Gold die bond sheet preform
First Claim
Patent Images
1. A method of forming a semiconductor bond site on a semiconductor package comprising the steps of:
- forming a gold containing die bond sheet preform having a width, a length and a substantially uniform thickness;
placing the die bond sheet preform on a die bond area on a semiconductor package; and
welding the die bond sheet preform to the package die bond area at two spaced apart spots, the two spaced apart spots having a total area significantly smaller than the area of the sheet preform.
2 Assignments
0 Petitions
Accused Products
Abstract
The amount of gold required for bonding a semiconductor die to an electronic package is reduced by using a sheet preform tack welded to the package prior to mounting the die. The preform, only slightly larger than a semiconductor die to be attached to the package, is placed in the die bond location and tack welded to the package at two spaced locations.
-
Citations
20 Claims
-
1. A method of forming a semiconductor bond site on a semiconductor package comprising the steps of:
-
forming a gold containing die bond sheet preform having a width, a length and a substantially uniform thickness; placing the die bond sheet preform on a die bond area on a semiconductor package; and welding the die bond sheet preform to the package die bond area at two spaced apart spots, the two spaced apart spots having a total area significantly smaller than the area of the sheet preform. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
-
- 11. A semiconductor package comprising a copper tungsten base having a die bond site and a die bond sheet preform containing gold and tin welded to the base die bond site in at least two locations spaced from one another.
-
15. A semiconductor package formed by:
-
forming a gold containing die bond sheet preform having a width, a length and a substantially uniform thickness; placing the die bond sheet preform on a die bond area on a semiconductor package; welding the die bond sheet preform to the package die bond area at two spaced apart spots, the two spaced apart spots having a total area significantly smaller than the area of the sheet preform. - View Dependent Claims (16, 17, 18, 19, 20)
-
Specification