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Contact and contactless differential I/O pads for chip-to-chip communication and wireless probing

  • US 8,982,574 B2
  • Filed: 05/24/2012
  • Issued: 03/17/2015
  • Est. Priority Date: 12/29/2010
  • Status: Expired due to Fees
First Claim
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1. A coupling structure comprising:

  • a first substrate;

    a first differential pad and a second differential pad arranged as a pair and coupled to the first substrate;

    an insulating layer having opposing top and bottom surfaces, the bottom surface coupled to the first and second differential pads;

    a first mating differential pad and a second mating differential pad arranged as a pair and coupled to the top surface of the insulating layer, the first and second mating differential pads being aligned with the first and second differential pads, respectively;

    a circuit connected to the first and second differential pads and configured to provide differential signals based upon a first signal to the first and second differential pads, the circuit comprisingan input amplifier having an output,differential signal circuitry coupled to the output of the input amplifier, andan output amplifier having an input coupled to the differential signal circuitry,an ohmic-type contact pad coupled to the first substrate and configured to receive a second signal representative of the first signal; and

    a mating ohmic-type contact pad in direct ohmic contact with the ohmic-type contact pad.

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