Blister pack content usage monitoring

• US 8,960,440 B1
• Filed: 12/27/2013
• Issued: 02/24/2015
• Est. Priority Date: 12/27/2013
• Status: Active Grant

• Current Assignee: Intelligent Devices SEZC Inc.
• Original Assignee: VeriMed Holdings, LLC
• Inventors: Kronberg, James W.
• Primary Examiner(s): BLOUNT, ERIC
• Application Number:
  US14/141,599
• Time in Patent Office: 424 Days
• Field of Search: 340/540, 340/539.12, 340/568.1, 340/568.2, 340/571, 340/635, 340/636.15, 340/652, 206/531, 206/534, 206/528, 206/538
• US Class Current: 206/531
• CPC Class Codes: A61J 1/035 Blister-type containers blisters in general B65D75/36
• CPC Class Codes: A61J 2200/30 Compliance analysis for taking medication

Abstract

A system is provided for monitoring the removal of blister pack contents. An array of spatially-extended, electrically parallel breakable traces made from electrically resistive material is formed behind a corresponding array of blisters of a blister card. Then this array is connected in series with a reference resistor to form a voltage divider. All resistive traces are formed from the same materials in a single operation. Blister breakage is determined using changes in the ratio of the resistances of the array and the divider. A predictive algorithm is used to adjust the threshold resistance ratio change that signals blister breakage and voltage ratios are used to adjust for battery output changes over time. Breakage events and their time of occurrence are recorded in nonvolatile memory for later retrieval. Additional resistors can be used for activating the system and detecting tampering.

Claims

1. A blister pack for dispensing medication and the like, comprising:

(a) a blister card having plural blisters, said blister card including a sheet of plastic having said plural blisters formed therein and a backing applied to said sheet of plastic, said backing enclosing each blister of said blisters;

(b) an electronics module carried by said blister card, said electronics module including a microcontroller for receiving and generating data and a memory for storing said data;

(c) plural breakable resistive traces, one breakable resistive trace of said plural breakable resistive traces being applied to said backing behind each blister of said plural blisters, each breakable resistance trace of said plural breakable resistance traces being spatially extended;

(d) a reference resistance trace applied to said backing;

(e) conductive traces applied to said backing to connect in parallel said each breakable resistance trace with each other breakable resistance trace of said plural breakable resistance traces, to connect in series said reference resistance trace with said plural breakable resistance traces, and to connect in series said electronics module with said reference resistance trace and with said plural breakable resistance traces; and

(f) a power source for providing electrical power to said electronics module, said microcontroller of said electronics module using said electric power to apply a voltage across said reference resistance trace and said plural breakable resistance traces to detect breakage of said each breakable resistance trace,

wherein said microcontroller is configured to detect breakage of said each breakable resistance trace from changes measured in resistance of said plural breakable resistance traces and from changes measured in the ratio of resistance of said plural breakable resistance traces with respect to resistance of said reference resistance trace.

2. The blister pack as recited in claim 1, wherein said microcontroller is configured to detect said changes in said resistance of said plural breakable resistance traces based on measured voltage across unbroken breakable resistance traces of said plural breakable resistance traces.

3. The blister pack as recited in claim 2, wherein said microcontroller is programmed to calculate a voltage threshold based on said measured voltage, the number of said unbroken breakable resistance traces and said ratio of resistance of said plural breakable resistance traces with respect to said resistance of said reference resistance trace.

4. The blister pack as recited in claim 3, wherein said microcontroller is programmed to calculate said voltage threshold mid-way between a voltage across said unbroken breakable resistance traces and a voltage across one breakable resistance trace less than said unbroken breakable resistance traces.

5. The blister pack as recited in claim 2, wherein said measured voltage is recorded in said memory.

6. The blister pack as recited in claim 1, wherein said each breakable resistance trace is principally oriented in the same direction as each other breakable resistance trace of said plural breakable resistance traces.

7. The blister pack as recited in claim 1, wherein said memory is non-volatile memory and said power source is a battery, and wherein said microcontroller is programmed to have a sleep mode and to cycle on and off said sleep mode, detecting breakage of said each breakable resistance trace when cycled on and being in sleep mode when cycled off.

