Case of electronic device having low frequency antenna pattern embedded therein, mold therefor and method of manufacturing thereof

• US 8,976,074 B2
• Filed: 05/09/2011
• Issued: 03/10/2015
• Est. Priority Date: 05/11/2010
• Status: Expired due to Fees

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Sung, Jae Suk, Hong, Ha Ryong, Chang, Ki Won, Mun, Hyun Sam, Lee, Byung Hwa, Kim, Tae Sung, Lim, Dae Ki, Na, Yong Shik, Lee, Duk Woo, Lee, Dae Kyo
• Primary Examiner(s): Mikels, Matthew
• Application Number:
  US13/103,297
• Publication Number:
  US 20110278186A1
• Time in Patent Office: 1,401 Days
• Field of Search: 343/872, 343/873
• US Class Current: 343/873
• CPC Class Codes: B29C 2045/0049 the injected material flowing against a mould cavity protruding part
• CPC Class Codes: B29C 45/0046 Details relating to the filling pattern or flow paths or flow characteristics of moulding material in the mould cavity
• CPC Class Codes: B29C 45/14065 Positioning or centering articles in the mould
• CPC Class Codes: B29C 45/14418 Sealing means between mould and article
• CPC Class Codes: B29C 45/14639 for obtaining an insulating effect, e.g. for electrical components
• CPC Class Codes: B29C 45/1671 with an insert
• CPC Class Codes: B29K 2105/16 Fillers
• CPC Class Codes: B29K 2995/0008 Magnetic or paramagnetic
• CPC Class Codes: B29L 2031/3431 Telephones, Earphones
• CPC Class Codes: B29L 2031/3456 Antennas, e.g. radomes
• CPC Class Codes: B29L 2031/3481 Housings or casings incorporating or embedding electric or electronic elements
• CPC Class Codes: H01Q 1/243 with built-in antennas

Abstract

There is provided an electronic device case having a low frequency antenna pattern embedded therein, the case including: a radiator frame injection molded using a polymer mixture containing a magnetic substance component so that a radiator including a low frequency antenna pattern part is formed on one surface thereof; a case frame injection molded upwardly of the radiator frame and provided with the radiator embedded between the radiator frame and the case frame; and a boundary part forming a boundary between the radiator frame and the case frame and having a groove formed inwardly of the case frame.

Claims

1. An electronic device case having a low frequency antenna pattern embedded therein, the case comprising:

a radiator frame injection molded using a polymer mixture containing a magnetic substance component such that a radiator including a low frequency antenna pattern part is formed on one surface thereof;

a case frame injection molded upwardly of the radiator frame and provided with the radiator embedded between the radiator frame and the case frame; and

a boundary part forming a boundary between the radiator frame and the case frame and having a groove formed inwardly of the case frame.

2. The case of claim 1, wherein the radiator frame includes a through hole, and

the low frequency antenna pattern part includes an antenna coil wound multiple times around an outer portion of the through hole.

3. The case of claim 2, wherein the through hole is inserted into an inner boundary jaw of a mold of the electronic device case through which the case frame is injection molded.

4. The case of claim 2, wherein the case frame and the through hole are provided with a through hole boundary groove formed at a boundary therebetween.

5. The case of claim 4, wherein the through hole boundary groove has an inclination, a depth of which becomes shallower in a direction from the through hole toward the case frame formed at an inner portion of the through hole.

6. The case of claim 1, wherein the case frame formed at an outer portion of the radiator frame and the radiator frame are provided with an outer boundary groove formed at a boundary therebetween.

7. The case of claim 6, wherein the outer boundary groove has an inclination, a depth of which becomes shallower in a direction from the radiator frame toward the case frame formed at an outer portion of the radiator frame.

8. The case of claim 1, wherein the radiator includes a connection terminal part formed on one surface of the radiator frame, and

the connection terminal part is injection molded to be exposed on a connection terminal support formed to protrude to an outer portion of the radiator frame.

9. The case of claim 8, wherein the connection terminal support includes an interconnection hole formed in a position corresponding to that of the connection terminal part.

10. The case of claim 1, wherein the polymer mixture contains the magnetic substance component.

11. The case of claim 10, wherein the magnetic substance component includes ferrite.

12. The case of claim 1, wherein the case frame is formed by injection molding an injection molding liquid of at least one selected from a polycarbonate (PC), an acrylonitrile-butadiene-styrene (ABS), a resin and a polymer plastic.

13. A mold of a case of an electronic device, the mold comprising:

upper and lower molds contacted with and supported by a radiator frame, the radiator frame injection molded using a polymer mixture containing a magnetic substance component so that a radiator including a low frequency antenna pattern part may be formed on one surface thereof;

a resin material inlet formed in the upper mold, the lower mold, or in the upper and lower molds and having a resin material introduced thereinto so that a case frame shaped inner space formed by combining the upper and lower molds becomes a case frame; and

a boundary part forming part provided to at least one of the upper and lower molds and having the radiator frame inserted thereinto.

14. The mold of claim 13, wherein the boundary part forming part includes a protrusion protruding from the upper mold or the lower mold so that an outer circumferential portion defining an outer boundary of the radiator frame and an inner circumferential portion of a through hole formed in the radiator frame are inserted thereinto.

15. The mold of claim 13, wherein the boundary part forming part has an increasing inclination in a direction in which the resin material moves in the inner space.

16. The mold of claim 13, wherein the boundary part forming part has an inclination so that the introduced resin material first contacts an upper surface of the radiator frame.

17. The mold of claim 13, wherein the boundary part forming part has a large height at a boundary part of the radiator frame and a reduced height toward the inner space.

18. The mold of claim 13, wherein the resin material inlet is formed at an outer portion of the boundary part forming part.

19. The mold of claim 13, wherein the boundary part forming part includes an inclination part guiding the resin material to be inclined upwardly or downwardly within the case frame shaped inner space and a flat part continuously extended from the inclination part and guiding the resin material horizontally.

20. The mold of claim 19, wherein the inclination part has a tangential gradient of a bottom surface increased in a moving direction of an injection molding liquid.

21. The mold of claim 19, wherein a height of the flat part corresponds to that of the radiator frame.

22. The mold of claim 13, wherein the boundary part forming part includes the inclination part guiding the resin material to be inclined upwardly or downwardly within the case frame shaped inner space and having a tangential gradient of a bottom surface increasing in a moving direction of the injection molding liquid.

23. The mold of claim 22, wherein a height of the inclination part corresponds to that of the radiator frame.

24. The mold of claim 13, wherein the boundary part forming part includes the inclination part guiding the resin material to be inclined upwardly or downwardly within the case frame shaped inner space and having a tangential gradient of a bottom surface increasing and then decreasing at any one point thereof.

25. The mold of claim 24, wherein a height of the inclination part corresponds to that of the radiator frame.

26. A method of manufacturing a case of an electronic device, the method comprising:

injection molding a radiator frame using a polymer mixture containing a magnetic substance component so that a radiator including a low frequency antenna pattern part is formed on one surface thereof;

allowing an outer circumferential surface of the radiator frame to be inserted into and seated in an inner side of a boundary part forming part formed in a mold of the case of the electronic device; and

allowing a resin material to be introduced from an outer side of the boundary part forming part, pass through the boundary part forming part, be filled from an upper surface of the radiator frame and then be filled in a case frame shaped inner space formed in the mold of the case of the electronic device.

27. The method of claim 26, wherein the radiator frame is molded so that a through hole is formed at an inner side of the low frequency antenna pattern part, and

the radiator frame is seated in the mold of the case of the electronic device including the boundary part forming part into which the through hole is inserted.