Method and structure of sensors and MEMS devices using vertical mounting with interconnections
First Claim
1. An integrated sensor device or electronic device, the device comprising:
- a substrate member having a first surface region, the substrate member having at least one contact region;
at least one singulated integrated sensor or electronic device each coupled to a die member, each die member having a singulated surface region and at least one contact region, the singulated surface region(s) being coupled to the first surface region;
at least one first conductive material formed overlying at least the contact region(s) of the singulated integrated sensor or electronic device; and
at least one second conductive material formed overlying at least a portion of the first conductive material(s).
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Accused Products
Abstract
A method and structure for fabricating sensor(s) or electronic device(s) using vertical mounting with interconnections. The method includes providing a resulting device including at least one sensor or electronic device, formed on a die member, having contact region(s) with one or more conductive materials formed thereon. The resulting device can then be singulated within a vicinity of the contact region(s) to form one or more singulated dies, each having a singulated surface region. The singulated die(s) can be coupled to a substrate member, having a first surface region, such that the singulated surface region(s) of the singulated die(s) are coupled to a portion of the first surface region. Interconnections can be formed between the die(s) and the substrate member with conductive adhesives, solder processes, or other conductive bonding processes.
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Citations
11 Claims
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1. An integrated sensor device or electronic device, the device comprising:
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a substrate member having a first surface region, the substrate member having at least one contact region; at least one singulated integrated sensor or electronic device each coupled to a die member, each die member having a singulated surface region and at least one contact region, the singulated surface region(s) being coupled to the first surface region; at least one first conductive material formed overlying at least the contact region(s) of the singulated integrated sensor or electronic device; and at least one second conductive material formed overlying at least a portion of the first conductive material(s). - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification