Method for manufacturing a MEMS sensor

• US 8,975,090 B2
• Filed: 07/14/2014
• Issued: 03/10/2015
• Est. Priority Date: 10/15/2010
• Status: Active Grant

• Current Assignee: ROHM Co., Ltd.
• Original Assignee: ROHM Co., Ltd.
• Inventors: Nakatani, Goro, Fujita, Toma
• Primary Examiner(s): Lebentritt, Michael
• Application Number:
  US14/331,182
• Publication Number:
  US 20140322854A1
• Time in Patent Office: 239 Days
• Field of Search: 438/3, 257/E21.219, 257/499, 257/29.329
• US Class Current: 438/3
• CPC Class Codes: B81B 2201/0242 Gyroscopes
• CPC Class Codes: B81B 2203/0136 Comb structures
• CPC Class Codes: B81B 2203/04 Electrodes
• CPC Class Codes: B81B 7/02 containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] B81B7/04 takes precedence
• CPC Class Codes: B81C 1/00182 Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer
• CPC Class Codes: B81C 1/00801 Avoid alteration of functional structures by etching, e.g. using a passivation layer or an etch stop layer B81C1/00595, B81C1/00468 take precedence
• CPC Class Codes: B81C 2201/053 Depositing a protective layers
• CPC Class Codes: G01C 19/5733 Structural details or topology
• CPC Class Codes: G01C 19/5769 Manufacturing; Mounting; Housings
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate

Abstract

A capacitance type gyro sensor includes a semiconductor substrate, a first electrode integrally including a first base portion and first comb tooth portions and a second electrode integrally including a second base portion and second comb tooth portions, formed by processing the surface portion of the semiconductor substrate. The first electrode has first drive portions that extend from opposed portions opposed to the respective second comb tooth portions on the first base portion toward the respective second comb tooth portions. The second electrode has second drive portions formed on the tip end portions of the respective second comb tooth portions opposed to the respective first drive portions. The first drive portions and the second drive portions engage with each other at an interval like comb teeth.

Claims

1. A method for manufacturing a MEMS sensor comprising the steps of:

forming a recess dug to a halfway point in the thickness direction of a semiconductor substrate by selectively etching the surface layer portion of a sensor region of the semiconductor substrate having the sensor region and a peripheral region surrounding the sensor region, and concurrently, forming a comb-tooth-like fixed electrode and movable electrode that engage with each other via the recess;

forming a sacrifice layer that covers the sensor region and exposes the peripheral region;

forming a protective layer made of a first inorganic material on the semiconductor substrate so that a peripheral edge portion of the protective layer is bonded to the peripheral region and the central portion surrounded by the peripheral edge portion covers the sacrifice layer;

forming a space between the protective layer and the sensor region by removing the sacrifice layer directly below the protective layer; and

forming a cavity by linking the lower portions of the fixed electrode and the movable electrode to each other by isotropic etching by supplying an etching medium into the recess after removing the sacrifice layer.

2. The method for manufacturing a MEMS sensor according to claim 1, wherein

the step of forming the sacrifice layer includes:

a step of forming a first sacrifice layer made of a second inorganic material different from the material of the protective layer so as to close the opening end of the recess formed in the sensor region; and

a step of forming a second sacrifice layer made of a metal material on the first sacrifice layer so as to cover the sensor region after forming the first sacrifice layer.

3. The method for manufacturing a MEMS sensor according to claim 2, wherein the first sacrifice layer is made of an inorganic material that can be etched with a fluorine-based gas, and the second sacrifice layer is made of a metal material that can be etched with a chlorine-based gas.

4. The method for manufacturing a MEMS sensor according to claim 2, wherein the protective layer is made of SiO₂, the first sacrifice layer is made of SiN, and the second sacrifice layer is made of Al.

5. The method for manufacturing a MEMS sensor according to claim 1, further comprising:

a step of forming a protective film having etching selectivity to the sacrifice layer so as to cover side walls of the fixed electrode and the movable electrode previous to formation of the sacrifice layer.

