Microwave plasma processing apparatus

• US 8,980,047 B2
• Filed: 07/01/2011
• Issued: 03/17/2015
• Est. Priority Date: 07/02/2010
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd. (Samsung Group)
• Original Assignee: Samsung Electronics Co. Ltd. (Samsung Group)
• Inventors: Choi, Jin Hyuk, Han, Sang Chul, Kee, Jong Il, Lee, Young dong, Lee, Guen Suk, Oh, Seung Hun
• Primary Examiner(s): DHINGRA, RAKESH KUMAR
• Application Number:
  US13/174,938
• Publication Number:
  US 20120000610A1
• Time in Patent Office: 1,355 Days
• Field of Search: 118/723.MW, 118/723.R, 118/723.ME, 156/345.36, 156/345.35, 156/345.41
• US Class Current: 156/345.41
• CPC Class Codes: C23C 16/511 using microwave discharges
• CPC Class Codes: H01J 37/3222 Antennas
• CPC Class Codes: H01L 21/67069 for drying etching

Abstract

In accordance with example embodiments, a plasma processing apparatus includes a chamber configured to perform a plasma process, an upper plate on the chamber, an antenna under the upper plate and the antenna is configured to generate plasma in the chamber, an upper insulator between the upper plate and the antenna and the upper insulator covers a top of the antenna, a lower insulator covering a bottom of the antenna, an antenna support ring configured to fix the antenna to the upper plate, and a metal gasket adhered to the antenna support ring.

Claims

1. A plasma processing apparatus comprising:

a chamber configured to perform a plasma process;

an upper plate on the chamber;

an antenna under the upper plate, the antenna configured to generate plasma in the chamber and including a plurality of grooves defined by a circumferential surface of the antenna;

an upper insulator between the upper plate and the antenna, the upper insulator covering a top of the antenna;

a lower insulator covering a bottom of the antenna;

an antenna support ring disposed below the antenna and configured to fix the antenna to the upper plate, the antenna support ring including a plurality of protrusions along a circumferential surface of the antenna support ring;

and a metal gasket adhered to the antenna support ring,

wherein the plurality of grooves are configured to correspond to and accommodate the plurality of protrusions,

the antenna further including a plurality of slots through which microwaves are irradiated into the chamber.

2. The plasma processing apparatus according to claim 1, wherein the antenna includes a flat plate antenna.

3. The plasma processing apparatus according to claim 2, wherein

the plurality of slots includes a variety of shapes, the plurality of slots defined by at least one inner surface of the antenna.

4. The plasma processing apparatus according to claim 1, wherein

the plurality of slots includes a variety of shapes, the plurality of slots defined by at least one inner surface of the antenna.

5. The plasma processing apparatus according to claim 1, wherein the metal gasket is configured to push the antenna up to maintain contact between the antenna and the upper plate.

6. The plasma processing apparatus according to claim 1, wherein the metal gasket is configured to maintain electrical contact between the antenna and the antenna support ring.

7. The plasma processing apparatus according to claim 1, wherein the chamber includes a susceptor,

the susceptor is configured to support a semiconductor wafer, and

the susceptor is connected to at least one of a heater and an electrode, the electrode configured to apply RF bias.

8. A main part for a plasma processing apparatus comprising:

a chamber;

an antenna support ring disposed on the chamber, the antenna support ring including a plurality of protrusions along a circumferential surface of the antenna support ring;

an antenna on the antenna support ring, the antenna configured to generate a plasma in the chamber and including a plurality of grooves defined by a circumferential surface of the antenna;

an insulator covering the antenna; and

an upper plate on the insulator, the upper plate fixed to the antenna by the antenna support ring,

wherein the plurality of grooves are configured to correspond to and accommodate the plurality of protrusions,

the antenna further including a plurality of slots through which microwaves are irradiated into the chamber.

9. The main part of claim 8, wherein the antenna includes a flat plate shape.

10. The main part of claim 9, wherein

the plurality of protrusions include a size that is smaller than a size of the plurality of grooves of the antenna,

the plurality of protrusions each define a coupling hole;

and

the main part further includes a plurality of coupling bolts inserted through the coupling holes and the plurality of protrusions,

each coupling bolt coupled to the protrusions and configured to fix the antenna to the upper plate.

11. The main part of claim 10, wherein

each protrusion is within each groove, and

a space is provided between each protrusion in each groove, based on the size of the protrusions being smaller than the size of the grooves.

12. The main part of claim 8, wherein

the plurality of slots includes a variety of shapes, the plurality of slots defined by at least one inner surface of the antenna.

13. The main part of claim 8, further comprising:

at least one metal gasket adhered to the antenna support ring,

the metal gasket configured to maintain electrical contact between the antenna and the antenna support ring.

14. An antenna for a plasma processing apparatus, comprising:

a flat plate shape; and

a plurality of grooves defined by a circumferential surface of the antenna, the plurality of grooves distributed along a circumference of the antenna,

wherein the plurality of grooves are configured to correspond to and accommodate a plurality of protrusions adhered to an antenna support ring that are inserted into and coupled with the plurality of grooves,

the antenna further including a plurality of slots through which microwaves are irradiated into a plasma chamber.

15. The antenna of claim 14, wherein,

the plurality of slots including a variety of shapes, the plurality of slots defined by at least one inner surface of the antenna.

16. The antenna of claim 14, wherein

the plurality of grooves include a u-shape.