Silicon pen nanolithography

• US 8,961,853 B2
• Filed: 06/04/2010
• Issued: 02/24/2015
• Est. Priority Date: 06/05/2009
• Status: Expired due to Fees

• Current Assignee: Northwestern University
• Original Assignee: Northwestern University
• Inventors: Mirkin, Chad A., Shim, Wooyoung, Braunschweig, Adam B., Liao, Xing, Chai, Jinan, Lim, Jong Kuk, Zheng, Gengfeng, Zheng, Zijian
• Primary Examiner(s): Davis, Robert B
• Application Number:
  US13/375,361
• Publication Number:
  US 20120167262A1
• Time in Patent Office: 1,726 Days
• Field of Search: 425/385, 850/59, 850/60, 977/732, 346/140.1, 118/667, 101/32, 216/16, 264/293
• US Class Current: 264/293
• CPC Class Codes: B81B 2203/0361 Tips, pillars
• CPC Class Codes: B81B 2207/056 of static structures
• CPC Class Codes: B81C 1/00111 Tips, pillars, i.e. raised structures microneedles A61M37/0015
• CPC Class Codes: B81C 1/0046 using stamping, e.g. imprinting nanoimprinting for making etch masks G03F7/0002
• CPC Class Codes: B81C 2201/0154 other processes for film patterning not provided for in B81C2201/0149 - B81C2201/015
• CPC Class Codes: B81C 2201/0185 Printing, e.g. microcontact printing
• CPC Class Codes: B82Y 10/00 Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
• CPC Class Codes: B82Y 40/00 Manufacture or treatment of nanostructures
• CPC Class Codes: G03F 7/0002 Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
• CPC Class Codes: Y10S 977/732 Nanocantilever

Abstract

Disclosed are methods of lithography using a tip array having a plurality of pens attached to a backing layer, where the tips can comprise a metal, metalloid, and/or semi-conducting material, and the backing layer can comprise an elastomeric polymer. The tip array can be used to perform a lithography process in which the tips are coated with an ink (e.g., a patterning composition) that is deposited onto a substrate upon contact of the tip with the substrate surface. The tips can be easily leveled onto a substrate and the leveling can be monitored optically by a change in light reflection of the backing layer and/or near the vicinity of the tips upon contact of the tip to the substrate surface.

Claims

1. A tip array comprising a plurality of tips fixed to an elastomeric backing layer, the tips comprising a metal, a metalloid, a semi-conducting material, or a combination thereof, and each tip having a radius of curvature of less than 100 nm.

2. The tip array of claim 1, wherein the backing layer is at least translucent.

3. The tip array of claim 1, wherein the backing layer comprises an elastomeric polymer.

4. The tip array of claim 1, wherein the tips are pyramidal.

5. The tip array of claim 1, further comprising an adhesion-enhancing layer between the tips and the backing layer, optionally comprising silicon dioxide.

6. The tip array of claim 1, wherein the tips have a radius of curvature of less than 50 nm.

7. The tip array of claim 1, wherein the tips have a height of less than 100 μ

m.

8. The tip array of claim 1, wherein the tips and backing layer have a combined thickness of less than 1 mm.

9. The tip array of claim 1, further comprising a rigid support to which the backing layer is adhered, the rigid support disposed opposite the tips of the tip array and parallel to the backing layer.

10. The tip array of claim 1, further comprising a coating on the exposed surfaces of the tips and the surface of the backing layer adjacent to the tips.

11. The tip array of claim 1, wherein the tips comprise silicon, silicon nitride, gallium, gallium nitride, gallium sulfide, gallium arsenide, or a mixture thereof.

12. A method for sub-micron scale patterning of a substrate surface, comprising:

contacting the substrate surface with all or substantially all of the tips of a tip array of claim 1 to form a pattern on the substrate surface, wherein the patterning comprises one or more processes selected from the group consisting of depositing ink, indenting the surface, puncturing the surface, cutting the surface, etching the surface, oxidizing the surface, desorbing a material from the surface, or combinations thereof.

13. The method of claim 12, further comprising selecting an at least translucent backing layer material for the tip array and illuminating the tip array with incident light, wherein contacting the substrate surface comprises bringing the tip array and substrate surface towards each other until there is a change in reflection of the incident light from the backing layer above all or substantially all of the tips, the change in reflected light being indicative of contact between tip and substrate surface.

14. The method of claim 13, wherein the contacting of the tip to the substrate surface is indicated in the absence of a laser feedback.

15. The method of claim 12, comprising contacting each tip of the tip array with the substrate surface.

16. The method of claim 12, further comprising coating exposed surfaces of the tips of the tips array with a patterning composition, and the contacting comprising depositing the patterning composition onto the substrate surface and forming a substantially uniform first set of indicia with all or substantially all of the coated tips.

17. The method of claim 12, wherein the tip array comprises a conductive coating, further comprising applying a voltage across the tip array to transmit electrical energy through the coated tip to the substrate surface to form indicia on the substrate surface at points of contact of the tip to the substrate surface.

18. The method of claim 12, wherein the patterning forms indicia or indentations having a feature size of less than 70 nm.

19. The method of claim 12, further comprising leveling the tips of the tip array with respect to the substrate surface by selecting an at least translucent material for the backing layer;

backlighting the tip array with incident light to cause internal reflection of the incident light from the internal surfaces of the backing layer, from the back surfaces of the tips, or both;

bringing the tips of the tip array and the substrate surface together along a z-axis up to a point of contact between a subset of the tips with the substrate surface, contact indicated by increased intensity of reflected light from the backing layer proximate to each of a subset of tips in contact with the substrate surface, whereas no change in the intensity of reflected light proximate to other tips indicates non-contacting tips; and

tilting one or both of the tip array and the substrate surface with respect to the other in response to differences in intensity of the reflected light from the internal surfaces of the backing layer, to achieve contact between the substrate surface and non-contacting tips, wherein said tilting is performed one or more times along x-, y-, and/or z-axes.

20. A method of preparing a tip array according to claim 1, comprising

(a) providing a silicon wafer;

(b) adhering an elastomeric backing layer to the silicon wafer to form a structure;

(c) forming a mask pattern over the silicon wafer to form pre-tip regions; and

(d) etching the silicon pre-tip regions and silicon between pre-tip regions with an etching solution to form pyramidal silicon tips attached to the backing layer.

21. A tip array comprising a plurality of tips fixed to an elastomeric backing layer, the tips comprising a metal, a metalloid, a semi-conducting material, or a combination thereof, each tip having a radius of curvature of less than 1 μ

m, the tips comprising silicon, silicon nitride, gallium, gallium nitride, gallium sulfide, gallium arsenide, or a mixture thereof.

22. A tip array comprising a plurality of tips fixed to an elastomeric backing layer, the tips comprising a metal, a metalloid, a semi-conducting material, or a combination thereof, each tip having a radius of curvature of less than 1 μ

m, and the tips and backing layer have a combined thickness of less than 1 mm.

23. A tip array comprising a plurality of tips fixed to an elastomeric backing layer, the tips comprising a metal, a metalloid, a semi-conducting material, or a combination thereof, and a coating on the exposed surfaces of the tips and the surface of the backing layer adjacent to the tips, each tip having a radius of curvature of less than 1 μ

m.