Etching apparatus
First Claim
1. An etching apparatus for performing etching of an etching target film of a substrate by using processing gases that include a first processing gas and a second processing gas, the etching apparatus comprising:
- a processing chamber in which a susceptor for mounting the substrate thereon is disposed;
at least one first gas supply source containing a first gas that includes at least one of a CH2F2 gas, a CHF3 gas, CF4 gas or a C2F6 gas;
at least one second gas supply source containing a second gas that includes at least one of a C3F8 gas, a C4F8 gas, a C4F6 gas, or a C5F8 gas;
at least one mixing arrangement which mixes the gas and the second gas to form the first processing gas and the second processing gas, wherein each of the first processing gas and the second processing gas is a gaseous mixture of the first gas and the second gas;
a gas supply unit, disposed in the processing chamber to face the susceptor, for simultaneously supplying the first processing gas and the second processing gas, the gas supply unit having a gas supply surface facing the susceptor;
a first gas introduction line connected to a central portion of the gas supply unit for supplying the first processing gas to the central portion of the gas supply unit;
a second gas introduction line connected to a peripheral portion of the gas supply unit for supplying the second processing gas to the peripheral portion of the gas supply unit;
a first flow rate control unit disposed at the first gas introduction line;
a second flow rate control unit disposed at the second gas introduction line; and
a controller for controlling the supply of the first processing gas and the second processing gas,wherein the gas supply unit comprises a first gas introduction chamber for supplying the first processing gas to a central part of the substrate and a second gas introduction chamber for supplying the second processing gas to a peripheral part of the substrate,wherein the controller is programmed to control the supplying of the first processing gas and the second processing gas such that a flow rate of the first gas from the gas supply unit per unit area of the gas supply surface of the gas supply unit is greater in the central portion than in the peripheral portion and, simultaneously, a flow rate of the second gas from the gas supply unit per unit area of the gas supply surface of the gas supply unit is greater in the peripheral portion than in the central portion.
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Accused Products
Abstract
When a substrate is etched by using a processing gas including a first gas containing halogen and carbon and having a carbon number of two or less per molecule, while supplying the processing gas toward the substrate independently from a central and a peripheral portion of a gas supply unit, which face the central and the periphery part of the substrate respectively, the processing gas is supplied such that a gas flow rate is greater in the central portion than in the peripheral portion. When the substrate is etched by using a processing gas including a second gas containing halogen and carbon and having a carbon number of three or more per molecule, the processing gas is supplied such that a gas flow rate is greater in the peripheral portion than in the central portion.
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Citations
10 Claims
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1. An etching apparatus for performing etching of an etching target film of a substrate by using processing gases that include a first processing gas and a second processing gas, the etching apparatus comprising:
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a processing chamber in which a susceptor for mounting the substrate thereon is disposed; at least one first gas supply source containing a first gas that includes at least one of a CH2F2 gas, a CHF3 gas, CF4 gas or a C2F6 gas; at least one second gas supply source containing a second gas that includes at least one of a C3F8 gas, a C4F8 gas, a C4F6 gas, or a C5F8 gas; at least one mixing arrangement which mixes the gas and the second gas to form the first processing gas and the second processing gas, wherein each of the first processing gas and the second processing gas is a gaseous mixture of the first gas and the second gas; a gas supply unit, disposed in the processing chamber to face the susceptor, for simultaneously supplying the first processing gas and the second processing gas, the gas supply unit having a gas supply surface facing the susceptor; a first gas introduction line connected to a central portion of the gas supply unit for supplying the first processing gas to the central portion of the gas supply unit; a second gas introduction line connected to a peripheral portion of the gas supply unit for supplying the second processing gas to the peripheral portion of the gas supply unit; a first flow rate control unit disposed at the first gas introduction line; a second flow rate control unit disposed at the second gas introduction line; and a controller for controlling the supply of the first processing gas and the second processing gas, wherein the gas supply unit comprises a first gas introduction chamber for supplying the first processing gas to a central part of the substrate and a second gas introduction chamber for supplying the second processing gas to a peripheral part of the substrate, wherein the controller is programmed to control the supplying of the first processing gas and the second processing gas such that a flow rate of the first gas from the gas supply unit per unit area of the gas supply surface of the gas supply unit is greater in the central portion than in the peripheral portion and, simultaneously, a flow rate of the second gas from the gas supply unit per unit area of the gas supply surface of the gas supply unit is greater in the peripheral portion than in the central portion. - View Dependent Claims (2, 3, 4, 5)
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6. An etching apparatus for performing etching of an etching target film of a substrate by using processing gases that include a first processing gas and a second processing gas, the etching apparatus comprising:
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a processing chamber in which a susceptor for mounting the substrate thereon is disposed; at least one first gas supply source containing a first gas that includes a halogen and carbon having a carbon number of two or less per molecule; at least one second gas supply source containing a second gas that includes a halogen and carbon having a carbon number of three or more per molecule; a gas supply unit, disposed in the processing chamber to face the susceptor, for simultaneously supplying the first processing gas and the second processing gas, the gas supply unit haying a gas supply surface facing the susceptor; a controller; a first gas mixing arrangement that mixes the first gas and the second gas to form the first processing gas, wherein the controller controls the first gas mixing arrangement to control a mixing ratio of the first gas to the second gas in the first processing gas; a second gas mixing arrangement that mixes the first gas and the second gas to form the second processing gas, wherein the controller controls the second gas mixing arrangement to control a mixing ratio of the first gas to the second gas in the second processing gas, and wherein the mixing ratio of the first gas to the second gas in the first processing gas is different than the mixing ratio of the first gas to the second gas in the second processing gas; a first gas introduction line connecting an outlet of the first gas mixing arrangement to an inlet of a central portion of the gas supply unit for supplying the first processing gas to the central portion of the gas supply unit; a second gas introduction line connecting an outlet of the second gas mixing arrangement to an inlet of a peripheral portion of the gas supply unit for supplying the second processing gas to the peripheral portion of the gas supply unit; a first downstream flow rate control unit disposed at the first gas introduction line and configured to control a flow rate of the first processing gas downstream of the first gas mixing arrangement; a second downstream flow rate control unit disposed at the second gas introduction line and configured to control a flow rate of the second processing gas downstream of the second gas mixing arrangement, wherein the gas supply unit comprises a first gas introduction chamber for supplying the first processing gas to a central part of the substrate and a second gas introduction chamber for supplying the second processing gas to a peripheral part of the substrate, wherein the controller is programmed to control the first gas mixing arrangement, the second gas mixing arrangement, the first downstream flow rate control unit, and the second downstream flow rate control unit such that a flow rate of the first gas per unit area of the gas supply surface of the gas supply unit is greater in the central portion than in the peripheral portion and, simultaneously, a flow rate of the second gas per unit area of the gas supply surface of the gas supply unit is greater in the peripheral portion than in the central portion. - View Dependent Claims (7, 8, 9, 10)
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Specification