Terminal structure, and semiconductor element and module substrate comprising the same

• US 8,970,037 B2
• Filed: 08/06/2013
• Issued: 03/03/2015
• Est. Priority Date: 08/24/2012
• Status: Active Grant

• Current Assignee: TDK Corporation
• Original Assignee: TDK Corporation
• Inventors: Yoshida, Kenichi, Orikasa, Makoto, Seike, Hideyuki, Horikawa, Yuhei, Abe, Hisayuki
• Primary Examiner(s): Mandala, Victor A
• Application Number:
  US13/960,291
• Publication Number:
  US 20140054769A1
• Time in Patent Office: 574 Days
• Field of Search: 257/737, 257/741, 257/766, 257/781, 257/E23.02, 257/E23.021, 257/E23.026
• US Class Current: 257/737
• CPC Class Codes: H01L 2224/03462 Electroplating
• CPC Class Codes: H01L 2224/0347 using a lift-off mask
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05022 the internal layer being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/05552 in top view
• CPC Class Codes: H01L 2224/05571 the external layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/05655 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/11462 Electroplating
• CPC Class Codes: H01L 2224/11464 Electroless plating
• CPC Class Codes: H01L 2224/1147 using a lift-off mask
• CPC Class Codes: H01L 2224/11849 Reflowing
• CPC Class Codes: H01L 2224/13006 Bump connector larger than the underlying bonding area, e.g. than the under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/13017 being non uniform along the bump connector
• CPC Class Codes: H01L 2224/13022 the bump connector being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/13111 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 24/03 Manufacturing methods
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 24/11 Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art

Abstract

A preferred terminal structure comprises a base material; an electrode formed on the base material; an insulating covering layer formed on the base material and on the electrode and having an opening exposing at least part of the electrode; an under bump metal layer containing Ni, filling the opening on the electrode; and a dome-shaped bump containing Sn and Ti, covering the under bump metal layer, wherein at least part of the under bump metal layer has a portion sandwiched between the external electrode and the insulating covering layer.

Claims

1. A terminal structure comprising:

a base material;

an external electrode formed on the base material;

an insulating covering layer formed on the base material and on the external electrode and having an opening exposing at least part of the external electrode;

an under bump metal layer containing Ni, filling the opening on the external electrode; and

a dome-shaped bump containing Sn, covering the under bump metal layer, wherein

at least part of the under bump metal layer has a portion sandwiched between the external electrode and the insulating covering layer.

2. The terminal structure according to claim 1, wherein the under bump metal layer has a portion sandwiched between the external electrode and the insulating covering layer over an entire outer periphery thereof.

3. The terminal structure according to claim 1, wherein the bump further contains Ti.

4. A semiconductor element comprising the terminal structure according to claim 1.

5. A module substrate comprising the terminal structure according to claim 1.