Sequential infiltration synthesis for advanced lithography

• US 8,980,418 B2
• Filed: 03/22/2012
• Issued: 03/17/2015
• Est. Priority Date: 03/24/2011
• Status: Active Grant

• Current Assignee: UChicago Argonne LLC
• Original Assignee: UChicago Argonne LLC
• Inventors: Darling, Seth B., Elam, Jeffrey W., Tseng, Yu-Chih, Peng, Qing
• Primary Examiner(s): Khatri, Prashant J
• Assistant Examiner(s): FIGG, TRAVIS M
• Application Number:
  US13/427,619
• Publication Number:
  US 20120241411A1
• Time in Patent Office: 1,090 Days
• Field of Search: 216/67, 216/41, 216/49, 216/51, 428/220, 428212-219, 428/645, 428/416, 430/269, 257/E21.023
• US Class Current: 428/220
• CPC Class Codes: B81C 1/00428 Etch mask forming processes not provided for in groups B81C1/00396 - B81C1/0042
• CPC Class Codes: B81C 2201/0149 Forming nanoscale microstructures using auto-arranging or self-assembling material
• CPC Class Codes: B82Y 40/00 Manufacture or treatment of nanostructures
• CPC Class Codes: G03F 7/0041 providing an etching agent upon exposure G03F7/075 takes precedence; photolytic halogen compounds G03F7/0295
• CPC Class Codes: G03F 7/405 Treatment with inorganic or organometallic reagents after imagewise removal
• CPC Class Codes: H01L 21/0273 characterised by the treatment of photoresist layers
• CPC Class Codes: H01L 21/0274 Photolithographic processes
• CPC Class Codes: H01L 21/0277 Electrolithographic processes
• CPC Class Codes: H01L 21/0279 Ionlithographic processes
• CPC Class Codes: H01L 21/3065 Plasma etching; Reactive-ion etching
• CPC Class Codes: H01L 21/3081 characterised by their composition, e.g. multilayer masks, materials
• CPC Class Codes: H01L 21/3086 characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
• CPC Class Codes: Y10T 428/31522 Next to metal

Abstract

A plasma etch resist material modified by an inorganic protective component via sequential infiltration synthesis (SIS) and methods of preparing the modified resist material. The modified resist material is characterized by an improved resistance to a plasma etching or related process relative to the unmodified resist material, thereby allowing formation of patterned features into a substrate material, which may be high-aspect ratio features. The SIS process forms the protective component within the bulk resist material through a plurality of alternating exposures to gas phase precursors which infiltrate the resist material. The plasma etch resist material may be initially patterned using photolithography, electron-beam lithography or a block copolymer self-assembly process.

Claims

1. A modified organic resist mask layer having an increased resistance to plasma etching or ion milling in response to transferring at least one patterned feature to a substrate material by plasma etching or ion milling, comprising:

an organic resist material disposed over the substrate material and including at least one patterned feature; and

an inorganic protective etch component, comprising a metal or a metal oxide selected from the group consisting of aluminum oxide, titanium dioxide, zinc oxide, silicon dioxide, hafnium dioxide, zirconium dioxide, and tungsten, disposed over at least a portion of the surface of the organic resist material and within at least a portion of the organic resist material to a predetermined infiltration depth within the organic resist material forming a modified resist material,

wherein the plasma etch resistance of the organic resist mask layer is selectively controllable by establishing the infiltration depth of the inorganic protective etch component such that the at least one patterned feature has a high aspect ratio.

2. The modified organic resist mask layer of claim 1, wherein the organic resist material comprises poly(methyl glutarimide) (PMGI), phenol formaldehyde resin (DNQ/Novolac), polyhydroxystyrene-based polymers, polyimides or SU-8.

3. The modified organic resist mask layer of claim 1, wherein the organic resist material comprises a block copolymer comprising at least a first polymer and a second polymer, the block copolymer including a plurality of self-assembled periodic polymer nanostructures, and wherein the inorganic protective etch component is selectively disposed over and within the portion of the organic resist material consisting essentially of the first polymer.

4. The modified organic resist mask layer of claim 3, wherein the block copolymer comprises nanostructured polystyrene-block-poly (methyl methacrylate) (PS-b-PMMA).

5. The modified resist mask layer of claim 4, wherein the film thickness is below that leading to deformation under surface tension, commonly referred to as pattern collapse.

6. The modified organic resist mask layer of claim 1 having a thickness below 100 nm.

7. The modified organic resist mask layer of claim 6, wherein the plasma etch resistance is characterized by an etch resistance that is between about 5 and 10 times the plasma etch resistance of Si.

8. The modified organic resist mask layer of claim 1, wherein the high aspect ratio is at least 3:

1.

9. The modified organic resist mask layer of claim 8, wherein the high aspect ratio is at least 6:

1.

10. A modified organic resist mask layer having an increased resistance to plasma etching or ion milling in response to transferring at least one patterned feature to a substrate material by plasma etching or ion milling, comprising:

an organic resist material disposed over the substrate material and including at least one patterned feature; and

an inorganic protective etch component disposed over at least a portion of the surface of the organic resist material and within at least a portion of the organic resist material to a predetermined infiltration depth within the organic resist material forming a modified resist material,

wherein the plasma etch resistance of the organic resist mask layer is selectively controllable by establishing the infiltration depth of the inorganic protective etch component such that the at least one patterned feature has a high aspect ratio;

and further wherein the infiltration depth is less than a depth of the organic resist materials such that the modified resist material is separated from the substrate material by organic resist material.

11. The modified organic resist mask layer of claim 10, wherein the organic resist material comprises poly(methyl glutarimide) (PMGI), phenol formaldehyde resin (DNQ/Novolac), polyhydroxystyrene-based polymers, polyimides or SU-8.

12. The modified organic resist mask layer of claim 10, wherein the inorganic protective etch component comprises a metal or a metal oxide selected from the group consisting of aluminum oxide, titanium dioxide, zinc oxide, silicon dioxide, hafnium dioxide, zirconium dioxide, and tungsten.

13. The modified organic resist mask layer of claim 10, wherein the organic resist material comprises a block copolymer comprising at least a first polymer and a second polymer, the block copolymer including a plurality of self-assembled periodic polymer nanostructures, and wherein the inorganic protective etch component is selectively disposed over and within the portion of the organic resist material consisting essentially of the first polymer.

14. The modified organic resist mask layer of claim 13, wherein the block copolymer comprises nanostructured polystyrene-block-poly (methyl methacrylate) (PS-b-PMMA).

15. The modified organic resist mask layer of claim 10 having a thickness below 100 nm.

16. The modified resist mask layer of claim 15, wherein the film thickness is below that leading to deformation under surface tension, commonly referred to as pattern collapse.

17. The modified organic resist mask layer of claim 16, wherein the plasma etch resistance is characterized by an etch resistance that is between about 5 and 10 times the plasma etch resistance of Si.