System and method for managing cooling airflow for a multiprocessor information handling system
First Claim
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1. An information handling system comprising:
- a chassis;
a motherboard disposed in the chassis, the motherboard having plural processing component connectors operable to accept processing components and heat sink connectors operable to accept heat sinks associated with the processing components;
plural processing components populating less than all of the processing component connectors, the processing components operable to process information;
a fan disposed in the chassis and aligned to provide cooling airflow past the processing components; and
a shroud positioned over one of the processing component connectors unpopulated by a processing component, the shroud having an exterior outer housing and an interior within the outer housing, the interior forming a channel, the channel having an inlet aligned to accept the cooling airflow into the interior and an outlet aligned to direct the cooling airflow that passes over the unpopulated processing component connector in a predetermined manner.
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Abstract
Cooling airflow through an information handling system is redirected at positions of a motherboard having an unpopulated processing component towards positions of the motherboard having processing components. For example, a shroud shaped as a nozzle couples to a heat sink connector of the motherboard to cover an unpopulated CPU socket. The shroud has a nozzle-shaped channel with an inlet accepting cooling airflow and an outlet exhausting the cooling airflow towards a processing component. For instance, the inlet is proximate a cooling fan and the outlet directs the airflow from the cooling fan towards a heat sink associated with RAM populated on the motherboard.
28 Citations
16 Claims
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1. An information handling system comprising:
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a chassis; a motherboard disposed in the chassis, the motherboard having plural processing component connectors operable to accept processing components and heat sink connectors operable to accept heat sinks associated with the processing components; plural processing components populating less than all of the processing component connectors, the processing components operable to process information; a fan disposed in the chassis and aligned to provide cooling airflow past the processing components; and a shroud positioned over one of the processing component connectors unpopulated by a processing component, the shroud having an exterior outer housing and an interior within the outer housing, the interior forming a channel, the channel having an inlet aligned to accept the cooling airflow into the interior and an outlet aligned to direct the cooling airflow that passes over the unpopulated processing component connector in a predetermined manner. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method for managing cooling airflow through an information handling system, the method comprising:
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populating less than all of plural circuit board connectors with processing components; aligning a cooling fan to provide cooling airflow across the connectors; and covering an unpopulated circuit board connector with a shroud, the shroud having a housing forming a channel, the channel having an inlet to accept cooling airflow into the housing and an outlet to direct cooling airflow that passes over the unpopulated circuit board connector in a predetermined manner out of the housing. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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Specification