Reflective bank structure and method for integrating a light emitting device
First Claim
Patent Images
1. A method for integrating a light emitting device comprising:
- picking up a micro LED device from a carrier substrate with a transfer head;
placing the micro LED device within a reflective bank structure formed in a bank layer;
releasing the micro LED device from the transfer head;
applying a passivation layer over the bank layer and laterally around the micro LED device within the reflective bank structure, wherein a conductive line is elevated above the reflective bank structure;
hardening the passivation layer; and
etching the passivation layer, such that a top surface of the micro LED device and a top surface of the conductive line are not covered by the passivation layer, and a portion of the micro LED device and the conductive line protrude above a top surface of the passivation layer after etching the passivation layer.
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Abstract
Light emitting devices and methods of integrating micro LED devices into light emitting device are described. In an embodiment a light emitting device includes a reflective bank structure within a bank layer, and a conductive line atop the bank layer and elevated above the reflective bank structure. A micro LED device is within the reflective bank structure and a passivation layer is over the bank layer and laterally around the micro LED device within the reflective bank structure. A portion of the micro LED device and a conductive line atop the bank layer protrude above a top surface of the passivation layer.
316 Citations
22 Claims
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1. A method for integrating a light emitting device comprising:
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picking up a micro LED device from a carrier substrate with a transfer head; placing the micro LED device within a reflective bank structure formed in a bank layer; releasing the micro LED device from the transfer head; applying a passivation layer over the bank layer and laterally around the micro LED device within the reflective bank structure, wherein a conductive line is elevated above the reflective bank structure; hardening the passivation layer; and etching the passivation layer, such that a top surface of the micro LED device and a top surface of the conductive line are not covered by the passivation layer, and a portion of the micro LED device and the conductive line protrude above a top surface of the passivation layer after etching the passivation layer. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method for integrating a light emitting device comprising:
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applying a passivation layer over a bank layer and a reflective bank structure within the bank layer, wherein a conductive line atop the bank layer is elevated above the reflective bank structure and protrudes above a top surface of the passivation layer; picking up a micro LED device from a carrier substrate with a transfer head; placing the micro LED device within the reflective bank structure, wherein placing the micro LED device within the reflective bank structure comprises punching the micro LED device through the passivation layer; releasing the micro LED device from the transfer head; hardening the passivation layer; and etching the passivation layer, such that a top surface of the micro LED device and a top surface of the conductive line are not covered by the passivation layer, and a portion of the micro LED device and the conductive line protrude above the top surface of the passivation layer after etching the passivation layer. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A light emitting device comprising:
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a bank layer; a reflective bank structure within the bank layer; a conductive line atop the bank layer and elevated above the reflective bank structure; a micro LED device within the reflective bank structure; and a passivation layer that spans directly over the bank layer and within the reflective bank structure such that a portion of the passivation layer within the reflective bank structure is laterally around the micro LED device within the reflective bank structure, wherein a portion of the micro LED device and the conductive line atop the bank layer protrude above a top surface of the passivation layer. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22)
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Specification