Integrated circuit package and method of making the same

• US 8,963,301 B1
• Filed: 12/27/2013
• Issued: 02/24/2015
• Est. Priority Date: 06/24/1998
• Status: Expired due to Fees

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Glenn, Thomas P.
• Primary Examiner(s): Maldonado, Julio J
• Assistant Examiner(s): BACHNER, ROBERT G
• Application Number:
  US14/142,457
• Time in Patent Office: 424 Days
• Field of Search: 257666-667, 438/121, 438/123, 438/124, 438111-112
• US Class Current: 257/666
• CPC Class Codes: H01L 21/4842 Mechanical treatment, e.g. punching, cutting, deforming, cold welding
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/49503 characterised by the die pad
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 23/49548 Cross section geometry H01L23/49562 takes precedence
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01037 Rubidium [Rb]
• CPC Class Codes: H01L 2924/01039 Yttrium [Y]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01087 Francium [Fr]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: Y10T 29/49121 : Beam lead frame or beam lead device
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49146 : with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49171 : with encapsulating
• CPC Class Codes: Y10T 428/24207 : with strand[s] or strand-portion[s] between layers [e.g., upholstery trim, etc.]

Abstract

Packages for an integrated circuit die and methods and lead frames for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wares, and an encapsulant. The die pad and contacts are located at a lower surface of the package. The die pad and the contacts have side surfaces which include reentrant portions and asperities to engage the encapsulant.

Claims

1. A semiconductor device comprising:

a metal die pad comprising a top planar surface, a bottom planar surface opposite the top planar surface, and at least four sides between the top and bottom planar surfaces;

a semiconductor die coupled to the top planar surface of the metal die pad;

a plurality of metal members, each comprising;

a top surface;

a bottom surface;

a curved side surface; and

a straight side surface opposite the curved side surface; and

an encapsulating material covering at least;

said semiconductor die;

the top planar surface and the at least four sides of said metal die pad; and

the top surface and the curved side surface of each of said plurality of metal members.

2. The semiconductor device of claim 1, wherein each of said plurality of metal members comprises an anchor.

3. The semiconductor device of claim 1, wherein the curved side surface of each of said plurality of metal members is semicircular-shaped.

4. The semiconductor device of claim 1, wherein the curved side surface of each of said plurality of metal members is convex.

5. The semiconductor device of claim 1, wherein for each of said plurality of metal members, the curved side surface faces away from said metal die pad, and the straight side surface faces said metal die pad.

6. The semiconductor device of claim 1, wherein said metal die pad is positioned between a first metal member of said plurality of metal members and a second metal member of said plurality of metal members, and the first and second metal members are symmetric about said metal die pad.

7. The semiconductor device of claim 1, wherein each of said plurality of metal members is connected to said metal die pad by a respective connector.

8. The semiconductor device of claim 1, wherein each of said plurality of metal members comprises a lip extending from the curved side surface.

9. A semiconductor device comprising:

a metal die pad comprising a top planar surface, a bottom planar surface opposite the top planar surface, and at least four sides between the top and bottom planar surfaces;

a semiconductor die coupled to the top planar surface of the metal die pad;

a plurality of metal members, each comprising;

a top surface;

a bottom surface;

a curved side surface; and

a straight side surface; and

an encapsulating material covering at least;

said semiconductor die;

the top planar surface and the at least four sides of said metal die pad; and

the top surface and the curved side surface of each of said plurality of metal members,

wherein the straight side surface of each of said plurality of metal members is exposed by the encapsulating material.

10. The semiconductor device of claim 9, wherein each of said plurality of metal members comprises an anchor.

11. The semiconductor device of claim 9, wherein the straight side surface of each of said plurality of metal members is severed at a side surface of said encapsulating material.

12. The semiconductor device of claim 9, wherein the curved side surface of each of said plurality of metal members is semicircular-shaped.

13. The semiconductor device of claim 9, wherein the curved side surface of each of said plurality of metal members is convex.

14. The semiconductor device of claim 9, wherein each of said plurality of metal members is connected to said metal die pad by a respective connector.

15. The semiconductor device of claim 9, wherein each of said plurality of metal members comprises a lip extending from the curved side surface.

16. A semiconductor device comprising:

a metal die pad comprising a top planar surface, a bottom planar surface opposite the top planar surface, and at least four sides between the top and bottom planar surfaces;

a semiconductor die coupled to the top planar surface of the metal die pad;

a plurality of metal members, each comprising;

a top surface;

a bottom surface;

a first side surface that is curved;

a second side surface that is straight;

a third side surface extending between a first end of the second side surface and the first side surface; and

a fourth side surface extending between a second end of the second side surface and the first side surface; and

an encapsulating material covering at least;

said semiconductor die;

the top planar surface and the at least four sides of said metal die pad; and

the top surface, the first side surface, the third side surface, and the fourth side surface of each of said plurality of metal members,

wherein the second side surface of each of said plurality of metal members is exposed by the encapsulating material.

17. The semiconductor device of claim 16, wherein each of said plurality of metal members comprises an anchor.

18. The semiconductor device of claim 16, wherein the second side surface of each of said plurality of metal members is severed at a side surface of said encapsulating material.

19. The semiconductor device of claim 16, wherein the first side surface of each of said plurality of metal members is semicircular-shaped.

20. The semiconductor device of claim 16, wherein the first side surface of each of said plurality of metal members is convex.

21. The semiconductor device of claim 16, wherein each of said plurality of metal members is connected to said metal die pad by a respective connector.

22. The semiconductor device of claim 16, wherein for each of said plurality of metal members, the third and fourth side surfaces are straight and parallel to each other.

23. The semiconductor device of claim 16, wherein each of said plurality of metal members comprises a lip extending from the first side surface.