Protective device
First Claim
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1. A protective device, comprising:
- a substrate having a top surface and a bottom surface opposite to the top surface;
two first electrodes respectively arranged at two opposite sides of the substrate;
a low-melting point metal layer arranged over the two first electrodes and having a first surface facing the top surface of the substrate and a second surface opposite to the first surface;
an assisting layer formed on the second surface of the low-melting point metal layer, anda bridging structure directly contacting with the assisting layer on the second surface of the low-melting point metal layer,wherein a first liquidus temperature of the assisting layer is below a second liquidus temperature of the low-melting point metal layer, and the first liquidus temperature of the assisting layer is not below a predetermined temperature, the predetermined temperature is below a maximum temperature of reflow soldering process by 25 degrees Celsius.
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Abstract
A protective device includes a substrate, two first electrodes, a low-melting point metal layer and an assisting layer. The first electrodes are respectively arranged at two opposite sides of the substrate. The low melting point metal layer is arranged over the two first electrodes. The assisting layer is formed on the low melting point metal layer. The liquidus temperature of the assisting layer is below the liquidus temperature of the low melting point metal layer, and the liquidus temperature of the assisting layer is not below a predetermined temperature which is below the maximum working temperature of reflow soldering process by 25 degrees.
35 Citations
18 Claims
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1. A protective device, comprising:
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a substrate having a top surface and a bottom surface opposite to the top surface; two first electrodes respectively arranged at two opposite sides of the substrate; a low-melting point metal layer arranged over the two first electrodes and having a first surface facing the top surface of the substrate and a second surface opposite to the first surface; an assisting layer formed on the second surface of the low-melting point metal layer, and a bridging structure directly contacting with the assisting layer on the second surface of the low-melting point metal layer, wherein a first liquidus temperature of the assisting layer is below a second liquidus temperature of the low-melting point metal layer, and the first liquidus temperature of the assisting layer is not below a predetermined temperature, the predetermined temperature is below a maximum temperature of reflow soldering process by 25 degrees Celsius. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A protective device, comprising:
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a substrate having a top surface and a bottom surface opposite to the top surface; a low-melting point metal layer arranged over the substrate and having a first surface facing the top surface of the substrate and a second surface opposite to the first surface; an assisting layer formed on the second surface of the low-melting point metal layer; a bridging structure crossing the low melting point metal layer and directly contacting with the assisting layer on the second surface of the low-melting point metal layer; and a heating member disposed on the top surface of the substrate, wherein a first liquidus temperature of the assisting layer is below a second liquidus temperature of the low-melting point metal layer, and the first liquidus temperature of the assisting layer is not below a predetermined temperature, the predetermined temperature is below a maximum temperature of reflow soldering process by 25 degrees Celsius. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18)
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Specification