Stacked module

• US 8,981,881 B2
• Filed: 01/15/2013
• Issued: 03/17/2015
• Est. Priority Date: 03/28/2012
• Status: Active Grant

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Masuda, Satoshi
• Primary Examiner(s): Donovan, Lincoln
• Assistant Examiner(s): SKIBINSKI, THOMAS S
• Application Number:
  US13/741,730
• Publication Number:
  US 20130257565A1
• Time in Patent Office: 791 Days
• Field of Search: 333245-247, 257/664, 257/728, 257/773, 257/700, 257/723, 361/761, 361/820, 361/600, 361/601, 361/622, 361/679.01
• US Class Current: 333/247
• CPC Class Codes: H01L 2223/6644 Packaging aspects of high-frequency amplifiers
• CPC Class Codes: H01L 2223/6683 for monolithic microwave integrated circuit [MMIC]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/047 the other leads being parallel to the base
• CPC Class Codes: H01L 23/15 Ceramic or glass substrates H01L23/142, H01L23/145, H01L23/147 take precedence
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/49833 the chip support structure consisting of a plurality of insulating substrates
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 25/162 the devices being mounted on two or more different substrates
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H01P 3/02 with two longitudinal conductors
• CPC Class Codes: H05K 1/021 Components thermally connected to metal substrates or heat-sinks by insert mounting
• CPC Class Codes: H05K 1/0215 Grounding of printed circuits by connection to external grounding means
• CPC Class Codes: H05K 1/0243 Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/1056 Metal over component, i.e. metal plate over component mounted on or embedded in PCB
• CPC Class Codes: H05K 3/4697 : having cavities, e.g. for mounting components H05K3/4691 takes precedence

Abstract

A stacked module includes a first multilayer substrate including an opening having a stepwise wall face, and a first transmission line including a first grounding conductor layer, a second multilayer substrate supported on a stepped portion of the stepwise wall face and including a second transmission line including a second grounding conductor layer, a first chip mounted on a bottom of the opening and coupled to a third transmission line provided on the first multilayer substrate, and a second chip mounted on the front face of the second multilayer substrate and coupled to the second transmission line. A face to which the second grounding conductor layer or a fourth grounding conductor layer coupled thereto is exposed is joined to the stepped portion to which the first grounding conductor layer or a third grounding conductor layer coupled thereto is exposed, and the first and second grounding conductor layers are coupled.

Claims

1. A stacked module, comprising:

a first multilayer substrate that includes an opening having a stepwise wall face, and a first transmission line configured from a first line conductor provided on a front face side of a first substrate and a first grounding conductor layer provided on a back face side of the first substrate;

a second multilayer substrate supported on a stepped portion provided on the stepwise wall face of the opening and including a second transmission line configured from a second line conductor provided on a front face side of a second substrate and a second grounding conductor layer provided on a back face side of the second substrate;

a first semiconductor chip mounted on a bottom face of the opening of the first multilayer substrate and electrically coupled to a third transmission line provided on the first multilayer substrate; and

a second semiconductor chip mounted on the front face of the second multilayer substrate and electrically coupled to the second transmission line;

wherein

a face to which the second grounding conductor layer or a fourth grounding conductor layer electrically coupled to the second grounding conductor layer is exposed is joined to the stepped portion provided on the first grounding conductor layer or on the opposite side of the first grounding conductor layer across the substrate on the lower side of the first grounding conductor layer and to which a third grounding conductor layer electrically coupled to the first grounding conductor layer is exposed, and the first grounding conductor layer and the second grounding conductor layer are electrically coupled to each other.

2. The stacked module according to claim 1, wherein the second multilayer substrate includes a projecting portion that has a smaller number of stacked layers at an outer side portion thereof and that projects, at a front face side portion thereof, to the outer side with respect to a back face portion thereof, and

the face to which the second grounding conductor layer or the fourth grounding conductor layer is exposed is the back face of the projecting portion.

3. The stacked module according to claim 2, wherein the back face of the projecting portion to which the second grounding conductor layer is exposed is joined to the stepped portion to which the first grounding conductor layer is exposed, and the first grounding conductor layer and the second grounding conductor layer are electrically coupled to each other.

4. The stacked module according to claim 2, wherein the back face of the projecting portion to which the fourth grounding conductor layer is exposed is joined to the stepped portion to which the first grounding conductor layer is exposed, and the first grounding conductor layer and the second grounding conductor layer are electrically coupled to each other.

5. The stacked module according to claim 4, wherein the second substrate has a thickness smaller than that of the first substrate;

and

the fourth grounding conductor layer is provided on the opposite side of the second grounding conductor layer across a substrate that has a thickness smaller than that of the first substrate on the lower side of the second grounding conductor layer.

6. The stacked module according to claim 2, wherein the back face of the projecting portion to which the second grounding conductor layer is exposed is joined to the stepped portion to which the third grounding conductor layer is exposed, and the first grounding conductor layer and the second grounding conductor layer are electrically coupled to each other.

7. The stacked module according to claim 2, wherein the back face of the projecting portion to which the fourth grounding conductor layer is exposed is joined to the stepped portion to which the third grounding conductor layer is exposed, and the first grounding conductor layer and the second grounding conductor layer are electrically coupled to each other.

8. The stacked module according to claim 1, wherein the bottom face of the second multilayer substrate to which the fourth grounding conductor layer is exposed is joined to the stepped portion to which the first grounding conductor layer is exposed, and the first grounding conductor layer and the second grounding conductor layer are electrically coupled to each other.

9. The stacked module according to claim 1, wherein the face to which the second grounding conductor layer or the fourth grounding conductor layer is exposed is joined by soldering to the stepped portion to which the first grounding conductor layer or the third grounding conductor layer is exposed, and the first grounding conductor layer and the second grounding conductor layer are electrically coupled to each other.

10. The stacked module according to claim 1, wherein a grounding conductor layer is formed on the back face of the second multilayer substrate.

11. The stacked module according to claim 1, wherein a transmission or reception semiconductor chip is provided as the first semiconductor chip;

and

a reception or transmission semiconductor chip is provided as the second semiconductor chip.