8. The blister pack as recited in claim 7, wherein when said microcontroller cycles on, said microcontroller makes plural measurements of changes in voltage across said plural breakable resistance traces during each cycle, averaging said plural measurements of voltage to avoid electric noise artifacts.

9. The blister pack as recited in claim 7, wherein said microprocessor increments a count of said cycles and stores said count of said cycles in memory in associated with a detection of breakage of each breakable resistance trace.

10. The blister pack as recited in claim 1, further comprising a start resistance trace in electrical series with said reference resistance trace, wherein breach of said start resistance trace activates said electronic module.

11. The blister pack as recited in claim 10, wherein time associated with detection of breaking said each breakable resistance trace is accumulated upon breaking said start resistance trace.

12. The blister pack as recited in claim 1, further comprising a tampering resistance trace in electrical connection with said electronics module, wherein breach of said tampering resistance trace causes said microcontroller to generate an alarm message.

13. The blister pack as recited in claim 12, wherein said blister card has a rim and wherein said tampering resistance trace runs around said rim of said blister card.

14. The blister pack as recited in claim 12, wherein said microprocessor enters said alarm message in said memory.

15. The blister pack as recited in claim 12 wherein said tampering resistance trace is connected electrically in parallel with said plural breakable resistance traces.

16. The blister pack as recited in claim 13, wherein said tampering resistance trace has a resistance greater than said resistance of said each breakable resistance trace.

17. The blister pack as recited in claim 1, wherein said plural breakable resistance traces and said reference resistance trace are made of an electrically resistive material and said conductive traces are made of an electrically conductive material wherein the electrical resistance of said resistive material is at least an order of magnitude higher than the resistance of said conductive material.

18. The blister pack as recited in claim 1, wherein said plural breakable resistance traces are made of a resistive material having a first thickness and said conductive traces are made of said resistive material in a second thickness greater than said first thickness so that the resistance of said conductive material is lower than said resistance of said plural resistive traces.

19. The blister pack as recited in claim 1, wherein said plural breakable resistance traces are made of a first material and said conductive traces are made of a second material, said second material being made of both low and high resistance materials so that the effective resistance of said second material is lower than said resistance of said first material by at least an order of magnitude.

20. The blister pack as recited in claim 1, wherein said conductive traces are made of a layer of conductive foil stamped onto said backing and a layer of said resistive material.

21. A blister pack for dispensing medication, comprising:

(a) a blister card having plural blisters, said blister card including a sheet of plastic having said plural blisters formed therein and a backing applied to said sheet of plastic, said backing enclosing each blister of said blisters;

(b) an electronics module carried by said blister card, said electronics module including a microcontroller for receiving and generating data and a memory for storing said data;

(c) plural breakable resistive traces, one breakable resistive trace of said plural breakable resistive traces being applied to said backing behind said each blister of said plural blisters, each breakable resistance trace of said plural breakable resistance traces being spatially extended;

(d) a reference resistance trace applied to said backing;

(e) conductive traces applied to said backing to connect in parallel said each breakable resistance trace with each other breakable resistance trace of said plural breakable resistance traces, to connect in series said reference resistance trace with said plural breakable resistance traces, and to connect in series said electronics module with said reference resistance trace and with said plural breakable resistance traces; and

(f) a power source for providing electrical power to said electronics module, said microcontroller of said electronics module using said electric power to apply a voltage across said reference resistance trace and said plural breakable resistance traces to detect breakage of said each breakable resistance trace,

wherein said each breakable resistance trace is principally oriented in the same direction as each other breakable resistance trace of said plural breakable resistance traces.

