Substrate laser oxide removal process followed by electro or immersion plating

• US 8,985,050 B2
• Filed: 11/05/2010
• Issued: 03/24/2015
• Est. Priority Date: 11/05/2009
• Status: Active Grant

• Current Assignee: Trustees Of Columbia University In The City Of New York (Columbia University)
• Original Assignee: Trustees Of Columbia University In The City Of New York (Columbia University)
• Inventors: Von Gutfeld, Robert J
• Primary Examiner(s): Yuan, Dah-Wei D
• Assistant Examiner(s): Pence, Jethro M
• Application Number:
  US12/940,703
• Publication Number:
  US 20110104396A1
• Time in Patent Office: 1,600 Days
• Field of Search: None
• US Class Current: 118/620
• CPC Class Codes: B05C 1/06 by rubbing contact, e.g. by brushes, by pads brushes in general A46B
• CPC Class Codes: B05D 3/06 by exposure to radiation B05D3/02 takes precedence ; plasma treatment B05D3/141
• CPC Class Codes: C25D 17/00 Constructional parts, or assemblies thereof, of cells for electrolytic coating
• CPC Class Codes: C25D 5/34 Pretreatment of metallic surfaces to be electroplated
• CPC Class Codes: C25D 5/36 of iron or steel
• CPC Class Codes: C25D 5/38 of refractory metals or nickel
• CPC Class Codes: C25D 5/44 Aluminium

Abstract

Method of ablating the surface of a substrate including providing a dry substrate and an electrolyte source, ablating the surface of the dry substrate to at least partially remove a native oxide layer, and immersing the ablated dry substrate in the electrolyte source, in which the dry substrate is ablated prior to being introduced into the electrolyte source. Also provided is a method of ablating the surface of a substrate that includes providing a dry substrate and an electrolyte, depositing a portion of the electrolyte on the substrate at a thickness of less than 10 microns and ablating the surface of the substrate with the electrolyte applied thereon. System for use in the ablation of the surface of a substrate are also provided.

Claims

1. A system for use in the ablation of the surface of a substrate using a first plating solution source and a second plating solution source, comprising:

(a) a laser to provide a laser beam;

(b) a substrate having a native oxide layer on a surface thereof; and

(c) a conveyor to direct the substrate towards the first plating solution source and from the first plating solution source to the second plating solution source; and

(d) a support block configured to reduce movement of the substrate from the laser beam impingement on the substrate,

wherein the laser and substrate are configured such that the laser beam contacts the substrate in a dry form in air to at least partially remove the native oxide layer prior to the substrate being introduced to the first plating solution source, and

wherein the conveyor is adapted to direct the substrate at a speed to reduce re-oxidation of the substrate between where the laser beam strikes the substrate and the first plating solution source.

2. The system of claim 1, wherein the first plating solution source comprises a first container of the plating solution and the second plating solution source comprises a second container of the plating solution.

3. The system of claim 2, wherein the first container of the plating solution includes a plating solution air interface, and the distance between where the laser beam strikes the substrate and the plating solution air interface is from 5 mm to 15 mm.

4. The system of claim 1, wherein the first plating solution source comprises a first wetting pad and the second plating solution source comprises a second wetting pad.

5. The system of claim 4, wherein the distance between where the laser beam strikes the substrate and the first wetting pad is from 5 mm to 15 mm.

6. A system for use in the ablation of the surface of a substrate comprising:

(a) a laser to provide a laser beam;

(b) a substrate having a native oxide layer on a surface thereof;

(c) a first wetting pad that includes an plating solution and a second wetting pad that includes the plating solution;

(d) a support block configured to reduce movement of the substrate from the laser beam impingement on the substrate; and

(e) a conveyor to direct the substrate towards the first wetting pad and from the first wetting pad to the second wetting pad;

wherein the laser and substrate are configured such that the laser beam contacts the substrate after a thin layer of the plating solution is deposited on the substrate by being introduced to the first wetting pad to at least partially remove the native oxide layer and prior to the substrate being introduced to the second wetting pad, and

wherein the conveyor is configured to direct the substrate at a speed to reduce re-oxidation of the substrate between where the laser beam strikes the substrate and the second wetting pad.

7. The system of claim 6, wherein the first and second wetting pads are each configured to deposit the plating solution on the substrate at a thickness of from 200 nm to 10 microns.