Microwave plasma processing apparatus
First Claim
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1. A plasma processing apparatus comprising:
- a chamber configured to perform a plasma process;
an upper plate on the chamber;
an antenna under the upper plate, the antenna configured to generate plasma in the chamber and including a plurality of grooves defined by a circumferential surface of the antenna;
an upper insulator between the upper plate and the antenna, the upper insulator covering a top of the antenna;
a lower insulator covering a bottom of the antenna;
an antenna support ring disposed below the antenna and configured to fix the antenna to the upper plate, the antenna support ring including a plurality of protrusions along a circumferential surface of the antenna support ring;
and a metal gasket adhered to the antenna support ring,wherein the plurality of grooves are configured to correspond to and accommodate the plurality of protrusions,the antenna further including a plurality of slots through which microwaves are irradiated into the chamber.
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Abstract
In accordance with example embodiments, a plasma processing apparatus includes a chamber configured to perform a plasma process, an upper plate on the chamber, an antenna under the upper plate and the antenna is configured to generate plasma in the chamber, an upper insulator between the upper plate and the antenna and the upper insulator covers a top of the antenna, a lower insulator covering a bottom of the antenna, an antenna support ring configured to fix the antenna to the upper plate, and a metal gasket adhered to the antenna support ring.
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Citations
16 Claims
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1. A plasma processing apparatus comprising:
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a chamber configured to perform a plasma process; an upper plate on the chamber; an antenna under the upper plate, the antenna configured to generate plasma in the chamber and including a plurality of grooves defined by a circumferential surface of the antenna; an upper insulator between the upper plate and the antenna, the upper insulator covering a top of the antenna; a lower insulator covering a bottom of the antenna; an antenna support ring disposed below the antenna and configured to fix the antenna to the upper plate, the antenna support ring including a plurality of protrusions along a circumferential surface of the antenna support ring; and a metal gasket adhered to the antenna support ring, wherein the plurality of grooves are configured to correspond to and accommodate the plurality of protrusions, the antenna further including a plurality of slots through which microwaves are irradiated into the chamber. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A main part for a plasma processing apparatus comprising:
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a chamber; an antenna support ring disposed on the chamber, the antenna support ring including a plurality of protrusions along a circumferential surface of the antenna support ring; an antenna on the antenna support ring, the antenna configured to generate a plasma in the chamber and including a plurality of grooves defined by a circumferential surface of the antenna; an insulator covering the antenna; and an upper plate on the insulator, the upper plate fixed to the antenna by the antenna support ring, wherein the plurality of grooves are configured to correspond to and accommodate the plurality of protrusions, the antenna further including a plurality of slots through which microwaves are irradiated into the chamber. - View Dependent Claims (9, 10, 11, 12, 13)
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14. An antenna for a plasma processing apparatus, comprising:
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a flat plate shape; and a plurality of grooves defined by a circumferential surface of the antenna, the plurality of grooves distributed along a circumference of the antenna, wherein the plurality of grooves are configured to correspond to and accommodate a plurality of protrusions adhered to an antenna support ring that are inserted into and coupled with the plurality of grooves, the antenna further including a plurality of slots through which microwaves are irradiated into a plasma chamber. - View Dependent Claims (15, 16)
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Specification