High threshold voltage NMOS transistors for low power IC technology

• US 8,969,969 B2
• Filed: 03/19/2010
• Issued: 03/03/2015
• Est. Priority Date: 03/20/2009
• Status: Active Grant

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: International Business Machines Corporation
• Inventors: Chan, Victor W. C., Kanike, Narasimhulu, Shang, Huiling, Vidya, Varadarajan, Yuan, Jun, Booth, Roger Allen Jr.
• Primary Examiner(s): Gurley, Lynne
• Assistant Examiner(s): Webb, Vernon P
• Application Number:
  US12/727,312
• Publication Number:
  US 20100237425A1
• Time in Patent Office: 1,810 Days
• Field of Search: 257/369, 257/E21.633, 257/E27.062, 257/370, 257/372, 438/217
• US Class Current: 257/369
• CPC Class Codes: H01L 21/823412 with a particular manufacturing method of the channel structures, e.g. channel implants, halo or pocket implants, or channel materials
• CPC Class Codes: H01L 21/823807 with a particular manufacturing method of the channel structures, e.g. channel implants, halo or pocket implants, or channel materials

Abstract

Transistors exhibiting different electrical characteristics such as different switching threshold voltage or different leakage characteristics are formed on the same chip or wafer by selectively removing a film or layer which can serve as an out-diffusion sink for an impurity region such as a halo implant and out-diffusing an impurity such as boron into the out-diffusion sink, leaving the impurity region substantially intact where the out-diffusion sink has been removed. In forming CMOS integrated circuits, such a process allows substantially optimal design for both low-leakage and low threshold transistors and allows a mask and additional associated processes to be eliminated, particularly where a tensile film is employed to increase electron mobility since the tensile film can be removed from selected NMOS transistors concurrently with removal of the tensile film from PMOS transistors.

Claims

1. An integrated circuit including

a plurality of transistors of benchmark design of a first conductivity type, each said transistor of said benchmark design including a stressed layer or film applying stress on a channel of said transistor of benchmark design to cause increased electron mobility in said channel, said stressed film also causing out-diffusion of impurities from said channel such that no halo implant is formed therein;

and

at least one transistor of a different design of said first conductivity type exhibiting reduced leakage and increased threshold voltage compared with said plurality of transistors of benchmark design, said at least one transistor of a different design having a channel region with a higher concentration of impurities than channels regions of said plurality of transistors of benchmark design, wherein said higher concentration forms a halo implant in said channel region of said at least one transistor of a different design,

wherein a total impurity dose in a channel region of a transistor of said benchmark design and in material adjacent said channel region of said transistor of said benchmark design and a total impurity dose in a channel region of said at least one transistor of said different design are substantially equal but differently distributed such that halo implants are present in said channel region of said at least one transistor of different design but not present in channel regions of said plurality of transistors of said benchmark design, such that a total impurity dose within each channel region of said plurality of transistors of benchmark design is less than said total impurity dose in said channel region of said at least one transistor of said different design and such that a total impurity content of said integrated circuit is substantially equal to the a total impurity content required to form halo implants in all transistors of both said benchmark design and different design.

2. The integrated circuit as recited in claim 1, wherein said transistor of said benchmark design includes said stressed layer or film overlying a portion of a said transistor of benchmark design.

3. The integrated circuit as recited in claim 2, wherein said stressed layer or film is a tensile film.

4. The integrated circuit as recited in claim 3, wherein said tensile film is a tensile nitride film.

5. The integrated circuit as recited in claim 1, wherein said plurality of transistors of said benchmark design have a nominal channel length of 40 nm.

6. The integrated circuit as recited in claim 5, wherein said at least one transistor of said different design exhibiting reduced leakage has a channel length in excess of 40 nm.

7. The integrated circuit as recited in claim 5, wherein said at least one transistor of said different design exhibiting reduced leakage has a nominal channel length of 40 nm.

8. The integrated circuit as recited in claim 1, wherein said plurality of transistors of benchmark design and said at least one transistor of said different design exhibiting reduced leakage are NMOS transistors.

9. The integrated circuit as recited in claim 1, wherein said impurities include boron.

10. The integrated circuit as recited in claim 1, further including

a plurality of transistors of a second conductivity type.