Method for manufacturing fabric type circuit board
First Claim
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1. A method for manufacturing a fabric type circuit board, comprising:
- forming a metal plating layer on a base substrate;
forming a circuit pattern by etching the metal plating layer;
bonding a carrier film on the circuit pattern;
bonding an adhesive film directly below the circuit pattern after removing the base substrate; and
transferring the circuit pattern by bonding the adhesive film to a fabric, thereby manufacturing the fabric type circuit board.
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Abstract
Methods for manufacturing a fabric-type circuit board, including: forming a metal plating layer on a base substrate, forming a circuit pattern by etching the metal plating layer, bonding a carrier film on the circuit pattern, and bonding an adhesive film directly below the circuit pattern after removing the base substrate; or bonding an adhesive film to a metal thin film, forming a circuit pattern by etching the metal thin film, and bonding a carrier film on the circuit pattern. In either case, the circuit pattern is transferred to a fabric by bonding the adhesive film to the fabric.
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Citations
19 Claims
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1. A method for manufacturing a fabric type circuit board, comprising:
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forming a metal plating layer on a base substrate; forming a circuit pattern by etching the metal plating layer; bonding a carrier film on the circuit pattern; bonding an adhesive film directly below the circuit pattern after removing the base substrate; and transferring the circuit pattern by bonding the adhesive film to a fabric, thereby manufacturing the fabric type circuit board. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method for manufacturing a fabric type circuit board, comprising:
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bonding an adhesive film to a metal thin film; forming a circuit pattern by etching the metal thin film; bonding a carrier film on the circuit pattern; and transferring the circuit pattern by bonding the adhesive film to a fabric, thereby manufacturing the fabric type circuit board. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19)
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Specification