Thermal dissipation structure for light emitting diode
First Claim
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1. An apparatus comprising:
- an array of light emitting diodes (LEDs), wherein the array of LEDs has one or more electrical contacts through which power is supplied to the one or more LEDs;
one or more thermal pads, each thermal pad being disposed beneath one or more LEDs of the array of LEDs and thermally coupled to the one or more LEDs, wherein the one or more electrical contacts are located on a same side of the array of LEDs as the one or more thermal pads;
a heat conductor disposed beneath and thermally coupled to the one or more thermal pads at one or more protrusions of the heat conductor; and
a flexible printed circuit electrically coupled to the one or more electrical contacts,wherein the apparatus further comprises resin between the LEDs and the heat conductor for high-voltage tracking isolation between the one or more thermal pads and the one or more electrical contacts of the LEDs, wherein the one or more protrusions space the heat conductor apart from the one or more electrical contacts of the LEDs for the resin to fill in.
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Abstract
The tunable color mixing system includes a mixing barrel that captures light from multiple light emitting diodes emitting at different colors, mixes the light, and outputs the light with a narrow beam angle from a small area. The array of LEDs in the system is thermally coupled to a heat conductor via thermal pads. A flexible printed circuit is electrically connected to the LEDs to supply and fine-tune the electrical power. The array includes LEDs of at least three emitting colors to achieve an output light having a high color rendering index, tunable to a wide range of correlated color temperatures.
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Citations
31 Claims
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1. An apparatus comprising:
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an array of light emitting diodes (LEDs), wherein the array of LEDs has one or more electrical contacts through which power is supplied to the one or more LEDs; one or more thermal pads, each thermal pad being disposed beneath one or more LEDs of the array of LEDs and thermally coupled to the one or more LEDs, wherein the one or more electrical contacts are located on a same side of the array of LEDs as the one or more thermal pads; a heat conductor disposed beneath and thermally coupled to the one or more thermal pads at one or more protrusions of the heat conductor; and a flexible printed circuit electrically coupled to the one or more electrical contacts, wherein the apparatus further comprises resin between the LEDs and the heat conductor for high-voltage tracking isolation between the one or more thermal pads and the one or more electrical contacts of the LEDs, wherein the one or more protrusions space the heat conductor apart from the one or more electrical contacts of the LEDs for the resin to fill in. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. An apparatus comprising:
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an array of light emitting diodes (LEDs), wherein the array of LEDs has one or more electrical contacts through which power is supplied to the one or more LEDs; a plurality of thermal pads, each thermal pad thermally coupled to a non-emitting surface of the one or more LEDs, wherein the one or more electrical contacts are located on a same side of the array of LEDs as the plurality of thermal pads; a heat conductor thermally coupled to the plurality of thermal pads, wherein the one or more electrical contacts are spaced apart from the heat conductor; and a flexible printed circuit electrically coupled to each LED of the plurality of LEDs via the one or more electrical contacts, wherein the apparatus further comprises resin between the LEDs and the heat conductor for high-voltage tracking isolation between the one or more thermal pads and the one or more electrical contacts of the LEDs, wherein the one or more protrusions space the heat conductor apart from the one or more electrical contacts of the LEDs for the resin to fill in. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23)
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24. A method comprising:
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thermally coupling an array of light emitting diodes (LEDs) to a plurality of thermal pads, wherein each thermal pad is disposed beneath one or more LEDs of the array of LEDs and thermally coupled to said one or more LEDs, wherein the array of LEDs has one or more electrical contacts through which power is supplied to the one or more LEDs, and further wherein the one or more electrical contacts are located on a same side of the array of LEDs as the plurality of thermal pads; thermally coupling a heat conductor disposed beneath the plurality of thermal pads at one or more protrusions of the heat conductor, each of the one or more protrusions protruding away from a surface of the heat conductor that is spaced apart from the one or more electrical contacts; and electrically coupling a flexible printed circuit to each LED of the plurality of LEDs via the one or more electrical contacts, wherein the thermal and electrical couplings do not interfere with light emitted by the LEDs. - View Dependent Claims (25, 26, 27, 28, 29, 30, 31)
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Specification