22. A blister pack for dispensing medication, comprising:

(a) a blister card having plural blisters, said blister card including a sheet of plastic having said plural blisters formed therein and a backing applied to said sheet of plastic, said backing enclosing each blister of said blisters;

(b) an electronics module carried by said blister card, said electronics module including a microcontroller for receiving and generating data and a memory for storing said data;

(c) plural breakable resistive traces, one breakable resistive trace of said plural breakable resistive traces being applied to said backing behind said each blister of said plural blisters, each breakable resistance trace of said plural breakable resistance traces being spatially extended;

(d) a reference resistance trace applied to said backing;

(e) conductive traces applied to said backing to connect in parallel said each breakable resistance trace with each other breakable resistance trace of said plural breakable resistance traces, to connect in series said reference resistance trace with said plural breakable resistance traces, and to connect in series said electronics module with said reference resistance trace and with said plural breakable resistance traces; and

(f) a power source for providing electrical power to said electronics module, said microcontroller of said electronics module using said electric power to apply a voltage across said reference resistance trace and said plural breakable resistance traces to detect breakage of said each breakable resistance trace,

wherein said memory is non-volatile memory and said power source is a battery, and wherein said microcontroller is programmed to have a sleep mode and to cycle on and off said sleep mode, detecting breakage of said each breakable resistance trace when cycled on and being in sleep mode when cycled off.

23. The blister pack as recited in claim 22, wherein when said microcontroller cycles on, said microcontroller makes plural measurements of changes in voltage across said plural breakable resistance traces during each cycle, averaging said plural measurements of voltage to avoid electric noise artifacts.

24. The blister pack as recited in claim 22, wherein said microprocessor increments a count of said cycles and stores said count of said cycles in memory in associated with a detection of breakage of each breakable resistance trace.

25. A blister pack for dispensing medication, comprising:

(a) a blister card having plural blisters, said blister card including a sheet of plastic having said plural blisters formed therein and a backing applied to said sheet of plastic, said backing enclosing each blister of said blisters;

(b) an electronics module carried by said blister card, said electronics module including a microcontroller for receiving and generating data and a memory for storing said data;

(c) plural breakable resistive traces, one breakable resistive trace of said plural breakable resistive traces being applied to said backing behind said each blister of said plural blisters, each breakable resistance trace of said plural breakable resistance traces being spatially extended;

(d) a reference resistance trace applied to said backing;

(e) conductive traces applied to said backing to connect in parallel said each breakable resistance trace with each other breakable resistance trace of said plural breakable resistance traces, to connect in series said reference resistance trace with said plural breakable resistance traces, and to connect in series said electronics module with said reference resistance trace and with said plural breakable resistance traces;

(f) a power source for providing electrical power to said electronics module, said microcontroller of said electronics module using said electric power to apply a voltage across said reference resistance trace and said plural breakable resistance traces to detect breakage of said each breakable resistance trace; and

(g) a start resistance trace in electrical series with said reference resistance trace, wherein breach of said start resistance trace activates said electronic module.

26. The blister pack of claim 25, wherein time associated with detection of breaking said each breakable resistance trace is accumulated upon breaking said start resistance trace.

27. A blister pack for dispensing medication, comprising:

(a) a blister card having plural blisters, said blister card including a sheet of plastic having said plural blisters formed therein and a backing applied to said sheet of plastic, said backing enclosing each blister of said blisters;

(b) an electronics module carried by said blister card, said electronics module including a microcontroller for receiving and generating data and a memory for storing said data;

(c) plural breakable resistive traces, one breakable resistive trace of said plural breakable resistive traces being applied to said backing behind said each blister of said plural blisters, each breakable resistance trace of said plural breakable resistance traces being spatially extended;

(d) a reference resistance trace applied to said backing;

(e) conductive traces applied to said backing to connect in parallel said each breakable resistance trace with each other breakable resistance trace of said plural breakable resistance traces, to connect in series said reference resistance trace with said plural breakable resistance traces, and to connect in series said electronics module with said reference resistance trace and with said plural breakable resistance traces;

(f) a power source for providing electrical power to said electronics module, said microcontroller of said electronics module using said electric power to apply a voltage across said reference resistance trace and said plural breakable resistance traces to detect breakage of said each breakable resistance trace; and

(g) a tampering resistance trace in electrical connection with said electronics module, wherein breach of said tampering resistance trace causes said microcontroller to generate an alarm message.

28. The blister pack as recited in claim 27, wherein said blister card has a rim and wherein said tampering resistance trace runs around said rim of said blister card.

29. The blister pack as recited in claim 27, wherein said microprocessor enters said alarm message in said memory.

30. The blister pack as recited in claim 27 wherein said tampering resistance trace is connected electrically in parallel with said plural breakable resistance traces.

