Lightweight audio system for automotive applications and method

• US 8,982,561 B2
• Filed: 05/28/2013
• Issued: 03/17/2015
• Est. Priority Date: 08/18/2006
• Status: Expired due to Fees

• Current Assignee: Aptiv Technologies Limited (Aptiv PLC)
• Original Assignee: Delphi Technologies, Inc. (BorgWarner Incorporated)
• Inventors: Snider, Chris R., Gupta, Vineet, Huntzinger, Joseph K., Coady, Michael G., Stapert, Curtis Allen, Meyer, Kevin Earl, Garner, Timothy D., Oberlin, Allen E.
• Primary Examiner(s): Chen, Xiaoliang
• Application Number:
  US13/903,335
• Publication Number:
  US 20140160683A1
• Time in Patent Office: 658 Days
• Field of Search: 361/704, 361/697, 361/709, 361/752, 361/760, 439/66, 439/72, 257/177, 257/666, 257/693, 257/787
• US Class Current: 361/704
• CPC Class Codes: B29C 59/16 by wave energy or particle radiation , e.g. infrared heating B29C59/007 takes precedence
• CPC Class Codes: B60R 11/02 for radio sets, television sets, telephones, or the like; Arrangement of controls thereof
• CPC Class Codes: G06F 11/00 Error detection; Error correction; Monitoring error detection, correction or monitoring in information storage based on relative movement between record carrier and transducer G11B20/18; monitoring, i.e. supervising the progress of recording or reproducing G11B27/36; in static stores G11C29/00
• CPC Class Codes: H04B 1/082 to be used in vehicles H04B1/086 takes precedence; holding or mounting accessories B60R11/02
• CPC Class Codes: H04R 1/02 Casings; Cabinets ; Supports therefor; Mountings therein H04R1/28 takes precedence ; attachments for microphones H04R1/08; mounting of transducers in earpieces H04R1/1075
• CPC Class Codes: H05K 1/0215 Grounding of printed circuits by connection to external grounding means
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 13/00 Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
• CPC Class Codes: H05K 2201/09081 Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
• CPC Class Codes: H05K 2201/10386 Clip leads; Terminals gripping the edge of a substrate
• CPC Class Codes: H05K 2201/10446 Mounted on an edge
• CPC Class Codes: H05K 5/0217 Mechanical details of casings covers, lids, hoods or members for covering apertures H05K5/03
• CPC Class Codes: H05K 5/0221 Locks; Latches
• CPC Class Codes: H05K 5/0226 Hinges
• CPC Class Codes: H05K 7/20409 Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
• CPC Class Codes: H05K 7/20418 the radiating structures being additional and fastened onto the housing
• CPC Class Codes: H05K 7/20436 Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
• CPC Class Codes: H05K 9/0007 Casings standardised racks H05K9/0062
• CPC Class Codes: H05K 9/0047 being rigid plastic containers having conductive particles, fibres or mesh embedded therein
• CPC Class Codes: H05K 9/0079 Electrostatic discharge protection, e.g. ESD treated surface for rapid dissipation of charges
• CPC Class Codes: H05K 9/0081 : Electromagnetic shielding materials, e.g. EMI, RFI shielding H05K9/0003 takes precedence
• CPC Class Codes: Y10T 29/49002 : Electrical device making
• CPC Class Codes: Y10T 29/49124 : On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49126 : Assembling bases
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49169 : Assembling electrical component directly to terminal or elongated conductor
• CPC Class Codes: Y10T 29/49172 : by molding of insulating material
• CPC Class Codes: Y10T 29/4957 : Sound device making
• CPC Class Codes: Y10T 29/49826 : Assembling or joining
• CPC Class Codes: Y10T 29/49861 : Sizing mating parts during final positional association
• CPC Class Codes: Y10T 29/5313 : Means to assemble electrical device
• CPC Class Codes: Y10T 403/70 : Interfitted members
• CPC Class Codes: Y10T 428/24289 : Embedded or interlocked
• CPC Class Codes: Y10T 74/20396 : Hand operated

Abstract

A lightweight radio/CD player for vehicular application includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips.

Claims

1. A thermal control apparatus for an electrical assembly comprising:

a heat-generating component including a case and a leadframe;

a substrate mechanically and electrically supporting said component by the leadframe;

a convector disposed in abutting relationship with a heat liberating surface of said case; and

an elongated spring clip having a first end portion rigidly affixed to said substrate and a second end portion abutting said case to continuously urge said case into intimate contact with said convector.

2. The thermal control apparatus of claim 1, further comprising a housing substantially enclosing said heat-generating component and formed of thermally insulating material including an outwardly opening port in a wall thereof.

3. The thermal control apparatus of claim 2, wherein said convector is mounted externally of said wall and includes a recessed portion extending inwardly through said port to establish a thermally conductive coupling with said component.

4. The thermal control apparatus of claim 1, wherein said heat-generating component comprises an electronic device electrically and mechanically affixed to said substrate by said leadframe, said leadframe defining said spring clip.

5. The thermal control apparatus of claim 1, further comprising a system of cooperating self-engaging element pairs integrally formed with said housing and convector to affect fastenerless assembly thereof.

6. The thermal control apparatus of claim 3, wherein the recessed portion of said convector defines an inwardly facing surface abutting said heat-generating component.

7. The thermal control apparatus of claim 3, wherein the recessed portion of said convector defines an outwardly opening pocket.

8. The thermal control apparatus of claim 7, wherein said pocket is at least partially filled with thermally conductive material.

9. The thermal control apparatus of claim 1, wherein said housing defines at least one opening therein to affect convective airflow within said housing.

10. The thermal control apparatus of claim 9, wherein said housing is formed of a composite of relatively rigid polymer material and electrically conductive open mesh wire screen insert molded into said polymer material, said wire screen substantially overlaying said opening while permitting relatively unobstructed air flow therethrough.

11. The thermal control apparatus of claim 9, wherein said at least one opening is disposed in an upper portion of said housing to affect the exhaust of heated air from within said housing.

12. The thermal control apparatus of claim 9, wherein said at least one opening is disposed in a lower portion of said housing to affect the intake of relatively cool ambient air into said housing.

13. The thermal control device of claim 1, further comprising means operative to mechanically affix said heat-generating component to said convector.

14. The thermal control device of claim 13, wherein said means operative to mechanically affix said heat-generating component to said convector is externally applied.