Light module

• US 8,974,080 B2
• Filed: 09/28/2010
• Issued: 03/10/2015
• Est. Priority Date: 10/12/2009
• Status: Expired due to Fees

• Current Assignee: Molex Incorporated (KOCH Industries Incorporated)
• Original Assignee: Molex Incorporated (KOCH Industries Incorporated)
• Inventors: Zaderej, Victor, McGowan, Daniel B., Nguyen, Dan, Grzegorzewska, Barbara, Picini, Michael
• Primary Examiner(s): Patel, Ashok
• Application Number:
  US13/498,051
• Publication Number:
  US 20130044485A1
• Time in Patent Office: 1,624 Days
• Field of Search: None
• US Class Current: 362/249.02
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 17/005 with keying means, i.e. for enabling the assembling of component parts in distinctive positions, e.g. for preventing wrong mounting
• CPC Class Codes: F21V 17/16 by deformation of parts; Snap action mounting
• CPC Class Codes: F21V 23/06 the elements being coupling devices , e.g. connectors
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/773 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 29/89 Metals
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 33/64 Heat extraction or cooling elements

Abstract

An illumination module is provided that can be inserted into a receptacle with a ramp that includes a wall and may be mounted on a support surface, such as a heat sink, and the illumination module include a cover and an LED assembly rotateably coupled to the cover. The LED assembly seats within the receptacle which causes terminals of the LED assembly to align with contacts on the receptacle. Circuitry is provided in the module that accepts an input voltage and converts the input to a desired driving output. The cover can be rotated relative to the receptacle so as to engage ramps so as to direct the LED assembly into the receptacle. When the LED assembly is attached to the receptacle, the terminals on the LED assembly mate with the contacts on the receptacle.

Claims

1. An illumination system comprising:

a receptacle with first and second contacts, the receptacle mounted on a heat sink that includes a top surface, wherein the receptacle has one of a ramp and a shoulder;

a light emitting diode (“

LED”

) assembly comprising a frame, a LED array supported by the frame, a heat spreader with an upper and a lower surface, the upper surface in thermal communication with the LED array and supported by the frame;

circuitry configured to receive an input voltage of not more than 24 volts and convert such input voltage into a desired DC voltage;

first and second terminals supported by the frame, the first and second terminals coupled to the circuitry so as to provide an input power source, the first and second terminals configured to respectively engage the first and second contacts; and

a cover rotatably coupled to the LED assembly, the cover having the other of the ramp and the shoulder, wherein, when the cover is rotated, the shoulder and ramp engage each other and cause the cover to translate vertically and the vertical translation of the cover causes the heat spreader to translate vertically, wherein the heat spreader is configured to translate vertically without rotation so that the heat spreader is thermally coupled to the top surface.

2. The illumination system of claim 1, wherein the circuitry is configured to receive AC voltage.

3. The illumination system of claim 2, further including a thermal pad provided on a lower surface of the heat spreader.

4. The illumination system of claim 3, wherein the thermal pad is compliant.

5. The illumination system of claim 4, wherein a thermal resistance between the LED array and the heat spreader is less than 3 K/W.

6. The illumination system of claim 5, wherein the module has a thermal resistance between the LED array and the top surface that is less than 5 K/W.

7. The illumination system of claim 6, further comprising a biasing element positioned between the cover and the frame, the biasing element configured to urge the frame and heat spreader toward the top surface when the cover is rotatably translated.

8. The illumination system of claim 7, wherein the cover includes a circular base wall with a plurality of projections extending therefore.

9. The illumination system of claim 8, wherein the thermal resistance between the top surface and the LED array is less than 3 K/W.

10. The illumination system of claim 9, wherein the thermal pad has a thickness of less than one mm.

11. The illumination system of claim 10, wherein the heat spreader is formed of material that has a thermal conductivity greater than 50 W/m-K.

12. The illumination system of claim 11, wherein the heat spreader is formed of material that has a thermal conductivity greater than 100 W/m-K.

13. The illumination system of claim 12, wherein the circuitry is configured to receive 12 volt AC.

14. The illumination system of claim 13, wherein the circuitry is configured to receive 12 volt DC.

15. The illumination system of claim 14, wherein the receptacle supports 4 contacts and the frame support four terminals, the terminals and contacts configured to engage each other when the frame is seated in the receptacle.

16. An illumination system comprising:

a receptacle with first and second contacts, the receptacle mounted on a heat sink that includes a top surface, wherein the receptacle has one of a ramp and a shoulder;

a light emitting diode (“

LED”

) assembly comprising a frame, a LED array supported by the frame, a heat spreader with an upper and a lower surface, the upper surface in thermal communication with the LED array and supported by the frame;

circuitry positioned in the LED assembly that is configured to receive an AC input voltage and power the LED array;

first and second terminals supported by the frame, the first and second terminals coupled to the circuitry so as to provide an input power source, the first and second terminals configured to respectively engage the first and second contacts; and

a cover rotatably coupled to the LED assembly, the cover having another of the ramp and the shoulder, wherein, when the cover is rotated, the shoulder and ramp engage each other and cause the cover to translate vertically and the vertical translation of the cover causes the heat spreader to translate vertically, wherein the heat spreader is configured to translate without rotation so that the heat spreader is thermally coupled to the top surface.

17. The illumination system of claim 16, wherein the further including a thermal pad provided on a lower surface of the heat spreader.

18. The illumination system of claim 17, wherein the module has a thermal resistance between the LED array and the top surface that is less than 5 K/W.

19. The illumination system of claim 18, wherein the heat spreader is formed of material that has a thermal conductivity greater than 50 W/m-K.

20. The illumination system of claim 19, wherein the circuitry is configured to receive 12 volt AC.

21. The illumination system of claim 19, further comprising a biasing element positioned between the cover and the frame, the biasing element configured to urge the frame and heat spreader toward the top surface when the cover is rotatably translated.