Assembling thin silicon chips on a contact lens
First Claim
1. A method for manufacturing a contact lens having an integrated circuit, comprising:
- creating a plurality of chip contact pads on a chip by forming a grid of metal lines on a surface of the chip, wherein the chip contact pads correspond to intersection points of the metal lines in the grid;
applying assembly bonding material to each of a plurality of lens contact pads formed on a lens substrate, wherein the assembly bonding material includes an anisotropic conductive material;
bonding the plurality of chip contact pads to the plurality of lens contact pads via the assembly bonding material to bond the chip to the lens substrate; and
embedding the lens substrate and the chip bonded thereon into a contact lens material to form the contact lens.
3 Assignments
0 Petitions
Accused Products
Abstract
A contact lens having a thin silicon chip integrated therein is provided along with methods for assembling the silicon chip within the contact lens. In an aspect, a method includes creating a plurality of lens contact pads on a lens substrate and creating a plurality of chip contact pads on a chip. The method further involves applying assembly bonding material to the each of the plurality of lens contact pads or chip contact pads, aligning the plurality of lens contact pads with the plurality of chip contact pads, bonding the chip to the lens substrate via the assembly bonding material using flip chip bonding, and forming a contact lens with the lens substrate.
177 Citations
21 Claims
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1. A method for manufacturing a contact lens having an integrated circuit, comprising:
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creating a plurality of chip contact pads on a chip by forming a grid of metal lines on a surface of the chip, wherein the chip contact pads correspond to intersection points of the metal lines in the grid; applying assembly bonding material to each of a plurality of lens contact pads formed on a lens substrate, wherein the assembly bonding material includes an anisotropic conductive material; bonding the plurality of chip contact pads to the plurality of lens contact pads via the assembly bonding material to bond the chip to the lens substrate; and embedding the lens substrate and the chip bonded thereon into a contact lens material to form the contact lens. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A contact lens having an integrated circuit disposed thereon or therein formed by a process comprising the steps of:
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creating a plurality of chip contact pads on a chip by forming a grid of metal lines on a surface of the chip, wherein the chip contact pads correspond to intersection points of the metal lines in the grid; applying assembly bonding material to each of the plurality of chip contact pads, wherein the assembly bonding material includes an anisotropic conductive material; bonding the plurality of the chip contact pads to a plurality of lens contact pads formed on a lens substrate via the assembly bonding material to bond the chip to the lens substrate; and embedding the lens substrate having the chip bonded thereon into a contact lens material to form the contact lens. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A method for manufacturing a contact lens having an integrated circuit, comprising:
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creating a plurality of lens contact pads on a lens substrate; creating a plurality of chip contact pads on a chip, wherein the plurality of chip contact pads corresponding to intersection points of a grid of metal lines on the chip; applying assembly bonding material to the each of the plurality of lens contact pads or chip contact pads, wherein the assembly bonding material includes an anisotropic conductive material; aligning the plurality of lens contact pads with the plurality of chip contact pads; bonding the chip to the lens substrate via the assembly bonding material using flip chip bonding; and forming a contact lens with the lens substrate. - View Dependent Claims (16, 17, 18, 19, 20, 21)
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Specification