Semiconductor light-emitting device and method for manufacturing same
First Claim
1. A method for manufacturing a semiconductor light-emitting device, comprising:
- forming a multilayer body including a first semiconductor layer having a first major surface and a second major surface which is an opposite side from the first major surface, a second semiconductor layer including a light-emitting layer laminated on the second major surface of the first semiconductor layer, and electrodes formed on the second major surface of the first semiconductor layer and on a surface of the second semiconductor layer on an opposite side from the first semiconductor layer;
forming a groove through the first semiconductor layer;
forming a phosphor layer on the first major surface and on a side surface of the first semiconductor layer in the groove; and
forming an insulating layer on the second major surface of the first semiconductor layer and on the electrodes, the insulating layer having a first surface above a lower surface of the second semiconductor layer and a second surface which is an opposite side from the first surface, whereinthe first semiconductor layer and the second semiconductor layer are formed on a substrate,the substrate is removed after the forming the insulating layer,the groove is formed after the removing the substrate.
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Abstract
A method for manufacturing a semiconductor light-emitting device includes forming a multilayer body including a first semiconductor layer having a first major surface and a second major surface which is an opposite side from the first major surface, a second semiconductor layer including a light-emitting layer laminated on the second major surface of the first semiconductor layer, and electrodes formed on the second major surface of the first semiconductor layer and on a surface of the second semiconductor layer on an opposite side from the first semiconductor layer. The method includes forming a groove through the first semiconductor layer. The method includes forming a phosphor layer on the first major surface and on a side surface of the first semiconductor layer in the groove.
23 Citations
10 Claims
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1. A method for manufacturing a semiconductor light-emitting device, comprising:
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forming a multilayer body including a first semiconductor layer having a first major surface and a second major surface which is an opposite side from the first major surface, a second semiconductor layer including a light-emitting layer laminated on the second major surface of the first semiconductor layer, and electrodes formed on the second major surface of the first semiconductor layer and on a surface of the second semiconductor layer on an opposite side from the first semiconductor layer; forming a groove through the first semiconductor layer; forming a phosphor layer on the first major surface and on a side surface of the first semiconductor layer in the groove; and forming an insulating layer on the second major surface of the first semiconductor layer and on the electrodes, the insulating layer having a first surface above a lower surface of the second semiconductor layer and a second surface which is an opposite side from the first surface, wherein the first semiconductor layer and the second semiconductor layer are formed on a substrate, the substrate is removed after the forming the insulating layer, the groove is formed after the removing the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method for manufacturing a semiconductor light-emitting device, comprising:
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forming a multilayer body including a first semiconductor layer having a first major surface and a second major surface which is an opposite side from the first major surface, a second semiconductor layer including a light-emitting layer laminated on the second major surface of the first semiconductor layer, and electrodes formed on the second major surface of the first semiconductor layer and on a surface of the second semiconductor layer on an opposite side from the first semiconductor layer; forming a groove through the first semiconductor layer; forming a phosphor layer on the first major surface and on a side surface of the first semiconductor layer in the groove; and forming an insulating layer on the second major surface of the first semiconductor layer and on the electrodes, the insulating layer having a first surface above a lower surface of the second semiconductor layer and a second surface which is an opposite side from the first surface, wherein the groove is reached to the first surface of the insulating layer through the first semiconductor layer.
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10. A method for manufacturing a semiconductor light-emitting device, comprising:
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forming a multilayer body including a first semiconductor layer having a first major surface and a second major surface which is an opposite side from the first major surface, a second semiconductor layer including a light-emitting layer laminated on the second major surface of the first semiconductor layer, and electrodes formed on the second major surface of the first semiconductor layer and on a surface of the second semiconductor layer on an opposite side from the first semiconductor layer; forming a groove through the first semiconductor layer; forming a phosphor layer on the first major surface and on a side surface of the first semiconductor layer in the groove; and forming an insulating layer on the second major surface of the first semiconductor layer and on the electrodes, the insulating layer having a first surface above a lower surface of the second semiconductor layer and a second surface which is an opposite side from the first surface, wherein the phosphor layer is formed on the first surface of the insulating layer and is not formed on a side surface of the insulating layer.
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Specification