Systems and methods for integrating radio-frequency identification circuitry into flexible circuits

• US 8,978,988 B2
• Filed: 10/04/2013
• Issued: 03/17/2015
• Est. Priority Date: 09/17/2010
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Mauricia, Juan Carlos
• Primary Examiner(s): Lee, Michael G
• Assistant Examiner(s): ELLIS, SUEZU Y
• Application Number:
  US14/046,799
• Publication Number:
  US 20140033515A1
• Time in Patent Office: 529 Days
• Field of Search: 235/492, 235/488, 340/572.1, 340/572.7, 340/572.8, 343/700.MS, 296/00, 296/01
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/09754 Connector integrally incorporated in the printed circuit board [PCB] or in housing
• CPC Class Codes: H05K 2201/10098 Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49018 with other electrical component
• CPC Class Codes: Y10T 29/49126 Assembling bases

Abstract

Systems and methods for integrating radio-frequency identification (RFID) circuitry into flexible circuits are provided. An RFID integrated circuit can be embedded within a dielectric layer of a flexible circuit or between a dielectric layer and a conductive layer of the flexible circuit. Additionally or alternatively, an RFID antenna may be integrated into a conductive layer of the flexible circuit. Alternatively, both the integrated circuit and antenna of RFID circuitry may be provided off of the flexible circuit but an RFID connector coupling the integrated circuit and antenna may be integrated into the flexible circuit.

Claims

1. A method of forming a flexible circuit, the method comprising:

positioning a first conductive layer along a first surface of a dielectric layer;

integrating at least a first portion of radio-frequency identification (RFID) circuitry into one of the first conductive layer and the dielectric layer, wherein the first portion of the RFID circuitry comprises an integrated circuit, and the integrating comprises;

forming a pocket into the dielectric layer, and

positioning at least a portion of the integrated circuit within the pocket; and

integrating a second portion of the RFID circuitry into one of the first conductive layer and the dielectric layer, wherein the second portion of the RFID circuitry comprises an antenna.

2. The method of claim 1, further comprises:

positioning at least a portion of the antenna within the pocket.

3. The method of claim 1, further comprising:

integrating the second portion of the RFID circuitry between an insulation via and a side of the flexible circuit opposite the insulation via.

4. The method of claim 1, further comprising:

coupling a first portion of the first conductive layer to a first electronic component; and

coupling a second portion of the first conductive layer to a second electronic component.

5. The method of claim 4, wherein the first conductive layer electrically couples the integrated circuit to the antenna.

6. The method of claim 4, wherein:

a third portion of the RFID circuitry comprises a connector; and

the connector electrically couples the integrated circuit to the antenna.

7. The method of claim 1, further comprising:

positioning the RFID circuitry between an insulation via and a side of the flexible circuit allowing RF signals to be radiated from the RFID circuitry through the side of the flexible circuit.

8. The method of claim 1, further comprising:

forming a conductive via through at least a portion of the dielectric layer; and

electrically coupling the conductive via to one or more various portions of the first conductive layer.

9. The method of claim 1, further comprising:

positioning at least a first portion of a second RFID circuitry in a first component; and

coupling the first component to the flexible circuit through an RFID connector included in the second RFID circuitry, wherein the first component includes at least one of a separate flexible circuit and a housing component.

10. The method of claim 1, wherein the steps further comprise:

electrically coupling the integrated circuit to the antenna using the first conductive layer.

11. The method of claim 1, wherein the steps further comprise:

coupling an electronic component to the flexible circuit using an RFID connector.

12. The method of claim 11, wherein the electronic component is a housing component of an electronic device.

13. A method of forming a flexible circuit, the method comprising:

positioning a first conductive layer along a first surface of a dielectric layer;

integrating at least a first portion of radio-frequency identification (RFID) circuitry into one of the first conductive layer and the dielectric layer;

coupling a first portion of the first conductive layer to a first electronic component;

coupling a second portion of the first conductive layer to a second electronic component; and

separating a flex data portion from an RFID data portion in the flexible circuit with an insulation via.

14. The method of claim 13, wherein separating the flex data portion from the RFID data portion comprises:

extending the insulation via from the first conductive layer through the dielectric layer to a second conductive layer located opposite the first conductive layer relative to the dielectric layer.

15. The method of claim 13, further comprising:

separating the flex data portion in the flexible circuit from an extra RFID data portion with an extra insulation via through at least a portion of the flexible circuit.

16. The method of claim 15, further comprising:

forming an extra RFID antenna and an integrated circuit in the extra RFID data portion.

17. The method of claim 13, further comprising:

coupling a third electronic component to the flexible circuit through a second portion of the RFID circuitry.

18. The method of claim 17, wherein the third electronic component is a housing component of an electronic device.

19. The method of claim 13, wherein the steps further comprise:

positioning the RFID circuitry between the insulation via and a side of the flexible circuit allowing RF signals to be radiated from the RFID circuitry through the side of the flexible circuit.

20. The method of claim 13, wherein the steps further comprise:

forming a conductive via through at least a portion of the dielectric layer; and

electrically coupling the conductive via to one or more various portions of the first conductive layer.