Acoustic wave device and method for producing same

• US 8,963,655 B2
• Filed: 11/26/2010
• Issued: 02/24/2015
• Est. Priority Date: 11/27/2009
• Status: Active Grant

• Current Assignee: Kyocera Corporation
• Original Assignee: Kyocera Corporation
• Inventors: Ookubo, Yoshihiro
• Primary Examiner(s): Jones, Stephen E
• Assistant Examiner(s): OUTTEN, SAMUEL S
• Application Number:
  US13/498,815
• Publication Number:
  US 20120182091A1
• Time in Patent Office: 1,551 Days
• Field of Search: 333/193, 333/194, 333/195, 333/196
• US Class Current: 333/193
• CPC Class Codes: B05D 1/38 with intermediate treatment intermediate treatment per se B05D3/00
• CPC Class Codes: B05D 3/12 by mechanical means
• CPC Class Codes: H03H 3/02 for the manufacture of piezoelectric or electrostrictive resonators or networks H03H3/08 takes precedence
• CPC Class Codes: H03H 3/08 for the manufacture of resonators or networks using surface acoustic waves
• CPC Class Codes: H03H 9/02629 of the edges
• CPC Class Codes: H03H 9/10 Mounting in enclosures constructional combinations of enclosure with electromechanical and other electronic elements H03H9/0538
• CPC Class Codes: H03H 9/1071 the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
• CPC Class Codes: H03H 9/171 implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
• CPC Class Codes: H03H 9/25 Constructional features of resonators using surface acoustic waves devices for manipulating acoustic surface waves in general G10K11/36
• CPC Class Codes: Y10T 83/0524 Plural cutting steps

Abstract

An acoustic wave device comprises a substrate and an acoustic wave element on one main surface of the substrate. Side surfaces of the substrate comprises a protruding portion which protrudes out at a side of an another main surface closer than a side with the one main surface side.

Claims

1. An acoustic wave device, comprising:

a substrate;

an acoustic wave element on one main surface of the substrate; and

a cover which is provided on the one main surface, is located at an inner side other than an outer circumference of the substrate, and seals the acoustic wave element,

wherein a side surface of the substrate comprises a protruding portion which protrudes out at a side of an another main surface closer than a side of the one main surface.

2. The acoustic wave device according to claim 1, further comprising:

a resin film which covers the side surface of the substrate at the part at the side of the one main surface other than the protruding portion, abuts against the protruding portion from the side of the one main surface, and is softer than the substrate.

3. The acoustic wave device according to claim 2, wherein the resin film is formed by a novolac-based resin, an epoxy resin, a Biphenol resin, or a Polyimide resin.

4. The acoustic wave device according to claim 2, further comprising a protective film on a third region of the one main surface of the substrate, the third region exposed from the cover, wherein the protective film abuts against the resin film.

5. The acoustic wave device according to claim 1, wherein when the side surface of the substrate is divided in a thickness direction into two regions comprising a first region at the side of the one main surface and a second region at the side of the another main surface, the protruding portion is provided in the second region.

6. The acoustic wave device according to claim 5, wherein the protruding portion is provided along an outer circumference of the another main surface and over the entire outer circumference.

7. The acoustic wave device according to claim 1, wherein the protruding portion is formed tapered to spread more outward toward a position near the another main surface.

8. The acoustic wave device according to claim 2, wherein a side surface of the cover is located at an inner side away from the side surface of the substrate and forms a step with the substrate, and wherein the resin film is provided and straddles the side surface of the cover from the side surface of the substrate and abuts against the step from the side of the one main surface.

9. The acoustic wave device according to claim 1, wherein:

protruding portion and the surface of the protruding portion facing the side direction of the substrate are cut surfaces formed by surfaces cut by a blade.

10. The acoustic wave device according to claim 1, wherein the cover comprises a frame surrounding the acoustic wave element and located at the inner side other than an outer circumference of the substrate.

11. The acoustic wave device according to claim 1, wherein the cover comprises a frame on the one main surface and a lid on the frame, and wherein the frame and the lid are located at the inner side other than an outer circumference of the substrate.

12. The acoustic wave device according to claim 1, wherein the cover comprises a frame on the one main surface and a lid on the frame, and wherein the frame and the lid are formed by a photosensitive resin.

13. The acoustic wave device according to claim 1, further comprising a protective film on a third region of the one main surface of the substrate, the third region exposed from the cover.