Packaged light detector semiconductor devices with non-imaging optical concentrators for ambient light and/or optical proxmity sensing, methods for manufacturing the same, and systems including the same

• US 8,987,658 B2
• Filed: 12/17/2012
• Issued: 03/24/2015
• Est. Priority Date: 11/28/2012
• Status: Active Grant

• Current Assignee: Intersil Americas LLC (Renesas Electronics Corporation)
• Original Assignee: Intersil Americas LLC (Renesas Electronics Corporation)
• Inventors: Earman, Allen M., Wiese, Lynn K.
• Primary Examiner(s): Epps, Georgia Y
• Assistant Examiner(s): Moore, Carolynn A
• Application Number:
  US13/716,842
• Publication Number:
  US 20140145069A1
• Time in Patent Office: 827 Days
• Field of Search: 250/239, 250/216, 250/214.1, 250/208.1, 250/221, 250/203.4, 257290-294, 257431-435, 257 80- 85, 359/853
• US Class Current: 250/239
• CPC Class Codes: G01J 1/0403 Mechanical elements; Supports for optical elements; Scanning arrangements
• CPC Class Codes: G01J 1/0422 using light concentrators, collectors or condensers
• CPC Class Codes: G01J 1/4204 with determination of ambient light solar light G01J2001/4266
• CPC Class Codes: G02B 19/0028 refractive and reflective surfaces, e.g. non-imaging catadioptric systems
• CPC Class Codes: G02B 19/0076 for use with a detector G02B19/009, G02B19/0095 take precedence
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02327 the optical elements being integrated or being directly associated to the device, e.g. back reflectors optical coatings H01L31/0216
• CPC Class Codes: H01L 31/1876 Particular processes or apparatus for batch treatment of the devices
• CPC Class Codes: H03K 17/941 using an optical detector H03K17/968 takes precedence

Abstract

Packaged light detector semiconductor devices (PLDSDs), methods for manufacturing PLDSDs, and systems including a PLDSD are described herein. In an embodiment, a PLDSD includes a light detector die having a surface including an active photosensor region, and a non-imaging optical concentrator including an entrance aperture and an exit aperture axially aligned with one another and with the active photosensor region. A molding material forms the non-imaging optical concentrator and encapsulates at least a portion of the surface of the light detector die that extends beyond the exit aperture of the non-imaging optical concentrator. The non-imaging optical concentrator concentrates light from the entrance aperture toward the exit aperture and onto the active photosensor region. In certain embodiments, a reflective material is disposed on an inner surface of the non-imaging optical concentrator, and a light transmissive molding material fills at least a portion of an inner volume of the non-imaging optical concentrator.

Claims

1. A packaged light detector semiconductor device, comprising:

a light detector die having a surface including an active photosensor region;

a non-imaging optical concentrator including an entrance aperture and an exit aperture axially aligned with one another and with the active photosensor region; and

a molding material that forms the non-imaging optical concentrator and encapsulates at least a portion of the surface of the light detector die that extends beyond the exit aperture of the non-imaging optical concentrator.

2. The device of claim 1, wherein:

the active photosensor region is adjacent the exit aperture of the non-imaging optical concentrator; and

the entrance aperture and the exit aperture of the non-imaging optical concentrator are separated by an axial distance that is substantially equal to an axial distance between the entrance aperture and the active photosensor region.

3. The device of claim 1, wherein:

the non-imaging optical concentrator is adapted to concentrate light from the entrance aperture toward the exit aperture and onto the active photosensor region.

4. The device of claim 3, further comprising:

an optical filter between the active photosensor region and the exit aperture of the non-imaging optical concentrator;

wherein the optical filter is adapted to at least one of absorb or reflect at least some wavelengths of light before the light reaches the active photosensor region.

5. The device of claim 1, further comprising:

a reflective material disposed on an inner surface of the non-imaging optical concentrator.

6. The device of claim 1, wherein:

the molding material, that forms the non-imaging optical concentrator and encapsulates at least a portion of the first surface of the light detector die that extends beyond the exit aperture of the non-imaging optical concentrator, comprises an opaque molding material; and

further comprising a light transmissive molding material that fills at least a portion of an inner volume of the non-imaging optical concentrator.

7. The device of claim 6, wherein the light transmissive molding material fills the inner volume of the non-imaging optical concentrator such that a top surface of the opaque molding material and a top surface of the light transmissive molding material are substantially flush with one another.

8. The device of claim 1, wherein the non-imaging optical concentrator comprises a compound parabolic concentrator (CPC).

