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MEMS package and a method for manufacturing the same

  • US 8,987,030 B2
  • Filed: 08/13/2010
  • Issued: 03/24/2015
  • Est. Priority Date: 08/13/2009
  • Status: Active Grant
First Claim
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1. A method of manufacturing a plurality of MEMS transducer packages, the method comprising the steps of:

  • applying a first material for coupling two or more discrete covers to a substrate;

    positioning the two or more covers onto the substrate to create one or more channels bounded by the two or more covers and the substrate, each of the two or more covers comprising four side portions and a top portion forming an interior region between each cover and the substrate, such that the side portions of each cover form a physical barrier between each interior region and the channels;

    coupling the covers to the substrate;

    depositing a second material onto the substrate in the one or more channels;

    performing a process on the second material to affix the second material; and

    singulating along the channels to create the plurality of MEMS transducer packages.

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