Patterned substrate design for layer growth
First Claim
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1. A device comprising:
- a substrate comprising a patterned surface, wherein the patterned surface includes a set of substantially flat top surfaces and a plurality of openings, wherein each substantially flat top surface has a root mean square roughness less than approximately 0.5 nanometers, wherein the plurality of openings have a characteristic size between approximately 0.1 micron and five microns, wherein the substrate is an at least partially transparent layer, and wherein the substrate includes an outer surface having a profiled surface, the profiled surface including;
a set of large roughness components providing a first variation of the profiled surface having a characteristic scale approximately an order of magnitude larger than a target wavelength of the radiation; and
a set of small roughness components providing a second variation of the profiled surface having a characteristic scale on the order of the target wavelength of the radiation, wherein the set of small roughness components are superimposed on the set of large roughness components.
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Abstract
A patterned surface for improving the growth of semiconductor layers, such as group III nitride-based semiconductor layers, is provided. The patterned surface can include a set of substantially flat top surfaces and a plurality of openings. Each substantially flat top surface can have a root mean square roughness less than approximately 0.5 nanometers, and the openings can have a characteristic size between approximately 0.1 micron and five microns.
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Citations
20 Claims
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1. A device comprising:
a substrate comprising a patterned surface, wherein the patterned surface includes a set of substantially flat top surfaces and a plurality of openings, wherein each substantially flat top surface has a root mean square roughness less than approximately 0.5 nanometers, wherein the plurality of openings have a characteristic size between approximately 0.1 micron and five microns, wherein the substrate is an at least partially transparent layer, and wherein the substrate includes an outer surface having a profiled surface, the profiled surface including; a set of large roughness components providing a first variation of the profiled surface having a characteristic scale approximately an order of magnitude larger than a target wavelength of the radiation; and a set of small roughness components providing a second variation of the profiled surface having a characteristic scale on the order of the target wavelength of the radiation, wherein the set of small roughness components are superimposed on the set of large roughness components. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method comprising:
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obtaining a substrate of a device having a patterned surface, wherein the patterned surface includes a set of substantially flat top surfaces and a plurality of openings, wherein each substantially flat top surface has a root mean square roughness less than approximately 0.5 nanometers, wherein the plurality of openings have a characteristic size between approximately 0.1 micron and five microns, wherein the substrate is an at least partially transparent layer; and forming a profiled surface on an outer surface of the substrate, the profiled surface including; a set of large roughness components providing a first non-uniform variation of the profiled surface having a characteristic scale approximately an order of magnitude larger than a target wavelength of the radiation; and a set of small roughness components providing a second non-uniform variation of the profiled surface having a characteristic scale on the order of the target wavelength of the radiation, wherein the set of small roughness components are superimposed on the set of large roughness components. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 20)
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17. A system comprising:
a computer system configured to implement a method of fabricating a device, the method comprising; fabricating a patterned surface for a substrate of the device, wherein the patterned surface includes a set of substantially flat top surfaces and a plurality of openings, wherein each substantially flat top surface has a root mean square roughness less than approximately 0.5 nanometers, and wherein the plurality of openings have a characteristic size between approximately 0.1 micron and five microns; forming a profiled surface on an outer surface of the substrate, the profiled surface including; a set of large roughness components providing a first non-uniform variation of the profiled surface having a characteristic scale approximately an order of magnitude larger than a target wavelength of the radiation; and a set of small roughness components providing a second non-uniform variation of the profiled surface having a characteristic scale on the order of the target wavelength of the radiation, wherein the set of small roughness components are superimposed on the set of large roughness components; and growing a group III-nitride layer directly on the patterned surface of the substrate. - View Dependent Claims (18, 19)
Specification