31. The blister pack as recited in claim 28, wherein said tampering resistance trace has a resistance greater than said resistance of said each breakable resistance trace.

32. A blister pack for dispensing medication, comprising:

(a) a blister card having plural blisters, said blister card including a sheet of plastic having said plural blisters formed therein and a backing applied to said sheet of plastic, said backing enclosing each blister of said blisters;

(b) an electronics module carried by said blister card, said electronics module including a microcontroller for receiving and generating data and a memory for storing said data;

(c) plural breakable resistive traces, one breakable resistive trace of said plural breakable resistive traces being applied to said backing behind said each blister of said plural blisters, each breakable resistance trace of said plural breakable resistance traces being spatially extended;

(d) a reference resistance trace applied to said backing;

(e) conductive traces applied to said backing to connect in parallel said each breakable resistance trace with each other breakable resistance trace of said plural breakable resistance traces, to connect in series said reference resistance trace with said plural breakable resistance traces, and to connect in series said electronics module with said reference resistance trace and with said plural breakable resistance traces; and

(f) a power source for providing electrical power to said electronics module, said microcontroller of said electronics module using said electric power to apply a voltage across said reference resistance trace and said plural breakable resistance traces to detect breakage of said each breakable resistance trace,

wherein said plural breakable resistance traces and said reference resistance trace are made of an electrically resistive material and said conductive traces are made of an electrically conductive material wherein the electrical resistance of said resistive material is at least an order of magnitude higher than the resistance of said conductive material.

33. A blister pack for dispensing medication, comprising:

(a) a blister card having plural blisters, said blister card including a sheet of plastic having said plural blisters formed therein and a backing applied to said sheet of plastic, said backing enclosing each blister of said blisters;

(b) an electronics module carried by said blister card, said electronics module including a microcontroller for receiving and generating data and a memory for storing said data;

(c) plural breakable resistive traces, one breakable resistive trace of said plural breakable resistive traces being applied to said backing behind said each blister of said plural blisters, each breakable resistance trace of said plural breakable resistance traces being spatially extended;

(d) a reference resistance trace applied to said backing;

(e) conductive traces applied to said backing to connect in parallel said each breakable resistance trace with each other breakable resistance trace of said plural breakable resistance traces, to connect in series said reference resistance trace with said plural breakable resistance traces, and to connect in series said electronics module with said reference resistance trace and with said plural breakable resistance traces; and

(f) a power source for providing electrical power to said electronics module, said microcontroller of said electronics module using said electric power to apply a voltage across said reference resistance trace and said plural breakable resistance traces to detect breakage of said each breakable resistance trace,

wherein said plural breakable resistance traces are made of a resistive material having a first thickness and said conductive traces are made of said resistive material in a second thickness greater than said first thickness so that the resistance of said conductive material is lower than said resistance of said plural resistive traces.

34. A blister pack for dispensing medication, comprising:

(a) a blister card having plural blisters, said blister card including a sheet of plastic having said plural blisters formed therein and a backing applied to said sheet of plastic, said backing enclosing each blister of said blisters;

(b) an electronics module carried by said blister card, said electronics module including a microcontroller for receiving and generating data and a memory for storing said data;

(c) plural breakable resistive traces, one breakable resistive trace of said plural breakable resistive traces being applied to said backing behind said each blister of said plural blisters, each breakable resistance trace of said plural breakable resistance traces being spatially extended;

(d) a reference resistance trace applied to said backing;

(e) conductive traces applied to said backing to connect in parallel said each breakable resistance trace with each other breakable resistance trace of said plural breakable resistance traces, to connect in series said reference resistance trace with said plural breakable resistance traces, and to connect in series said electronics module with said reference resistance trace and with said plural breakable resistance traces; and

(f) a power source for providing electrical power to said electronics module, said microcontroller of said electronics module using said electric power to apply a voltage across said reference resistance trace and said plural breakable resistance traces to detect breakage of said each breakable resistance trace,

wherein said conductive traces are made of a layer of conductive foil stamped onto said backing and a layer of said resistive material.