of metallic layers that extend along a periphery of the component portion wherein the plurality of metallic layers are coupled to one another;

providing an electronic component on the component area;

providing an overmold over the surface to cover the component area;

forming an opening through at least the overmold that exposes at least a section of one of the plurality of metallic layers along the periphery of the component portion; and

applying an electromagnetic shield material over the overmold and within the opening to form an electromagnetic shield over the component area that is coupled to at least the section of the one of the plurality of metallic layers.

2. The method of claim 1 wherein providing a substrate further comprises providing the plurality of metallic layers stacked over one another.

3. The method of claim 2, wherein providing the substrate further comprises providing one or more conductive vertical interconnect access structure (vias) that couple the plurality of metallic layers.

4. The method of claim 1, further comprising providing a ground plate coupled to the plurality of metallic layers.

5. The method of claim 1, wherein providing a substrate further comprises providing the plurality of metallic layers so that the plurality of metallic layers substantially surround the periphery of the component portion.

6. The method of claim 1, wherein the plurality of metallic layers comprises a first metallic layer and a second metallic layer below the first metallic layer when the substrate is provided.

7. The method of claim 6, wherein forming the opening comprises removing a portion of the overmold directly above at least a section of the first metallic layer along the periphery of the component portion wherein the section of the one of the plurality of metallic layers along the periphery of the component portion is the section of the first metallic layer.

8. The method of claim 6, wherein forming the opening comprises removing a portion of the overmold, at least a portion of the first metallic layer, and a portion of the substrate directly above a section of the second metallic layer wherein the section of the one of the plurality of metallic layers along the periphery of the component portion is the section of the second metallic layer.

9. The method of claim 1, wherein, when the substrate is provided:

the plurality of metallic layers have a first metallic layer and a second metallic layer within the substrate, wherein the second metallic layer is positioned below the first metallic layer, each of the first and second metallic layers having an extended section that extends from the periphery and into the component portion; and

at least one conductive vias that couples each of the extended sections of the first and second metallic layers.

10. A method of manufacturing a plurality of electronic modules, comprising:

providing a substrate comprising a substrate body having a plurality of component portions wherein each of the plurality of component portions includes a component area on a surface of the substrate body and a periphery, and a plurality of metallic structures associated with each of the plurality of component portions, wherein each of the plurality of metallic structures has a plurality of metallic layers that extend along the periphery of one of the plurality of component portions;

providing electronic components on the component areas;

providing an overmold over the surface of the substrate body to cover the component areas;

forming channels along the periphery of each of the plurality of component portions, the channels being formed through at least the overmold, wherein the channels expose at least a first section of a first metallic layer in the plurality of metallic layers of each of the plurality of metallic structures; and

applying an electromagnetic shield material over the overmold and in the channels to form electromagnetic shields over the component areas wherein the first section of the first metallic layer in each of the plurality of metallic structures are coupled to one of the electromagnetic shields.

11. The method of claim 10, further comprising singulating the plurality of component portions from the substrate body.

12. The method of claim 10, wherein providing the substrate comprises forming the plurality of component portions so that the plurality of component portions is configured as an array of component portions.

13. The method of claim 12, wherein the array of component portions includes columns and rows of component portions.

14. The method of claim 10, wherein providing the substrate comprises:

providing a first metal sheet;

for each of the plurality of metallic structures, forming the first metallic layer from the first metal sheet; and

providing a first substrate layer of the substrate body on the first metallic layer of each of the plurality of metallic structures.

15. The method of claim 14, wherein providing the substrate further comprises, for each of the plurality of metallic structures, providing one or more conductive vias on the first metallic layer.

16. The method of claim 15, wherein:

for each of the plurality of metallic structures, the first metallic layer substantially surrounds an area of the first substrate layer that forms a part of the one of the plurality of component portions; and

wherein, for each of the plurality of metallic structures, the one or more conductive vias on the first metallic layer comprises a plurality of conductive vias substantially surrounding the area of the first substrate layer that forms the part of the one of the plurality of component portions.

17. The method of claim 16, wherein providing the substrate further comprises:

providing a second metal sheet over or below the first substrate layer;

for each of the plurality of metallic structures, forming a second metallic layer of the plurality of metallic layers from the second metal sheet; and

providing a second substrate layer of the substrate body on the second metallic layer of each of the plurality of metallic structures.

18. The method of claim 17, wherein providing the substrate further comprises, for each of the plurality of metallic structures, providing one or more conductive vias on the second metallic layer of each of the plurality of metallic structures.

19. The method of claim 10, wherein providing the substrate further comprises, for each of the plurality of metallic structures, one of the plurality of metallic layers substantially surrounds a perimeter of the component area in the one of the plurality of component portions.

20. The method of claim 10, wherein the plurality of metallic structures are separated from one another, when the substrate is provided.

21. The method of claim 10, wherein providing the substrate further comprises providing a meta-metallic structure having the plurality of metallic structures.

22. The method of claim 10, wherein providing the substrate further comprises:

providing a first metal sheet;

for each of the plurality of metallic structures, forming the first metallic layer of the plurality of metallic layers having a first extended section that extends from the periphery and into the one of the plurality of component portions;

for each of the plurality of metallic structures, forming one or more conductive vias on each of the first extended sections;

providing a first substrate layer of the substrate body on the first metallic layer of each of the plurality of metallic structures;

providing a second metal sheet over or below the first substrate layer;

for each of the plurality of metallic structures, forming a second metallic layer of the plurality of metallic layers from the second metal sheet having a second extended section that extends from the periphery and into the one of the plurality of component portions and are coupled to the one or more conductive vias on each of the first extended sections; and

providing a second substrate layer of the substrate body over the second metallic layer of each of the plurality of metallic structures.

23. A method of manufacturing an electronic module, comprising:

providing a substrate within the electronic module, the substrate having;

a component portion wherein the component portion includes a component area on a surface of the substrate, and

a plurality of metallic layers that extend along a periphery of the component portion wherein the plurality of metallic layers are coupled to one another;

providing an electronic component on the component area;

providing an overmold over the surface to cover the component area;

forming an opening through at least the overmold that exposes at least a section of one of the plurality of metallic layers along the periphery of the component portion; and

applying an electromagnetic shield material over the overmold and within the opening to form an electromagnetic shield over the component area that is coupled to at least the section of the one of the plurality of metallic layers.