9. The device of claim 1, further comprising:

die contacts on the light detector die;

package contacts remote from the light detector die; and

bond wires that electrically connect the die contacts on the light detector die to the package contacts remote from the light detector die;

wherein the molding material, that forms the non-imaging optical concentrator and encapsulates portions of the first surface of the light detector die that extend beyond the exit aperture of the non-imaging optical concentrator, also encapsulates the die contacts, the bond wires and at least a portion of the package contacts.

10. The device of claim 1, wherein:

an area of the exit aperture is substantially the same as or smaller than an area of the active photosensor region so that substantially all of the light that reaches the exit aperture is directed toward the active photosensor region.

11. The device of claim 1, wherein an area of the exit aperture and an area of the active photosensor region are within 20% of one another.

12. The device of claim 1, further comprising:

a second active photosensor region; and

a second non-imaging optical concentrator including a second entrance aperture and a second exit aperture axially aligned with one another and with the second active photosensor region;

wherein the surface of the light detector die includes both the active photosensor region and the second active photosensor region, which are spaced apart from one another;

wherein the molding material forms both the non-imaging optical concentrator and the second non-imaging optical concentrator and encapsulates portions of the surface of the light detector die that extend beyond the exit aperture of the non-imaging optical concentrator and the second exit aperture of the second non-imaging optical concentrator; and

wherein one of the active photosensor regions is for use as an ambient light sensor, and the other one of the active photosensor regions is for use as part of an optical proximity sensor.

13. A method for manufacturing a packaged light detector semiconductor device that comprises a light detector die having a surface including an active photosensor region, the method comprising:

(a) molding, from a molding material, a non-imaging optical concentrator including an entrance aperture and an exit aperture axially aligned with one another and with the active photosensor region; and

(b) encapsulating, with the molding material, at least a portion of the surface of the light detector die that extends beyond the exit aperture of the non-imaging optical concentrator.

14. The method of claim 13, wherein steps (a) and (b) are simultaneously performed.

15. The method of claim 13, further comprising:

(c) depositing a reflective material on an inner surface of the non-imaging optical concentrator.

16. The method of claim 15, further comprising:

(d) filling at least a portion of an inner volume of the non-imaging optical concentrator with a further molding material, wherein the further molding material is light transmissive.

17. The method of claim 16, wherein:

a surface of the light detector die also includes a second active photosensor region;

step (a) also comprises molding, from the molding material, a second non-imaging optical concentrator including a second entrance aperture and a second exit aperture axially aligned with one another and with the second active photosensor region; and

step (b) includes encapsulating, with the molding material, portions of the surface of the light detector die that extend beyond the exit aperture of the non-imaging optical concentrator and the second exit aperture of the second non-imaging optical concentrator; and

wherein one of the active photosensor regions is for use as an ambient light sensor, and the other one of the active photosensor regions is for use as part of an optical proximity sensor.

18. A method for manufacturing a plurality of packaged light detector semiconductor devices each of which comprises a light detector die including at least one active photosensor region, the method comprising:

(a) attaching each of a plurality of the light detector dies to a package substrate;

(b) electrically connecting the light detector dies to package contacts of the package substrate;

(c) molding, from a molding material, at least one non-imaging optical concentrator for each light detector die of the plurality of light detector dies, wherein each non-imaging optical concentrator includes an entrance aperture and an exit aperture axially aligned with one another and with an active photosensor region of one of the light detector dies;

(d) depositing a reflective material on an inner surface of each of the non-imaging optical concentrators;

(e) filling at least a portion of an inner volume of each of the non-imaging optical concentrators with a further molding material, wherein the further molding material is light transmissive; and

(f) performing singulation to thereby separate the package substrate and molding material into a plurality of separate packaged light detector semiconductor devices each of which comprises one of the light detector dies and a corresponding non-imaging optical concentrator that is at least partially filled with the light transmissive further molding material.

19. A system, comprising:

a packaged light detector semiconductor device configured to produce an output signal indicative of detected light; and

a subsystem that is at least one of enabled, disabled or adjusted in dependence on the output signal produced by the packaged light detector semiconductor device;

wherein the packaged light detector semiconductor device includes a light detector die having a surface including an active photosensor region;

a non-imaging optical concentrator including an entrance aperture and an exit aperture axially aligned with one another and with the active photosensor region; and

a molding material that forms the non-imaging optical concentrator and encapsulates at least a portion of the surface of the light detector die that extends beyond the exit aperture of the non-imaging optical concentrator.

20. The system of claim 19, further comprising:

at least one of a comparator or a processor configured to

perform a comparison of the output signal, indicative of detected light, to one or more thresholds, and

at least one of enable, disable or adjust the subsystem based on results of the comparison.