Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system
First Claim
1. A semiconductor device comprising:
- a semiconductor chip provided on a substrate and capable of millimeter-wave band communication;
an antenna structure connected to the semiconductor chip;
an insulating member configured to cover the semiconductor chip; and
a millimeter wave transmission member made of a dielectric material including a dielectric capable of millimeter wave signal transmission and matched with the antenna structure.
1 Assignment
0 Petitions
Accused Products
Abstract
Provided is an in-millimeter-wave dielectric transmission device. The in-millimeter-wave dielectric transmission device includes a semiconductor chip provided on one interposer substrate and capable of in-millimeter-wave dielectric transmission, an antenna structure connected to the semiconductor chip, two semiconductor packages including a molded resin configured to cover the semiconductor chip and the antenna structure, and a dielectric transmission path provided between the two semiconductor packages to transmit a millimeter wave signal. The semiconductor packages are mounted such that the antenna structures thereof are arranged with the dielectric transmission path interposed therebetween.
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Citations
9 Claims
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1. A semiconductor device comprising:
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a semiconductor chip provided on a substrate and capable of millimeter-wave band communication; an antenna structure connected to the semiconductor chip; an insulating member configured to cover the semiconductor chip; and a millimeter wave transmission member made of a dielectric material including a dielectric capable of millimeter wave signal transmission and matched with the antenna structure. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of manufacturing a semiconductor device, the method comprising the steps of:
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forming a semiconductor chip capable of millimeter-wave band communication on a substrate; connecting an antenna structure to the semiconductor chip formed on the substrate; insulating the semiconductor chip by covering the semiconductor chip with an insulating member; and matching the antenna structure with a millimeter wave transmission member using a dielectric material including a dielectric capable of millimeter wave signal transmission. - View Dependent Claims (9)
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Specification