Methods of integrating LED chips with heat sinks, and LED-based lighting assemblies made thereby
First Claim
1. A light emitting diode (LED)-based lighting assembly, comprising:
- a heat sink having at least one pedestal integrally formed therewith, the pedestal including an upwardly facing, upper planar surface that is raised in a vertical direction relative to an upwardly facing, lower planar surface of the heat sink;
a printed circuit board (PCB) forming an aperture therein corresponding to the pedestal, the PCB including electrical conductors on an upper surface thereof, the PCB being attached to the lower planar surface such that the upper planar surface extends into the aperture; and
one or more LED chips attached directly to the upper planar surface and electrically connected to the conductors such that light from the one or more LED chips emits upwardly from the upper planar surface;
wherein the pedestal has a height such that the combined height of the pedestal and the one or more LED chips thereon matches a thickness of the PCB.
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Accused Products
Abstract
An LED-based lighting assembly includes a heat sink having at least one pedestal with an upwardly facing, upper planar surface that is raised in a vertical direction relative to an upwardly facing, lower planar surface of the heat sink. A PCB forms an aperture corresponding to the pedestal, includes electrical conductors on an upper surface thereof, and is attached to the lower planar surface. The upper planar surface extends into the aperture, and one or more LED chips attach directly to the upper planar surface and connect to the conductors such that light emits upwardly. A method of integrating LEDs with a heat sink includes mounting a PCB to a planar surface of the heat sink, mounting one or more LED chips to a raised surface of the heat sink that is not covered by the PCB, and electrically connecting the LED chips to conductors on the PCB.
85 Citations
21 Claims
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1. A light emitting diode (LED)-based lighting assembly, comprising:
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a heat sink having at least one pedestal integrally formed therewith, the pedestal including an upwardly facing, upper planar surface that is raised in a vertical direction relative to an upwardly facing, lower planar surface of the heat sink; a printed circuit board (PCB) forming an aperture therein corresponding to the pedestal, the PCB including electrical conductors on an upper surface thereof, the PCB being attached to the lower planar surface such that the upper planar surface extends into the aperture; and one or more LED chips attached directly to the upper planar surface and electrically connected to the conductors such that light from the one or more LED chips emits upwardly from the upper planar surface; wherein the pedestal has a height such that the combined height of the pedestal and the one or more LED chips thereon matches a thickness of the PCB. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A light emitting diode (LED)-based lighting assembly, comprising:
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a heat sink having at least one pedestal integrally formed therewith, the pedestal including an upwardly facing, upper planar surface that is raised in a vertical direction relative to an upwardly facing, lower planar surface of the heat sink; a printed circuit board (PCB) forming an aperture therein corresponding to the pedestal, the PCB including electrical conductors on an upper surface thereof, the PCB being attached to the lower planar surface such that the upper planar surface extends into the aperture; one or more LED chips attached directly to the upper planar surface and electrically connected to the conductors such that light from the one or more LED chips emits upwardly from the upper planar surface; and a first encapsulation material that covers each of the pedestals and each of the one or more LED chips; wherein the PCB acts as a dam to contain the first encapsulation material during dispense of the encapsulation material. - View Dependent Claims (20, 21)
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Specification