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Temperature adjusting mechanism and semiconductor manufacturing apparatus using temperature adjusting mechanism

  • US 8,968,512 B2
  • Filed: 06/30/2009
  • Issued: 03/03/2015
  • Est. Priority Date: 07/04/2008
  • Status: Active Grant
First Claim
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1. A temperature adjusting mechanism for controlling a temperature of a dielectric window provided within a semiconductor manufacturing device, the temperature adjusting mechanism comprising:

  • a narrow annular tube positioned alongside an outer surface of a processing device housing a processing object; and

    a two-phase condensable working liquid of vapor and liquid sealed in the narrow annular tube,wherein the narrow annular tube comprises;

    a heat receiving section in which the two-phase condensable working liquid absorbs heat and undergoes phase transition from liquid phase to vapor phase; and

    a heat dissipating section in which the two-phase condensable working liquid releases heat and undergoes phase transition from vapor phase to liquid phase,wherein a cooling channel is provided over at least part of said heat dissipating section,the narrow annular tube and the cooling channel are in separate cooling circuits,a heat medium which is different from the two-phase condensable working liquid is circulated inside the cooling channel, andthe two-phase condensable working liquid inside the heat dissipating section releases heat to the cooling channel, andwherein the narrow annular tube and the cooling channel are provided within a plate-shaped cooling jacket installed above the dielectric window,the cooling channel is provided at a peripheral portion of the plate-shaped cooling jacket, andthe narrow annular tube is extended from a central portion of the plate-shaped cooling jacket to the peripheral portion of the plate-shaped cooling jacket.

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