Reproducing audio signals with a haptic apparatus on acoustic headphones and their calibration and measurement

• US 8,977,376 B1
• Filed: 10/13/2014
• Issued: 03/10/2015
• Est. Priority Date: 01/06/2014
• Status: Active Grant

• Current Assignee: Alpine Electronics of Silicon Valley, Inc. (Alps Alpine Co., Ltd.)
• Original Assignee: Alpine Electronics of Silicon Valley, Inc. (Alps Alpine Co., Ltd.)
• Inventors: Lin, Rocky Chau-Hsiung, Yamasaki, Thomas
• Primary Examiner(s): McCord, Paul
• Assistant Examiner(s): ELJAIEK, ALEXANDER L
• Application Number:
  US14/512,679
• Time in Patent Office: 148 Days
• Field of Search: 295/921, 295/94, 73/18.2, 73/405.A, 735/79, 735/84, 735/85, 735/87, 736/46, 736/49, 381/56, 381/58, 381/60, 381/74, 381/151, 381/162, 381/190, 381/309, 381/312, 381/322, 381/328, 381/370, 381/371, 381/374, 381/380, 381/384, 600/27, 600/300, 600/528, 600/559, 601/47, 700/94, 702/56, 702/76, 702/104, 702/183, 702/189
• US Class Current: 700/94
• CPC Class Codes: G01H 11/06 by electric means
• CPC Class Codes: G06F 3/165 Management of the audio stream, e.g. setting of volume, audio stream path
• CPC Class Codes: H04R 1/1008 Earpieces of the supra-aural or circum-aural type
• CPC Class Codes: H04R 1/1041 Mechanical or electronic switches, or control elements switches in general H01H
• CPC Class Codes: H04R 1/1091 Details not provided for in groups H04R1/1008 - H04R1/1083
• CPC Class Codes: H04R 1/22 for obtaining desired frequency characteristic only circuit for combining transducers having different responses H04R3/00; for hearing aids H04R25/407
• CPC Class Codes: H04R 2420/07 Applications of wireless loudspeakers or wireless microphones
• CPC Class Codes: H04R 2460/13 Hearing devices using bone conduction transducers
• CPC Class Codes: H04R 29/00 Monitoring arrangements; Testing arrangements for hearing aids H04R25/30; detection of loudspeaker connection H04R5/04; sound-field adaptation dependent on speaker detection H04S7/308
• CPC Class Codes: H04R 3/04 for correcting frequency response
• CPC Class Codes: H04R 31/00 Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182

Abstract

Method and devices for testing a headphone with increased sensation are provided. The headphone can filter and amplify low frequency audio signals, which are then sent to a haptic device in the headphone. The haptic device can cause bass sensations at the top of the skull and at both ear cups. The testing system can evaluate the haptic and acoustic sensations produced by the headphone to evaluate if they have been properly assembled and calibrate the headphones if necessary.

Claims

1. A method for manufacturing a haptic headphone comprising a rigid headband with a right circumaural ear cup attached to one end of the rigid headband with a right driver configured to receive a right audio signal and reproduce sound, a left circumaural ear cup attached to the other end of the rigid headband with a left driver configured to receive a left audio signal and reproduce sound, and a haptic device attached to the midpoint of the headband configured to receive a combination of the right and left audio channels and to produce vibrations, the method comprising:

initiating, on a computer system, a test of the haptic headphone;

obtaining, on the computer system, a left audio test signal and a right audio test signal;

transmitting, on the computer system, the left audio test signal and the right audio test signal;

capturing, on the computer system, a left vibration signal from a left vibration sensor on a test structure that represents the tactile vibrations transmitted by the left circumaural ear cup of the haptic headphone, a right vibration signal from a right vibration sensor on the test structure that represents the tactile vibrations transmitted by the right circumaural ear cup of the haptic headphone, and a top vibration signal from a top vibration sensor on the test structure that represents the tactile vibrations of the top of the headband of the haptic headphone;

displaying, on a display of the computer system, the left vibration signal, the right vibration signal, and the top vibration signal;

retrieving, from the memory of the computer system, a model left vibration signal, a model right vibration signal, and a model top vibration signal;

determining, on the computer system, the similarity of the left vibration signal against the model left vibration signal, the right vibration signal against the right model vibration signal, and the top vibration signal against the model top vibration signal;

displaying, on a display of the computer system, the result of the determination; and

calibrating the haptic headphones based on the determination.

2. The method of claim 1, wherein the determining step comprises a cross-correlation analysis of the left vibration signal and the model left vibration signal, the right vibration signal and the right model vibration signal, or the top vibration signal and the model top vibration signal.

3. The method of claim 1, wherein the calibration comprises modifying the gain to one of the haptic device, the left driver, or the right driver of the haptic headphone.

4. The method of claim 1, wherein the left vibration signal, the right vibration signal, or the top vibration signal is aligned after they are captured.

5. The method of claim 1, wherein the computer system automatically initiates the test when a pressure sensor on the test structure indicates a headphone is properly seated on at least a portion of the test structure.

6. The method of claim 1, further comprising:

modifying at least one of the left audio test signal, or the right audio test signal;

transmitting, on the computer system, the modified left audio test signal or the modified right audio test signal; and

capturing, on the computer system, a modified left vibration signal from a left vibration sensor on a test structure that represents the vibrations transmitted by the left circumaural ear cup of the haptic headphone, a modified right vibration signal from a right vibration sensor on the test structure that represents the vibrations transmitted by the right circumaural ear cup of the haptic headphone, or a modified top vibration signal from a top vibration sensor on the test structure that represents the vibrations of the top of the headband of the haptic headphone.

7. The method of claim 1, wherein the capturing further comprises capturing, on the computer system, a left audio signal from a left microphone sensor on a test structure that represents the acoustic energy transmitted by the left circumaural ear cup of the haptic headphone, or a right audio signal from a right microphone sensor on the test structure that represents the acoustic energy transmitted by the right circumaural ear cup of the haptic headphone.

8. The method of claim 1, wherein the calibration comprises modifying a reproduction setting.

9. The method of claim 1, wherein the calibration comprises modifying a crossover frequency.

10. The method of claim 1, wherein the calibration comprises reprogramming the processor in the haptic headphone.

11. The method of claim 1, wherein the calibration comprises reworking the haptic headphone.