Wafer storing container

• US 8,960,442 B2
• Filed: 11/08/2011
• Issued: 02/24/2015
• Est. Priority Date: 11/08/2011
• Status: Active Grant

• Current Assignee: Miraial Company Limited, Shin-Etsu Polymer Company Limited (Shin-Etsu Chemical Company Limited)
• Original Assignee: Miraial Company Limited, Shin-Etsu Polymer Company Limited (Shin-Etsu Chemical Company Limited)
• Inventors: Oyama, Takaharu, Matsutori, Chiaki, Nagashima, Tsuyoshi, Inoue, Shuichi, Shida, Hiroyuki, Yamagishi, Hiroki, Onuki, Kazumasa
• Primary Examiner(s): Ackun, Jacob K
• Application Number:
  US14/356,852
• Publication Number:
  US 20140367307A1
• Time in Patent Office: 1,204 Days
• Field of Search: 206/710, 206/711, 206/454, 206/449, 206/832, 211/41.14, 211/41.18, 414/938, 414/941
• US Class Current: 206/711
• CPC Class Codes: H01L 21/67383 characterised by substrate supports
• CPC Class Codes: H01L 21/67386 characterised by the construction of the closed carrier
• CPC Class Codes: Y10S 206/832 Semiconductor wafer boat

Abstract

Wafer support shelves (10, 10) are each provided with wafer support projections (A, B1, B2) on which parts of the outer margins of a semiconductor wafer (W) are to be placed. In each case, one of the support projections (A, B1, B2) is provided on the far side of the center position of the semiconductor wafer (W), and two of the support projections are provided on the near side of the center of the semiconductor wafer. By means of this structure, in a state in which a lid body (3) is not attached to a wafer extraction/insertion opening (2), the flexure amount of the semiconductor wafers placed on the support projections of multiple locations in the wafer support shelves can be reduced with a minimal number of projections, so that a hindrance is not created to an operation such as extraction by a robot arm.

Claims

1. A wafer storing container, comprising:

a container body for storing a plurality of semiconductor wafers in a state of being arranged in a parallel manner;

a wafer load/unload opening that is formed in a front face of the container body for the purpose of loading or unloading the semiconductor wafer to or from the container body;

a cover removably attached from a front of the wafer load/unload opening for the purpose of closing the wafer load/unload opening; and

wafer support shelves for individually mounting outer margins of the plurality of semiconductor wafers so as to horizontally support the semiconductor wafers at positions on right and left sides inside the container body as viewed from the wafer load/unload opening, in a state where the cover is not attached to the wafer load/unload opening,

wherein the outer margins of the plurality of semiconductor wafers are partially mounted on wafer support projections of the wafer support shelves arranged on the right and left sides as viewed from the wafer load/unload opening,

wherein the wafer support projections are provided at one point on a back side and at two points on a front side in each of the right and left sides, on the basis of a central position of the semiconductor wafers as viewed from the wafer load/unload opening

wherein, among the front-side wafer support projections provided at two points in each of the right and left sides, second front-side wafer support projections farther from a reference center line are each provided in a direction at an angle within a range of 45±

15 degrees relative to the reference center line, which passes through the central position of the semiconductor wafers, and is parallel to the wafer load/unload opening,

wherein, among the front-side wafer support projections provided at two points in each of the right and left sides on the front side on the basis of the central position of the semiconductor wafers, first front-side wafer support projections closer to the reference center line are each provided in a direction at an angle within a range of 20±

5 degrees relative to the reference center line, and

wherein the first and second front-side wafer support projections have a relative positional relationship with each other at different angles within a range of 10 to 30 degrees around the central position of the semiconductor wafers.

2. The wafer storing container according to claim 1,

wherein, in a state where the semiconductor wafers are supported by the wafer support shelves, the semiconductor wafers are in a state of concurrently being in contact with and being mounted on the first and second front-side wafer support projections.

3. The wafer storing container according to claim 2,

wherein the second front-side wafer support projections are provided in a position lower than a position of the first front-side wafer support projections, within a range of 0.2 mm.

4. The wafer storing container according to claim 1,

wherein the back-side wafer support projections provided at one point in each of the right and left sides are provided at a position lower than any of the front-side wafer support

projections provided at two points in each of the right and left sides.