Sensing module for orthopedic load sensing insert device

• US 8,979,758 B2
• Filed: 06/29/2010
• Issued: 03/17/2015
• Est. Priority Date: 06/29/2010
• Status: Active Grant

• Current Assignee: Howmedica Osteonics Corp. (Stryker Corporation)
• Original Assignee: OrthoSensor, Inc (Stryker Corporation)
• Inventors: Stein, Marc, Ellis, Jim, Roche, Martin
• Primary Examiner(s): FERNANDEZ, KATHERINE L
• Application Number:
  US12/826,329
• Publication Number:
  US 20110319755A1
• Time in Patent Office: 1,722 Days
• Field of Search: 600/437, 600/459, 600/438, 600/587, 600/595, 737/60, 73/10.8, 738/626.21, 738/626.32, 737/81, 738/62, 623/18.11
• US Class Current: 600/438
• CPC Class Codes: A61B 2562/0219 Inertial sensors, e.g. accelerometers, gyroscopes, tilt switches
• CPC Class Codes: A61B 2562/0247 Pressure sensors
• CPC Class Codes: A61B 2562/0252 Load cells
• CPC Class Codes: A61B 5/0031 Implanted circuitry
• CPC Class Codes: A61B 5/4528 Joints A61B5/4533, A61B5/4538 take precedence
• CPC Class Codes: A61B 5/4585 Evaluating the knee
• CPC Class Codes: A61B 5/4851 Prosthesis assessment or monitoring
• CPC Class Codes: A61B 8/0875 for diagnosis of bone A61B5/4504 takes precedence
• CPC Class Codes: A61B 8/4472 Wireless probes
• CPC Class Codes: A61F 2/389 Tibial components A61F2/3868 takes precedence
• CPC Class Codes: A61F 2/4657 Measuring instruments used for implanting artificial joints for surgical instruments A61B90/06
• CPC Class Codes: A61F 2002/3067 for data transfer
• CPC Class Codes: A61F 2002/3895 unicompartimental
• CPC Class Codes: A61F 2002/4666 for measuring force, pressure or mechanical tension

Abstract

A sensing insert device (100) is disclosed for measuring a parameter of the muscular-skeletal system. The sensing insert device (100) can be temporary or permanent. The sensing module (200) is a self-contained encapsulated measurement device having at least one contacting surface that couples to the muscular-skeletal system. The sensing module (200) comprises one or more sensing assemblages (1802), electronic circuitry (307), an antenna (2302), and communication circuitry (320). The sensing assemblages (1802) are between a top plate (1502) and a bottom plate (1504) in a sensing platform (121). The bottom plate (1504) is supported by a ledge (1708) on an interior surface of a sidewall (1716) of a housing (1706). A cap (1702) couples to top plate (1502). The cap (1702) is adhesively coupled to the housing (1706). The adhesive is flexible allowing movement of the cap (1702) when a force, pressure, or load is applied thereto.

Claims

1. A sensing module for measuring a parameter of the muscular-skeletal system comprising:

a housing comprising;

a flexible load bearing top surface;

a sidewall; and

a bottom surface;

a rigid bottom plate;

a rigid top plate;

a sensing platform configured to measure a load on the top surface and a location of the load on the top surface, wherein the top plate is configured to transfer a portion of the load applied to the top surface to the sensing platform, wherein the sensing platform is between the top plate and the bottom plate; and

electronic circuitry operatively coupled to the sensing platform and configured to receive measurement data from the sensing platform, wherein the electronic circuitry is configured to wirelessly transmit the measurement data, and wherein the housing isolates the sensing platform and electronic circuitry from an external environment.

2. The sensing module of claim 1 further including a ledge formed on an interior of the sidewall of the housing and wherein the ledge supports the sensing platform a predetermined distance above the bottom surface of the housing.

3. The sensing module of claim 2 wherein the electronic circuitry resides between the sensing platform and the bottom surface of the housing.

4. The sensing module of claim 3 wherein the sensing module comprises a printed circuit board supported by a support structure a predetermined distance from the bottom surface of the housing.

5. The sensing module of claim 1 wherein the flexible load bearing top surface comprises a cap and wherein the cap overlies the sensing platform.

6. The sensing module of claim 5 wherein the cap is configured to move under a load applied thereto.

7. The sensing module of claim 1 wherein a portion of the sensing platform is configured to compress under a load.

8. The sensing module of claim 7 wherein the sensing platform comprises:

a waveguide; and

at least one transducer to emit energy waves into the waveguide and to detect propagated energy waves.

9. The sensing module of claim 1 wherein the sensing module is shaped to act as a trial insert that is dimensionally substantially equal to a final insert.

10. The sensing module of claim 1 wherein the sensing module is shaped to act as a final insert.

11. A sensing module for measuring a parameter of the muscular-skeletal system comprising:

an encapsulating enclosure having a curved surface;

a sensing assemblage;

a rigid top load plate;

a rigid bottom plate

a load disk; and

electronic circuitry, wherein the sensing assemblage is connected to the electronic circuitry, wherein the encapsulating enclosure encloses the sensing assemblage, load disk, bottom load plate and the top load plate, wherein the load disk is configured to transmit a portion of a load on the curved surface to the sensing assemblage, wherein the sensing assemblage is configured to measure the portion of the load, and wherein the sensing module is configured to be placed into an orthopedic system.

12. The sensing module of claim 11 wherein the

sensing assemblage is between the top plate and the bottom plate.

13. The sensing module of claim 12 wherein the encapsulating enclosure comprises a housing and wherein the housing comprises at least one support structure interior to the housing that supports the the sensing assemblage.

14. The sensing module of claim 13 wherein the encapsulating enclosure further includes:

a cap, wherein the cap is configured to move in relation to the housing when a load is applied thereto.

15. The sensing module of claim 14 wherein the encapsulating enclosure comprises an adhesive coupling the cap to the housing and wherein the adhesive is flexible allowing movement of the cap in relation to the housing.