6. The method for manufacturing a MEMS sensor according to claim 1, wherein the step of removing the sacrifice layer includes a step of supplying an etching medium capable of etching the sacrifice layer from a through hole by forming the through hole in the central portion of the protective layer.

7. A method for manufacturing a MEMS sensor comprising the steps of:

selectively forming a lower electrode on a semiconductor substrate;

laminating an electrode coating film made of a material having etching selectivity to polysilicon on the semiconductor substrate so as to coat the lower electrode;

selectively forming a sacrifice polysilicon layer on the electrode coating film;

laminating a sacrifice oxide film on the electrode coating film so as to coat the sacrifice polysilicon layer;

forming an electrode polysilicon layer on the sacrifice oxide film;

forming an upper electrode by selectively etching the electrode polysilicon layer;

forming a protective film having etching selectivity to polysilicon so as to cover side walls of the upper electrode;

exposing the sacrifice polysilicon layer by removing portions of the sacrifice oxide film; and

forming a cavity directly below the upper electrode by removing the exposed sacrifice polysilicon layer.

8. The method for manufacturing a MEMS sensor according to claim 7, wherein the step of forming the upper electrode includes a step of molding the electrode polysilicon layer into a comb-tooth-like fixed electrode and movable electrode that engage with each other at an interval.

9. The method for manufacturing a MEMS sensor according to claim 8, further comprising:

a step of removing the protective film from the side walls of the fixed electrode and the movable electrode after removing the sacrifice polysilicon layer.

10. The method for manufacturing a MEMS sensor according to claim 7, further comprising:

a step of forming an opening that penetrates through the electrode coating film and selectively exposes the lower electrode previous to formation of the electrode polysilicon layer, wherein

the step of forming the electrode polysilicon layer includes a step of forming the electrode polysilicon layer on the sacrifice oxide film and concurrently, making a portion of the electrode polysilicon layer enter the opening of the electrode coating film and come into contact with the lower electrode, and

the step of forming the upper electrode includes a step of forming a contact electrode that is separated from the upper electrode and in contact with the lower electrode.

11. The method for manufacturing a MEMS sensor according to claim 10, further comprising:

a step of forming a wiring on the contact electrode.

12. The method for manufacturing a MEMS sensor according to claim 11, wherein the step of forming a wiring on the contact electrode includes a step of forming a wiring on the upper electrode as well, concurrently.

13. A method for manufacturing a MEMS sensor comprising the steps of:

forming a base film made of a material having etching selectivity to Si on a Si substrate;

forming a polysilicon layer on the base film;

forming trenches from the surface of the polysilicon layer to the surface of the Si substrate by selectively etching the polysilicon layer and the base film and concurrently, forming a comb-tooth-like first electrode and second electrode that have a lamination structure including the base film and the polysilicon layer and engage with each other via the trenches; and

forming a cavity directly below the base film by etching portions directly below the base film of the Si substrate by isotropic etching by supplying an etching medium into the trenches.

14. The method for manufacturing a MEMS sensor according to claim 13, wherein

the step of forming the base film includes:

a step of processing the Si substrate into a plate-shaped base portion and columnar portions standing on the surface of the base portion by selectively etching the Si substrate, and

a step of altering the surface of the base portion and the columnar portions into insulating films by thermally oxidizing the surface of the base portion and the columnar portions, and

the step of selectively etching the polysilicon layer and the base film includes;

a step of etching to respectively insulate the first electrode and/or the second electrode from other portions of the polysilicon layer by the columnar portions altered into the insulating films.

15. The method for manufacturing a MEMS sensor according to claim 14, wherein

the step of forming the polysilicon layer includes:

a step of depositing a polysilicon material to a position higher than the top portions of the columnar portions on the base portion, and

a step of grinding the polysilicon material until the surface of the deposited polysilicon material is lowered to the height of the top portions of the columnar portions.

16. The method for manufacturing a MEMS sensor according to claim 13, further comprising:

a step of forming a protective film having etching selectivity to polysilicon so as to cover the side walls of the first electrode and the second electrode.

17. The method for manufacturing a MEMS sensor according to claim 13, comprising:

a step of selectively forming wirings on the polysilicon layer previous to formation of the trenches.